Prosecution Insights
Last updated: April 19, 2026
Application No. 18/082,473

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Non-Final OA §102
Filed
Dec 15, 2022
Examiner
DIAZ, JOSE R
Art Unit
2815
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Advanced Semiconductor Engineering Inc.
OA Round
1 (Non-Final)
87%
Grant Probability
Favorable
1-2
OA Rounds
2y 6m
To Grant
94%
With Interview

Examiner Intelligence

Grants 87% — above average
87%
Career Allow Rate
799 granted / 922 resolved
+18.7% vs TC avg
Moderate +8% lift
Without
With
+7.5%
Interview Lift
resolved cases with interview
Typical timeline
2y 6m
Avg Prosecution
26 currently pending
Career history
948
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
39.3%
-0.7% vs TC avg
§102
36.3%
-3.7% vs TC avg
§112
7.8%
-32.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 922 resolved cases

Office Action

§102
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of Group I, claims 1-15 and newly added claims 21-25, in the reply filed on November 7, 2025 is acknowledged. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 1-4, 6-10, 15 and 21 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Wang et al. (US 9818722). Regarding claim 1, Wang discloses a semiconductor device package, comprising: a carrier (100) comprising a predetermined non-shielding region (NS) [Figs. 26-27, annotated below]; an electronic component (400) disposed over the predetermined non-shielding region (NS) [Fig. 6]; and a shielding layer (600) comprising a first portion (portion along line P1-P1) disposed over the predetermined non-shielding region (NS) [Figs. 25-27, below]. PNG media_image1.png 646 714 media_image1.png Greyscale PNG media_image2.png 439 717 media_image2.png Greyscale [AltContent: textbox (E1)][AltContent: textbox (E3)] PNG media_image3.png 650 704 media_image3.png Greyscale [AltContent: connector][AltContent: connector] [AltContent: textbox (P1)][AltContent: textbox (P1)] [AltContent: connector] [AltContent: textbox (P2)][AltContent: textbox (P2)][AltContent: connector] [AltContent: textbox (E2)][AltContent: textbox (E3)] [AltContent: textbox (E1)] [AltContent: textbox (Fig. 26’)] [AltContent: textbox (NS)][AltContent: arrow][AltContent: connector] [AltContent: connector] [AltContent: connector] [AltContent: arrow][AltContent: textbox (P3)][AltContent: arrow] [AltContent: textbox (S)][AltContent: textbox (E4)] [AltContent: textbox (L2)][AltContent: textbox (C2)][AltContent: textbox (T)] [AltContent: arrow][AltContent: arrow][AltContent: arrow] Regarding claim 2, Wang discloses wherein the first portion (P1) of the shielding layer (600) extends from a first edge (E1) of the carrier (100) toward a top surface (T) of the carrier (100) [Fig. 26, annotated above]. Regarding claim 3. Wang discloses wherein the shielding layer (600) further comprises a second portion (potion along P2-P2 line) disposed over the predetermined non-shielding region (NS), the second portion (P2) extends from the first edge (E1) toward the top surface (similar to T) of the carrier, and the second portion (P2) is separated (separated by device 200) from the first portion (P1) [Figs. 25-26. above]. Regarding claim 4, Wang discloses wherein the shielding layer (600) further comprises a third portion (portion P3 perpendicular to line P1-P1 and device 400) disposed over the predetermined non-shielding region (NS), the third portion extends from a second edge (E4) toward the top surface of the carrier (similar to T), and the second edge (E4) is distinct from the first edge (E1) [Figs. 25-26. above]. Regarding claim 6, Wang discloses wherein the first portion (P1) of the shielding layer (600) is spaced apart from the third portion (P3) of the shielding layer (See line P1-P1 separated from P3 by device 400) [Figs. 25-26, above]. Regarding claim 7, Wang discloses wherein a length of the first portion (P1) of the shielding layer is different from a length of the third portion (P3) of the shielding layer from a top view perspective [Figs. 25-26, above]. Regarding claim 8, Wang discloses wherein the carrier (100) further comprises a shielding region (S) , the shielding layer (600) further comprises a fourth portion (arbitrary portion within region S) disposed over the shielding region (S), and the fourth portion is separated (see region NS) from the first portion (P1) from a top view perspective [Figs. 25-27]. Regarding claim 9, Wang discloses an encapsulant (300) disposed between the shielding region and the shielding layer (600) [Figs. 25-27]. Regarding claim 10, Wang discloses wherein the shielding layer (600) further comprises a second portion (portion 600 comprising the curve portion C2 and L-shaped L2 connected to the first potion T) connected to the first portion (portion located at top surface T) and extending over a first lateral side of the carrier [Fig. 26, above]. Regarding claim 15, Wang discloses wherein the first portion (P1) of the shielding layer (600) is exposed (outside of ER region) from a coverage of the electronic component (400) [Figs. 25-27, above]. Regarding claim 21, Wang discloses wherein the electronic component (400) comprises a connector (410) configured to provide an external connection wiring [Fig. 26]. Allowable Subject Matter Claims 5, 11-14, and 22-25 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to JOSE R DIAZ whose telephone number is (571)272-1727. The examiner can normally be reached Monday-Friday. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Joshua Benitez can be reached at 571-270-1435. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /Jose R Diaz/Primary Examiner, Art Unit 2815
Read full office action

Prosecution Timeline

Dec 15, 2022
Application Filed
Jan 24, 2026
Non-Final Rejection — §102 (current)

Precedent Cases

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
87%
Grant Probability
94%
With Interview (+7.5%)
2y 6m
Median Time to Grant
Low
PTA Risk
Based on 922 resolved cases by this examiner. Grant probability derived from career allow rate.

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