DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Continued Examination Under 37 CFR 1.114
A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on May 18, 2026 has been entered.
Response to Arguments
Applicant’s arguments with respect to claim(s) 10 and 12 have been considered but are moot on grounds of new rejection. Claim 1-9 and 13-23 are no longer considered allowable due to new interpretation of the claims, current prior art and newly found prior are.
Drawings
The drawings are objected to under 37 CFR 1.83(a). The drawings must show every feature of the invention specified in the claims. Therefore, the “at least one transducer comprises at least one speaker not in mechanical communication with either the first substrate support or the second substrate support” and “a first substrate comprising first microelectronic elements and the second element comprises a second substrate comprising second microelectronic elements” must be shown or the feature(s) canceled from the claim(s). No new matter should be entered.
Corrected drawing sheets in compliance with 37 CFR 1.121(d) are required in reply to the Office action to avoid abandonment of the application. Any amended replacement drawing sheet should include all of the figures appearing on the immediate prior version of the sheet, even if only one figure is being amended. The figure or figure number of an amended drawing should not be labeled as “amended.” If a drawing figure is to be canceled, the appropriate figure must be removed from the replacement sheet, and where necessary, the remaining figures must be renumbered and appropriate changes made to the brief description of the several views of the drawings for consistency. Additional replacement sheets may be necessary to show the renumbering of the remaining figures. Each drawing sheet submitted after the filing date of an application must be labeled in the top margin as either “Replacement Sheet” or “New Sheet” pursuant to 37 CFR 1.121(d). If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 13-23 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Claim 22 recites the limitation "the first element and the second element" in lines 1-2. There is insufficient antecedent basis for this limitation in the claim. Claim 23 recites the limitation "that at least one of the first and second elements" in line 2. There is insufficient antecedent basis for this limitation in the claim. For the purpose of examination, the Examiner is taking claims 22 and 23 to be dependent upon claim 1 or claim 10.
Claim Interpretation
The following is a quotation of 35 U.S.C. 112(f):
(f) Element in Claim for a Combination. – An element in a claim for a combination may be expressed as a means or step for performing a specified function without the recital of structure, material, or acts in support thereof, and such claim shall be construed to cover the corresponding structure, material, or acts described in the specification and equivalents thereof.
The following is a quotation of pre-AIA 35 U.S.C. 112, sixth paragraph:
An element in a claim for a combination may be expressed as a means or step for performing a specified function without the recital of structure, material, or acts in support thereof, and such claim shall be construed to cover the corresponding structure, material, or acts described in the specification and equivalents thereof.
The claims in this application are given their broadest reasonable interpretation using the plain meaning of the claim language in light of the specification as it would be understood by one of ordinary skill in the art. The broadest reasonable interpretation of a claim element (also commonly referred to as a claim limitation) is limited by the description in the specification when 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, is invoked.
As explained in MPEP § 2181, subsection I, claim limitations that meet the following three-prong test will be interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph:
(A) the claim limitation uses the term “means” or “step” or a term used as a substitute for “means” that is a generic placeholder (also called a nonce term or a non-structural term having no specific structural meaning) for performing the claimed function;
(B) the term “means” or “step” or the generic placeholder is modified by functional language, typically, but not always linked by the transition word “for” (e.g., “means for”) or another linking word or phrase, such as “configured to” or “so that”; and
(C) the term “means” or “step” or the generic placeholder is not modified by sufficient structure, material, or acts for performing the claimed function.
Use of the word “means” (or “step”) in a claim with functional language creates a rebuttable presumption that the claim limitation is to be treated in accordance with 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph. The presumption that the claim limitation is interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, is rebutted when the claim limitation recites sufficient structure, material, or acts to entirely perform the recited function.
Absence of the word “means” (or “step”) in a claim creates a rebuttable presumption that the claim limitation is not to be treated in accordance with 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph. The presumption that the claim limitation is not interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, is rebutted when the claim limitation recites function without reciting sufficient structure, material or acts to entirely perform the recited function.
Claim limitations in this application that use the word “means” (or “step”) are being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, except as otherwise indicated in an Office action. Conversely, claim limitations in this application that do not use the word “means” (or “step”) are not being interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, except as otherwise indicated in an Office action.
Claim limitation “a first substrate support to hold a first substrate; a second substrate support to hold a second substrate and to controllably release the second substrate, at least one of the first substrate support and the second substrate support to move at least one of the first substrate and the second substrate to contact one another to initiate a bonding process of the first substrate to the second substrate, at least one of the first substrate and the second substrate undergoing first vibrations during the bonding process; and at least one transducer to controllably generate and transmit second vibrations to at least one of the first substrate and the second substrate during the bonding process, the second vibrations to reduce vibration-induced distortions of the at least one of the first substrate and the second substrate during the bonding process” has been evaluated under the three-prong test set forth in MPEP § 2181, subsection I, but the result is inconclusive. Thus, it is unclear whether this limitation should be interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, because the Applicant seems to be relying on functional/intended use language. The boundaries of this claim limitation are ambiguous; therefore, the claim is indefinite and is rejected under 35 U.S.C. 112(b) or pre-AIA 35 U.S.C. 112, second paragraph.
In response to this rejection, applicant must clarify whether this limitation should be interpreted under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph. Mere assertion regarding applicant’s intent to invoke or not invoke 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph is insufficient. Applicant may:
(a) Amend the claim to clearly invoke 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, by reciting “means” or a generic placeholder for means, or by reciting “step.” The “means,” generic placeholder, or “step” must be modified by functional language, and must not be modified by sufficient structure, material, or acts for performing the claimed function;
(b) Present a sufficient showing that 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, should apply because the claim limitation recites a function to be performed and does not recite sufficient structure, material, or acts to perform that function;
(c) Amend the claim to clearly avoid invoking 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, by deleting the function or by reciting sufficient structure, material or acts to perform the recited function; or
(d) Present a sufficient showing that 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph, does not apply because the limitation does not recite a function or does recite a function along with sufficient structure, material or acts to perform that function.
If the Applicant’s choose to invoke 112(f) the claim should probably read as “a (first) means [referring to a first substrate support in the specification] to hold a first substrate; another (a second) means [referring to a second substrate support in the specification] to hold a second substrate and to controllably release the second substrate, at least one of the first and second/another means to move at least one of the first substrate and the second substrate to contact one another to initiate a bonding process of the first substrate to the second substrate, at least one of the first substrate and the second substrate undergoing first vibrations during the bonding process; and a third means [referring to at least one transducer in the specification] to controllably generate and transmit second vibrations to at least one of the first substrate and the second substrate during the bonding process, the second vibrations to reduce vibration-induced distortions of the at least one of the first substrate and the second substrate during the bonding process”. Appropriate correction is required. Claims 14-23 inherit the deficiencies due to their dependency.
Claim Rejections - 35 USC § 103
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claim(s) 10, 12, 22 and 23 is/are rejected under 35 U.S.C. 103 as being unpatentable over Matsumura (US 2007/0065985 A1 now US 7,523,775 B2) in view of MA et al. (MA) (CN 114836615 A) as evidenced by or in view of Luechinger et al. (Luechinger) (US 2013/0042960 A1).
In regards to claim 10, Matsumura (claim 1, paragraph 20, Figs. 1-3 and associated text) discloses a method comprising: bonding a first element (items 4 or 6) to a second element (items 4 or 6) in a bond initiation region (where items 10 and 11 or 10a, 10b, 11a, and 11b reside), the bond initiation region having first vibrations (20, 25 or 30 KHz); and externally applying predetermined second vibrations (40, 50 or 60 KHz) to at least one of the first and second elements (items 4 and 6) during said bonding, the second vibrations (40, 50 or 60 KHz) configured to reduce distortions from the first vibrations, but does not specifically disclose the second vibrations counteracting the first vibrations so as to reduce distortions from the first vibrations.
MA (Background) discloses a double frequency transducer to output ultrasonic vibration of two different frequencies for ultrasonic bonding.
Therefore it would have been obvious for one of ordinary skill in the art before the effective filing date to incorporate the teachings of MA for the purpose of controlling and adjusting amplitude value of the ultrasonic driving signal with different frequencies, so as to adapt to different application requirements.
Therefore Matsumura as modified by MA (Background) discloses externally applying predetermined second vibrations (40, 50 or 60 KHz, Matsumura as modified by MA) to at least one of the first and second elements (items 4 and 6) during said bonding, the second vibrations (40, 50 or 60 KHz, Matsumura as modified by MA) (out of phase with the first vibration in the bond initiation region and) counteracting the first vibrations so as to reduce distortions from the first vibrations (20, 25 or 30 KHz, Matsumura as modified by MA).
Matsumura as modified by MA does not specifically disclose the second vibrations are out of phase with the first vibrations.
As evidenced by Luechinger (paragraphs 28, 31, Figs. 2D, 2E and associated text), in-phase and out-of-phase ultrasonic bonding (Figs. 2D and 2E) can be performed, thus wherein the second vibrations (item 266) are out of phase with the first vibrations (item 244).
Therefore it would have been obvious for one of ordinary skill in the art before the effective filing date to incorporate the teachings of Luechinger for the purpose of improving bond formation (paragraph 31).
In regards to claim 12, Matsumura (claim1, paragraph 20, Figs. 1-3 and associated text) as modified by MA (Background) and Luechinger (paragraphs 28, 31, Figs. 2D, 2E and associated text) discloses hybrid bonding (paragraph 55).
In regards to claim 22, Matsumura (claim1, paragraph 20, Figs. 1-3 and associated text) as modified by MA (Background) and Luechinger (paragraphs 28, 31, Figs. 2D, 2E and associated text) does not specifically disclose wherein at least one of the first element and the second element has a thickness in a range of 10 μm to 300 μm.
It would have been obvious to one having ordinary skill in the art at the time of the invention to modify the invention to include at least one of the first element and the second element having a thickness in a range of 10 μm to 300 μm, since it has been held that discovering an optimum value of a result effective variable involves only routine skill in the art (In re Boesch, 617 F.2d 272, 205 USPQ 215 (CCPA 1980)).
In regards to claim 23, Matsumura (claim1, paragraph 20, Figs. 1-3 and associated text) as modified by MA (Background) and Luechinger (paragraphs 28, 31, Figs. 2D, 2E and associated text) discloses wherein the at least one transducer (not shown, paragraph 30) is centrally located with respect to the at least one of the first and second elements (items 4 and 6, Matsumura).
Claim(s) 12 is/are rejected under 35 U.S.C. 103 as being unpatentable over Matsumura (US 2007/0065985 A1 now US 7,523,775 B2) in view of MA et al. (MA) (CN 114836615 A) as evidenced by or in view of Luechinger et al. (Luechinger) (US 2013/0042960 A1), as applied to claim 10 above, and further in view of Molnar et al. (Molnar) (US 2023/0187407 A1).
In regards to claim 12, Matsumura (claim1, paragraph 20, Figs. 1-3 and associated text) as modified by MA (Background) and Luechinger (paragraphs 28, 31, Figs. 2D, 2E and associated text) does not specifically disclose wherein said bonding comprises direct hybrid bonding.
Molnar (paragraph 115) discloses hybrid bonding.
Therefore it would have been obvious to one of ordinary skill in the art before the effective filing date to incorporate the teachings of Molnar for the purpose of direct bond and low pitch interconnection (paragraph 115).
Claim(s) 1-4, 6-9 and 13-23 is/are rejected under 35 U.S.C. 103 as being unpatentable over Kim et al. (Kim) (US 2021/0104405 A1) in view of Luechinger et al. (Luechinger) (US 2013/0042960 A1).
In regard to claim 1, Kim (Fig. 1, 3A-3E, 6A-6E and associated text) discloses a method comprising: supporting a first element (item S1); supporting a second element (item S2) spaced from the first element (item S1); moving at least one of the first element (item S1) and the second element (item S2) to contact first regions (central regions of items S1 and S2) of the first and second elements (items S1 and S2) with one another while second regions (peripheral regions of items S1 and S2) of the first and second elements (items S1 and S2) are not in contact with one another, the first regions (central region of items S1 and S2) directly bonding to one another to form a bond interface without adhesive; directly bonding the second regions (peripheral regions of items S1 and S2) of the first and second elements (items S1 and S2) to one another without adhesive by controllably releasing one of the first element and the second element (items S1 and S2) such that the bond interface and a boundary between the bond interface and the second regions (peripheral regions of items S1 and S2) not in contact with one another expands radially away from the first regions (central region of items S1 and S2), the second regions (peripheral regions of items S1 and S2) having first vibrations within a bond initiation region bordering the boundary; and externally applying second vibrations (buy way of item 230, paragraph 38) to at least one of the first and second elements (items S1 and S2) during said directly bonding, but does not specifically disclose second vibrations in antiphase with the first vibrations in the bond initiation region.
Luechinger (paragraphs 28, 31, Figs. 2D, 2E and associated text) discloses in-phase and out-of-phase ultrasonic bonding (Figs. 2D and 2E), thus the second vibrations (item 266) in antiphase with the first vibrations (item 244) in the bond initiation region.
Therefore it would have been obvious for one of ordinary skill in the art before the effective filing date to incorporate the teachings of Luechinger for the purpose of improving bond formation (paragraph 31).
In regard to claim 2, Kim (Fig. 1, 3A-3E, 6A-6E and associated text) discloses wherein the first element (item S1) comprises a first substrate (item S1) comprising first microelectronic elements (not shown) and the second element (item S2) comprises a second substrate (item S2) comprising second microelectronic elements (not shown). Examiner takes official notice that it is well known in the art the substrates can comprise microelectronics on and/or within the substrate.
In regard to claim 3, Kim (Fig. 1, 3A-3E, 6A-6E and associated text) discloses wherein the first element (item S1) comprises a first bonding surface (upper surface of item S1) and the second element (item S2) comprises a second bonding surface (bottom surface of item S2), wherein said directly bonding directly bonds the first bonding surface (upper surface of item S1) to the second bonding surface (bottom surface of item S2) to one another without the adhesive between the first and second bonding surfaces (upper surface of item S1 and bottom surface of item S2).
In regard to claim 4, Kim (Fig. 1, 3A-3E, 6A-6E and associated text) as modified by Luechinger (paragraphs 28, 31, Figs. 2D, 2E and associated text) discloses wherein the second vibrations reduce vibrational distortions of at least one of the first and second bonding surfaces during said directly bonding as compared to directly bonding the first bonding surface to the second bonding surface to one another without said externally applying the second vibrations to the at least one of the first and second elements during said directly bonding.
In regard to claim 6, Kim (Fig. 1, 3A-3E, 6A-6E and associated text) as modified by Luechinger (paragraphs 28, 31, Figs. 2D, 2E and associated text) discloses further comprising receiving information indicative of the first vibrations (by way of vibration sensor, item 310), in response to the information, generating the second vibrations (paragraphs 36, 38).
In regard to claim 7, Kim (Fig. 1, 3A-3E, 6A-6E and associated text) as modified by Luechinger (paragraphs 28, 31, Figs. 2D, 2E and associated text) discloses wherein said receiving the information comprises calculating, prior to initiating said directly bonding, the first vibrations within the bond initiation region as a function of time (paragraphs 34-41).
In regard to claim 8, Kim (Fig. 1, 3A-3E, 6A-6E and associated text) as modified by Luechinger (paragraphs 28, 31, Figs. 2D, 2E and associated text) discloses wherein said calculating is performed using information selected from the group consisting of: sizes, thicknesses, and/or materials of the first and second elements (items S1 and S2); dimensions and other properties of an apparatus supporting the first and second elements (items S1 and S2); temperature or other environmental conditions of the first and second elements (items S1 and S2).
In regard to claim 9, Kim (Fig. 1, 3A-3E, 6A-6E and associated text) as modified by Luechinger (paragraphs 28, 31, Figs. 2D, 2E and associated text) discloses further comprising receiving feedback information from at least one sensor (item 310), the feedback information indicative of conditions during said directly bonding, and in response to said feedback information, dynamically modifying the second vibrations (by way of item 230).
In regards to claim 13. Kim (Fig. 1, 3E, 6E and associated text) discloses an apparatus comprising: a first substrate support (item 100) configured to hold a first substrate (item S1); a second substrate support (item 200) to hold a second substrate (item S2) and to controllably release the second substrate (item S2), at least one of the first substrate support (item 100) and the second substrate support (item 200) to move at least one of the first substrate (item S1) and the second substrate (item S2) to contact one another to initiate a bonding process of the first substrate (item S1) to the second substrate (item S2), at least one of the first substrate (item S1) and the second substrate (item S2) undergoing first vibrations during the bonding process; and at least one (transducer) pressurization device (item 230, paragraph 38) controllably generate and transmit second vibrations to at least one of the first substrate (item S1) and the second substrate (item S2) during the bonding process, the second vibrations configured to reduce vibration-induced distortions of the at least one of the first substrate (item S1) and the second substrate (item S2) during the bonding process. Examiner notes that “to hold a first substrate…to hold a second substrate and to controllably release the second substrate…to move at least one of the first substrate and the second substrate to contact one another to initiate a bonding process of the first substrate to the second substrate, at least one of the first substrate and the second substrate undergoing first vibrations during the bonding process…to controllably generate and transmit second vibrations to at least one of the first substrate and the second substrate during the bonding process, the second vibrations to reduce vibration-induced distortions of the at least one of the first substrate and the second substrate during the bonding process” is intended use language.
It has been held that a recitation with respect to the manner in which a claimed apparatus is intended to be employed does not differentiated the claimed apparatus from a prior art apparatus satisfying the claimed structural limitations (Ex parte Mashim, 2 USPQ2d 1647 (1987)).
Kim does not specifically disclose a transducer.
Luechinger (paragraphs 28-31, Figs. 2D, 2E and associated text) discloses an upper and lower transducer or a common transducer (not shown, paragraph 30).
Therefore it would have been obvious for one of ordinary skill in the art before the effective filing date to incorporate the teachings of Luechinger for the purpose of improving bond formation (paragraph 31) and applying various vibrations.
In regards to claim 14. Kim (Fig. 1, 3E, 6E and associated text) as modified by Luechinger (paragraphs 28-31, Figs. 2D, 2E and associated text) discloses wherein the at least one transducer (item 230, Kim, upper and lower or common transducers mentioned, not shown, Luechinger ) is in mechanical communication with at least one of the first substrate support (item 100, Kim) and the second substrate support (item 200, Kim), the second vibrations propagating from the at least one transducer (item 230, Kim, upper and lower or common transducers mentioned, not shown, Luechinger ) to at least one of the first substrate (item S1, Kim) and the second substrate (item S2, Kim).
In regards to claim 15. Kim (Fig. 1, 3E, 6E and associated text) as modified by Luechinger (paragraphs 28-31, Figs. 2D, 2E and associated text) discloses wherein the at least one transducer (item 230, Kim, upper and lower or common transducers mentioned, not shown, Luechinger ) is in direct contact with the at least one of the first substrate (item S1, Kim)and the second substrate (item S2, Kim) such that the second vibrations propagate from the at least one transducer (item 230, Kim, upper and lower or common transducers mentioned, not shown, Luechinger ) directly to the at least one of the first substrate (item S1, Kim) and the second substrate (item S2, Kim).
In regards to claim 16. Kim (Fig. 1, 3E, 6E and associated text) as modified by Luechinger (paragraphs 28-31, Figs. 2D, 2E and associated text) discloses wherein the second vibrations propagate from the at least one transducer (item 230, Kim, upper and lower or common transducers mentioned, not shown, Luechinger ), through at least a portion of the at least one of the first substrate support (item 100, Kim) and the second substrate support (item 200, Kim), to the at least one of the first substrate (item S1, Kim) and the second substrate (item S1, Kim).
In regards to claim 17. Kim (Fig. 1, 3E, 6E and associated text) as modified by Luechinger (paragraphs 28-31, Figs. 2D, 2E and associated text) discloses wherein the at least one transducer (item 230, Kim, upper and lower or common transducers mentioned, not shown, Luechinger ) comprises at least one speaker not in mechanical communication with either the first substrate support (item 100, Kim) or the second substrate support (item 200, Kim), the at least one speaker configured to generate and transmit sonic vibrations through air to at least one of the first substrate (item S1, Kim) and the second substrate (item S2, Kim), the sonic vibrations configured to generate the second vibrations.
In regards to claim 18. Kim (Fig. 1, 3E, 6E and associated text) as modified by Luechinger (paragraphs 28-31, Figs. 2D, 2E and associated text) discloses wherein the at least one transducer (item 230, Kim, upper and lower or common transducers mentioned, not shown, Luechinger ) comprises at least one piezoelectric transducer.
In regards to claim 19. Kim (Fig. 1, 3E, 6E and associated text) as modified by Luechinger (paragraphs 28-31, Figs. 2D, 2E and associated text) discloses wherein the second vibrations are configured to destructively interfere with the first vibrations in a bond initiation region during the bonding process.
In regards to claim 20. Kim (Fig. 1, 3E, 6E and associated text) as modified by Luechinger (paragraphs 28-31, Figs. 2D, 2E and associated text) discloses wherein the first vibrations have a predetermined first modal distribution as a function of time during the bonding process and the second vibrations have a second modal distribution as a function of time during the bonding process, at least a portion of the second modal distribution in antiphase to at least a portion of the first modal distribution.
In regards to claim 21. Kim (Fig. 1, 3E, 6E and associated text) as modified by Luechinger (paragraphs 28-31, Figs. 2D, 2E and associated text) discloses wherein the first modal distribution as a function of time comprises a first linear superposition of a plurality of vibration modes, each vibration mode having a corresponding amplitude and phase as a function of time and the second modal distribution F.sub.2(t) can comprise a second linear superposition of the plurality of vibrational modes of the first vibrations, but with each vibration mode having substantially equal amplitudes and substantially opposite phases as those of the first vibrations.
Claim(s) 2 and 5 is/are rejected under 35 U.S.C. 103 as being unpatentable over Kim et al. (Kim) (US 2021/0104405 A1) in view of Luechinger et al. (Luechinger) (US 2013/0042960 A1) as applied to claims 1, 3, 4, 6-9 and 13-21 above, and further in view of Gao et al. (Gao) (US 2019/0385966 A1).
In regard to claim 2, Kim discloses wherein the first element comprises a first substrate comprising first microelectronic elements and the second element comprises a second substrate comprising second microelectronic elements.
In regard to claim 2, Gao (paragraph 7, Fig. 2 and associated text) discloses wherein the first element (item 102 at the top or bottom) comprises a first substrate (item 104) comprising first microelectronic elements (items 110, 112, 114) and the second element (item 102 at the top or bottom) comprises a second substrate (item 104) comprising second microelectronic elements (items 110, 112, 114).
In regard to claim 5, Gao (paragraph 7, Fig. 2 and associated text) discloses wherein said directly bonding comprises direct hybrid bonding (paragraph 8, 43).
Therefore it would have been obvious to one of ordinary skill in the art before the effective filing date to incorporate the teachings of Gao for the purpose of device density and a reliable bond.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to TELLY D GREEN whose telephone number is (571)270-3204. The examiner can normally be reached M-F 8am-5pm.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Jessica Manno can be reached at 571-272-2339. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
TELLY D. GREEN
Examiner
Art Unit 2898
/TELLY D GREEN/Primary Examiner, Art Unit 2898 August 15, 2026
Prosecution Insights