20 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18628589 | STRUCTURES FOR BONDING ELEMENTS INCLUDING CONDUCTIVE INTERFACE FEATURES | CHAN, CANDICE | 2813 | Final Rejection | Apr 05, 2024 |
| 18395347 | DIRECT BONDING OF SEMICONDUCTOR ELEMENTS | NGUYEN, KHIEM D | 2892 | Non-Final OA | Dec 22, 2023 |
| 18395265 | SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING FUNCTIONAL AND NON-FUNCTIONAL CONDUCTIVE PADS | TURNER, BRIAN | 2818 | Non-Final OA | Dec 22, 2023 |
| 18391173 | CONDUCTIVE MATERIALS FOR DIRECT BONDING | TOBERGTE, NICHOLAS J | 2817 | Non-Final OA | Dec 20, 2023 |
| 18497810 | METHODS AND STRUCTURES EMPLOYING METAL OXIDE FOR DIRECT METAL BONDING | SARKER-NAG, AKHEE | 2893 | Non-Final OA | Oct 30, 2023 |
| 18379053 | HYBRID BONDING METHODS AND DEVICE ASSEMBLIES FORMED USING THE SAME | BOWEN, ADAM S | 2897 | Non-Final OA | Oct 11, 2023 |
| 18461372 | BONDED STRUCTURE AND METHOD OF FORMING SAME | NGUYEN, NIKI HOANG | 2818 | Non-Final OA | Sep 05, 2023 |
| 18366569 | BONDED DEBUGGING ELEMENTS FOR INTEGRATED CIRCUITS AND METHODS FOR DEBUGGING INTEGRATED CIRCUITS USING SAME | TYNES JR., LAWRENCE C | 2899 | Non-Final OA | Aug 07, 2023 |
| 18345607 | DIRECT BONDING ON BURIED POWER RAILS | ASSOUMAN, HERVE-LOUIS Y | 2812 | Final Rejection | Jun 30, 2023 |
| 18319786 | DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL | PATEL, REEMA | 2812 | Non-Final OA | May 18, 2023 |
| 18179126 | DIRECT BONDING METHODS AND STRUCTURES | NGUYEN, NIKI HOANG | 2818 | Non-Final OA | Mar 06, 2023 |
| 18069783 | APPARATUSES AND METHODS FOR DIE BOND CONTROL | ABRAHAM, JOSE K | 3729 | Final Rejection | Dec 21, 2022 |
| 18084232 | INTEGRATED SYSTEMS FOR COOLING HIGH POWERED DEVICES AND METHODS OF MANUFACTURING THE SAME | DRAVININKAS, ADAM B | 2835 | Final Rejection | Dec 19, 2022 |
| 18066159 | STRUCTURE WITH CONDUCTIVE FEATURE FOR DIRECT BONDING AND METHOD OF FORMING SAME | HUNTER III, CARNELL | 2893 | Non-Final OA | Dec 14, 2022 |
| 18064815 | INTERCONNECT STRUCTURES | NGUYEN, THANH T | 2893 | Final Rejection | Dec 12, 2022 |
| 18061383 | BONDED STRUCTURE WITH SECURITY DIE | GREEN, TELLY D | 2898 | Non-Final OA | Dec 02, 2022 |
| 18050010 | STACKED STRUCTURES WITH CAPACITIVE COUPLING CONNECTIONS | LUKE, DANIEL M | 2896 | Non-Final OA | Oct 26, 2022 |
| 17931826 | METHOD OF BONDING THIN SUBSTRATES | SANDVIK, BENJAMIN P | 2812 | Non-Final OA | Sep 13, 2022 |
| 17646361 | DIRECTLY BONDED STRUCTURES | GREEN, TELLY D | 2898 | Final Rejection | Dec 29, 2021 |
| 17449975 | INTERLAYER CONNECTION OF STACKED MICROELECTRONIC COMPONENTS | GRAY, AARON J | 2897 | Non-Final OA | Oct 05, 2021 |
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