Prosecution Insights
Prosecution Insights
16 pending office actions • 9 art units • 12 examiners • 0 of 16 (0%) have an AI response strategy ready • 56 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 16 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 16 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 15 (94%) |
| §102 only | 1 (6%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| GREEN, TELLY D | 4 | 81.7% | +3.8% |
| NGUYEN, NIKI HOANG | 2 | 90.7% | +5.1% |
| NGUYEN, KHIEM D | 1 | 85.7% | +12.5% |
| TOBERGTE, NICHOLAS J | 1 | 94.5% | +1.9% |
| ERDEM, FAZLI | 1 | 85.4% | +15.8% |
| BOWEN, ADAM S | 1 | 96.4% | +2.4% |
| ASSOUMAN, HERVE-LOUIS Y | 1 | 91.1% | +4.2% |
| CULLEN, PATRICK LAWRENCE | 1 | 86.7% | +25.0% |
| ABRAHAM, JOSE K | 1 | 82.4% | +34.8% |
| NGUYEN, THANH T | 1 | 83.3% | +13.9% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17646361 | DIRECTLY BONDED STRUCTURES | GREEN, TELLY D | 81d overdue |
| 18146265 | SYSTEM AND METHOD FOR USING ACOUSTIC WAVES TO COUNTERACT DEFORMATIONS DURING BONDING | GREEN, TELLY D | 77d overdue |
| 18379053 | HYBRID BONDING METHODS AND DEVICE ASSEMBLIES FORMED USING THE SAME | BOWEN, ADAM S | 58d overdue |
| 18055798 | THERMAL BYPASS FOR STACKED DIES | GREEN, TELLY D | 36d overdue |
| 18461372 | BONDED STRUCTURE AND METHOD OF FORMING SAME | NGUYEN, NIKI HOANG | 10d overdue |
| 18064815 | INTERCONNECT STRUCTURES | NGUYEN, THANH T | 5d overdue |
| 18391173 | CONDUCTIVE MATERIALS FOR DIRECT BONDING | TOBERGTE, NICHOLAS J | 4d overdue |
| 18395347 | DIRECT BONDING OF SEMICONDUCTOR ELEMENTS | NGUYEN, KHIEM D | 15d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 5 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18064815 | INTERCONNECT STRUCTURES | NGUYEN, THANH T | 5d overdue |
| 18395347 | DIRECT BONDING OF SEMICONDUCTOR ELEMENTS | NGUYEN, KHIEM D | 15d |
| 18069783 | APPARATUSES AND METHODS FOR DIE BOND CONTROL | ABRAHAM, JOSE K | 21d |
| 18512547 | INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND METHODS OF MANUFACTURING THE SAME | ERDEM, FAZLI | 39d |
| 18146326 | DIRECTLY BONDED FRAME WAFERS | CULLEN, PATRICK LAWRENCE | 57d |
| Art Unit | Apps |
|---|---|
| 2898 | 4 |
| 2812 | 3 |
| 2897 | 2 |
| 2818 | 2 |
| 2892 | 1 |
| 2817 | 1 |
| 2899 | 1 |
| 3729 | 1 |
| 2893 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18395347 | DIRECT BONDING OF SEMICONDUCTOR ELEMENTS | NGUYEN, KHIEM D | 2892 | §103 | Non-Final OA | 15d | Pending | Dec 22, 2023 |
| 18391173 | CONDUCTIVE MATERIALS FOR DIRECT BONDING | TOBERGTE, NICHOLAS J | 2817 | §103 | Non-Final OA | 4d overdue | Pending | Dec 20, 2023 |
| 18512547 | INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND METHODS OF MANUFACTURING THE SAME | ERDEM, FAZLI | 2812 | §103 | Non-Final OA | 39d | Pending | Nov 17, 2023 |
| 18379053 | HYBRID BONDING METHODS AND DEVICE ASSEMBLIES FORMED USING THE SAME | BOWEN, ADAM S | 2897 | §103 | Non-Final OA | 58d overdue | Pending | Oct 11, 2023 |
| 18461372 | BONDED STRUCTURE AND METHOD OF FORMING SAME | NGUYEN, NIKI HOANG | 2818 | §103 | Non-Final OA | 10d overdue | Pending | Sep 05, 2023 |
| 18345607 | DIRECT BONDING ON BURIED POWER RAILS | ASSOUMAN, HERVE-LOUIS Y | 2812 | §103 | Final Rejection | 34d | Pending | Jun 30, 2023 |
| 18194544 | SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MATERIAL | NGUYEN, NIKI HOANG | 2818 | §102 | Final Rejection | 41d | Pending | Mar 31, 2023 |
| 18146326 | DIRECTLY BONDED FRAME WAFERS | CULLEN, PATRICK LAWRENCE | 2899 | §103 | Final Rejection | 57d | Pending | Dec 23, 2022 |
| 18146265 | SYSTEM AND METHOD FOR USING ACOUSTIC WAVES TO COUNTERACT DEFORMATIONS DURING BONDING | GREEN, TELLY D | 2898 | §103 | Non-Final OA | 77d overdue | Pending | Dec 23, 2022 |
| 18069783 | APPARATUSES AND METHODS FOR DIE BOND CONTROL | ABRAHAM, JOSE K | 3729 | §103 | Final Rejection | 21d | Pending | Dec 21, 2022 |
| 18064815 | INTERCONNECT STRUCTURES | NGUYEN, THANH T | 2893 | §103 | Final Rejection | 5d overdue | Pending | Dec 12, 2022 |
| 18061383 | BONDED STRUCTURE WITH SECURITY DIE | GREEN, TELLY D | 2898 | §103 | Final Rejection | 63d | Pending | Dec 02, 2022 |
| 18055798 | THERMAL BYPASS FOR STACKED DIES | GREEN, TELLY D | 2898 | §103 | Non-Final OA | 36d overdue | Pending | Nov 15, 2022 |
| 17931826 | METHOD OF BONDING THIN SUBSTRATES | SANDVIK, BENJAMIN P | 2812 | §103 | Non-Final OA | 86d overdue | Pending | Sep 13, 2022 |
| 17646361 | DIRECTLY BONDED STRUCTURES | GREEN, TELLY D | 2898 | §103 | Final Rejection | 81d overdue | Pending | Dec 29, 2021 |
| 17449975 | INTERLAYER CONNECTION OF STACKED MICROELECTRONIC COMPONENTS | GRAY, AARON J | 2897 | §103 | Non-Final OA | 16d overdue | Pending | Oct 05, 2021 |
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