Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2811 2821 2822 2898
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18782476 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18679639 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18653101 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18642174 | GATE STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE GATE STRUCTURES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18544670 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18545488 | PIXEL OF IMAGE SENSOR AND IMAGE SENSOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18504226 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18219394 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18320513 | SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18142876 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18125348 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18833958 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18411414 | IMAGE SENSOR AND ELECTRONIC DEVICE | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18755726 | ORGANIC LIGHT EMITTING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18396714 | DISPLAY PANEL | Non-Final OA | Samsung Display Co., Ltd. |
| 18090056 | ETCH STOP FOR OXIDE SEMICONDUCTOR DEVICES | Non-Final OA | Intel Corporation |
| 17846129 | PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES | Non-Final OA | Intel Corporation |
| 18523131 | BACKSIDE POWER DELIVERY NETWORK | Final Rejection | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 17452754 | DIRECT BONDING METHODS AND STRUCTURES | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18390425 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18179669 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18654618 | LOW RESISTANCE STAIRCASE RIVET CONTACT USING METAL-TO-METAL STRAP CONNECTION | Non-Final OA | Micron Technology, Inc. |
| 18413276 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18392242 | INTERCONNECT STRUCTURE WITH CAPACITOR AND METHODS FOR MAKING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, LTD. |
| 18519271 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18503425 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18186754 | PROTECTION LAYER FOR SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17874192 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18199183 | Three-Dimensional Vertical Interconnect Architecture and Methods For Forming | Non-Final OA | Applied Materials, Inc. |
| 18516501 | BEOL INTEGRATION SOLUTION BASED ON DIRECT CMP TO IMPROVE INTERMETAL DIELECTRIC LAYER | Non-Final OA | STMicroelectronics International N.V. |
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