Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2811 2821 2822 2898
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18504226 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18219394 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18345955 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18142876 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17855105 | SEMICONDUCTOR DEVICES WITH HIGH CURRENT CAPABILITY FOR ELECTROSTATIC DISCHARGE OR SURGE PROTECTION | Non-Final OA | Texas Instruments Incorporated |
| 18467716 | SEMICONDUCTOR MODULE, AND ELECTRONIC DEVICE HAVING THE SAME | Non-Final OA | DENSO CORPORATION |
| 18571663 | DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | Sharp Display Technology Corporation |
| 17846129 | PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES | Non-Final OA | Intel Corporation |
| 18534894 | POWER MODULE | Non-Final OA | Robert Bosch GmbH |
| 18491332 | SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 18485684 | SEMICONDUCTOR DEVICE, SENSOR, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18516501 | BEOL INTEGRATION SOLUTION BASED ON DIRECT CMP TO IMPROVE INTERMETAL DIELECTRIC LAYER | Non-Final OA | STMicroelectronics International N.V. |
| 18289241 | SELECTIVE PASSIVATED CONTACT CELL AND PREPARATION METHOD THEREFOR | Non-Final OA | TRINA SOLAR CO., LTD. |
| 18323376 | STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18519271 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18362991 | SEMICONDUCTOR STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18186754 | PROTECTION LAYER FOR SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17815861 | Memory Device and Method of Forming The Same | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18324036 | HEAT DISSIPATION IN SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17898075 | Integrated Circuit Packages and Methods of Forming the Same | Final Rejection | Taiwan Semiconductor Manufacturing Co, Ltd. |
| 17709458 | Efficient Semiconductor Metrology Using Machine Learning | Non-Final OA | MELLANOX TECHNOLOGIES, LTD. |
| 17957483 | INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY STACKED SEMICONDUCTOR DEVICES | Non-Final OA | ADVANCED MICRO DEVICES, INC. |
| 18254159 | MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED WAFER SLICES AND PROCESS FOR MAKING THE SAME | Final Rejection | Qorvo US, Inc. |
| 18356838 | MEMORY DEVICE AND METHOD OF ASSEMBLING SAME | Non-Final OA | Sandisk Technologies, Inc. |
| 17460057 | ELECTRONIC DEVICE | Final Rejection | Advanced Semiconductor Engineering, Inc. |
| 18146265 | SYSTEM AND METHOD FOR USING ACOUSTIC WAVES TO COUNTERACT DEFORMATIONS DURING BONDING | Non-Final OA | Adeia Semiconductor Bonding Technologies Inc. |
| 18061383 | BONDED STRUCTURE WITH SECURITY DIE | Final Rejection | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18055798 | THERMAL BYPASS FOR STACKED DIES | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 17646361 | DIRECTLY BONDED STRUCTURES | Final Rejection | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18571601 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | Non-Final OA | CSMC TECHNOLOGIES FAB2 CO., LTD. |
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