Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2811 2821 2822 2898
This examiner grants 82% of resolved cases
Telly D. Green is an examiner in Tech Center 2800, working in Art Unit 2800. He has a high volume of 1314 resolved cases, which indicates a significant level of experience. The examiner's allowance rate is 82.0%, a figure that suggests a high probability of success for applications in his docket. Additionally, the data shows a 3.9% interview lift, providing a modest boost during the prosecution process.
The median days to allowance for cases under his supervision is 834. This 834-day timeline is relatively efficient, providing applicants with a clear expectation of the duration of the prosecution process in this specific unit. The 3.9% interview lift, while not the primary driver of success, still offers a benefit when combined with the overall allowance rate. With 1314 resolved cases, the examiner's performance metrics are very well-established and offer a clear guide for practitioners.
In the tech center, the 82.0% allowance rate and the provided median pendency are strong indicators of a favorable examination environment. Practitioners can expect a relatively smooth and efficient process. These figures offer a reliable and detailed roadmap for anyone working with Examiner Green.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18886654 | POWER SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18782476 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18679639 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18653101 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18642174 | GATE STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE GATE STRUCTURES | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18320513 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18125348 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18833958 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18755726 | ORGANIC LIGHT EMITTING DISPLAY DEVICE | Final Rejection | Samsung Display Co., Ltd. |
| 18397467 | LIGHT EMITTING ELEMENT AND DISPLAY DEVICE INCLUDING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18390425 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18179669 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 17619706 | DISPLAY DEVICE | Non-Final OA | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18411414 | IMAGE SENSOR AND ELECTRONIC DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18198390 | BASIC MOLECULE-ASSISTED DIRECT BONDING METHOD | Non-Final OA | COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18090056 | ETCH STOP FOR OXIDE SEMICONDUCTOR DEVICES | Non-Final OA | Intel Corporation |
| 18523131 | BACKSIDE POWER DELIVERY NETWORK | Final Rejection | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18146265 | SYSTEM AND METHOD FOR USING ACOUSTIC WAVES TO COUNTERACT DEFORMATIONS DURING BONDING | Non-Final OA | Adeia Semiconductor Bonding Technologies Inc. |
| 17452754 | DIRECT BONDING METHODS AND STRUCTURES | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18323376 | STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18432661 | LOGIC CROSS-COUPLE WITH BACKSIDE INTERCONNECTS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18503804 | Method of Reducing Acoustic Energy Losses in Standing Wave Microelectromechanical Resonators Using Thin Dielectric Films | Final Rejection | Government of the United States, as represented by the Secretary of the Air Force |
| 18416432 | IC PACKAGE WITH DIE AND COPPER POSTS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18654618 | LOW RESISTANCE STAIRCASE RIVET CONTACT USING METAL-TO-METAL STRAP CONNECTION | Non-Final OA | Micron Technology, Inc. |
| 18204092 | SYSTEMS, APPARATUSES, AND METHODS FOR BACK-TO-BACK DIE FOR SEMICONDUCTOR PACKAGES | Final Rejection | STMicroelectronics International N.V. |
| 18764945 | SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18741714 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18413276 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18503425 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18186754 | PROTECTION LAYER FOR SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy