DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Continued Examination Under 37 CFR 1.114
A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on 5.18.2026 has been entered.
Election/Restrictions
Claims 2, 7 and 27 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected species, there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 8.18.2025.
Drawings
The drawings are objected to under 37 CFR 1.83(a). The drawings must show every feature of the invention specified in the claims. Therefore, the items listed below must be shown or the feature(s) canceled from the claim(s). No new matter should be entered. Items not shown:
Regarding claim 1, “a first transceiver conductive structure…under the dielectric waveguide structure” and “a second transceiver conductive structure…under the dielectric waveguide structure” are not shown; 256a and 258a are not under 252 but, e.g., they are adjacent to 252. See Fig. 2.
Regarding claim 3, “a third transceiver conductive structure…over the dielectric waveguide structure” is not shown; 256b is not over 252 but, e.g., it is adjacent to 252. See Fig. 2.
Also, “a fourth transceiver conductive structure, associated with the third semiconductor die, over the third transceiver conductive structure and over the dielectric waveguide structure” is not shown; 258b is not over 256b (“third transceiver conductive structure”) but it is over 258a (“second transceiver conductive structure”), also, 258b is not over 252 but, e.g., it is adjacent to 252 or over 254. See Fig. 2.
Regarding claim 15, “a first transceiver conductive structure, associated with the second semiconductor die, under the dielectric waveguide structure and in the first low-k dielectric layer” is not shown because 256a is not under 252 but, e.g., it is adjacent to 252. See Fig. 2.
Also, “a second transceiver conductive structure, associated with the third semiconductor die, under the dielectric waveguide structure and in the second low-k dielectric layer” is not shown because there is no transceiver conductive structure both under the waveguide (252) and in the second low-k dielectric layer (242). If referring to 258a, the examiner suggests --a second transceiver conductive structure, associated with the third semiconductor die, adjacent the dielectric waveguide structure and in the first low-k dielectric layer--.
Regarding claim 19, “a third transceiver conductive structure, associated with the third semiconductor die, under the dielectric waveguide structure and in the first low-k dielectric layer” is not shown. If referring to 258b, 258b is adjacent 252 and in 242.
Also, “a fourth transceiver conductive structure, associated with the third semiconductor die, over the third transceiver conductive structure and in the second low-k dielectric layer” is not shown, if referring to 256b, 256b is associated with 204a and over 256a.
Corrected drawing sheets in compliance with 37 CFR 1.121(d) are required in reply to the Office action to avoid abandonment of the application. Any amended replacement drawing sheet should include all of the figures appearing on the immediate prior version of the sheet, even if only one figure is being amended. The figure or figure number of an amended drawing should not be labeled as “amended.” If a drawing figure is to be canceled, the appropriate figure must be removed from the replacement sheet, and where necessary, the remaining figures must be renumbered and appropriate changes made to the brief description of the several views of the drawings for consistency. Additional replacement sheets may be necessary to show the renumbering of the remaining figures. Each drawing sheet submitted after the filing date of an application must be labeled in the top margin as either “Replacement Sheet” or “New Sheet” pursuant to 37 CFR 1.121(d). If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance.
Claim Rejections - 35 USC § 112
The following is a quotation of the first paragraph of 35 U.S.C. 112(a):
(a) IN GENERAL.—The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor or joint inventor of carrying out the invention.
The following is a quotation of the first paragraph of pre-AIA 35 U.S.C. 112:
The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor of carrying out his invention.
Claims 1, 3-6 and 15-20 are rejected under 35 U.S.C. 112(a) or 35 U.S.C. 112 (pre-AIA ), first paragraph, as failing to comply with the written description requirement. The claim(s) contains subject matter which was not described in the specification in such a way as to reasonably convey to one skilled in the relevant art that the inventor or a joint inventor, or for applications subject to pre-AIA 35 U.S.C. 112, the inventor(s), at the time the application was filed, had possession of the claimed invention.
Regarding claim 1, “a first transceiver conductive structure, associated with the second semiconductor die, under the dielectric waveguide structure” and “a second transceiver conductive structure, associated with the third semiconductor die, under the dielectric waveguide structure” cause the claim to fail to comply with the written description requirement.
In the original disclosure, e.g., Fig. 2, there is no transceiver conductive structure (e.g., 256a and 258a) that is under the dielectric waveguide structure (252); said transceiver conductive structures are, e.g., adjacent to the dielectric waveguide structure.
None of dependent claims 3-6 address these deficiencies.
Regarding claim 1, the claim encompasses more embodiments that originally disclosed and as such fails to comply with the written description requirement.
The claim encompasses embodiments where only one of the transceiver conductive structures is electrically connected to a corresponding die through a TDV given the use of “at least one of” and “or” in the claim language.
The originally disclosed invention does not support only one of the transceiver conductive structures is electrically connected to a corresponding die through a TDV; the originally disclosed invention requires both transceiver conductive structures electrically connected to a corresponding die through a TDV.
The basis from the examiner’s position can be found, e.g., in (a) Fig. 2 which shows both structures 256a and 258a electrically connected to TDVs 236, (b) the disclosure of “The transceiver conductive structures 256a and 258a may be located above and/or over, and may be electrically connected and/or physically connected with respective TDV structures 236” in the specification as filed ([0056] of the published application, and, (c) original claim 4.
While [0056] discloses “Moreover, electrical signals may propagate between the semiconductor die 204a and the transceiver conductive structure 256a through the semiconductor die 202. For example, the electrical signals may propagate between the semiconductor die 204a and the transceiver conductive structure 256a through one or more conductive pads 232, through one or more via structures 228, and/or through one or more metallization layers 220 of the semiconductor die 202” it is noted that after electrical signals propagate through 232, 228 and 220, the only remaining possible way to achieve an electrical connection, per the original specification, between 256a/258a and 204a/204b is through 236; there is no other connection route. Hence, even if the connection between 256a/258a and 204a/204b is achieved via 202 (or parts of 202), the only electrical connection path remaining is through 236.
Hence, the original disclosure always requires a presence of a TDV and TDV connections may not be claimed in an alternative manner because that causes the claim to encompass more embodiments than originally disclosed.
None of dependent claims 3-6 address this deficiency.
Regarding claim 3, “a third transceiver conductive structure, associated with the second semiconductor die, over the first transceiver conductive structure and over the dielectric waveguide structure” and “a fourth transceiver conductive structure, associated with the third semiconductor die, over the third transceiver conductive structure and over the dielectric waveguide structure” cause the claim to fail to comply with the written description requirement.
First, regarding “a third transceiver conductive structure, associated with the second semiconductor die, over the first transceiver conductive structure and over the dielectric waveguide structure”, 256b is not over 252 in Fig. 2 but it is adjacent to it. Hence, this causes the claim to fail to comply with the written description requirement.
Second, regarding “a fourth transceiver conductive structure, associated with the third semiconductor die, over the third transceiver conductive structure and over the dielectric waveguide structure”, 258b is not over 256b (“third transceiver conductive structure”) but it is over 258a (“second transceiver conductive structure”), also, 258b is not over 252 but, e.g., it is adjacent to 252 or over 254. See Fig. 2. Hence, this causes the claim to fail to comply with the written description requirement.
Regarding claim 15, “a first transceiver conductive structure, associated with the second semiconductor die, under the dielectric waveguide structure and in the first low-k dielectric layer” causes the claim to fail to comply with the written description requirement. 256a is not under 252 but, e.g., it is adjacent to 252. See Fig. 2.
Also, “a second transceiver conductive structure, associated with the third semiconductor die, under the dielectric waveguide structure and in the second low-k dielectric layer” causes the claim to fail to comply with the written description requirement because there is no transceiver conductive structure both under the waveguide (252) and in the second low-k dielectric layer (242). If referring to 258a, the examiner suggests --a second transceiver conductive structure, associated with the third semiconductor die, adjacent the dielectric waveguide structure and in the first low-k dielectric layer--.
Dependent claims 16-20 do not address these deficiencies.
Regarding claim 15, the claim encompasses more embodiments that originally disclosed and as such fails to comply with the written description requirement.
The claim encompasses embodiments where only one of the recited transceiver conductive structures is included within the scope of the claim as well as only one TDV given the use of the terms “at least one of” and “or” throughout the claim.
The originally disclosed invention requires both transceiver conductive structures present and both electrically connected to a corresponding die through a TDV.
The basis from the examiner’s position can be found, e.g., in (a) Fig. 2 which shows both structures 256a and 2588 electrically connected to TDVs 236, (b) the disclosure of “The transceiver conductive structures 256a and 258a may be located above and/or over, and may be electrically connected and/or physically connected with respective TDV structures 236” in the specification as filed ([0056] of the published application, and, (c) original claim 4.
While [0056] discloses “Moreover, electrical signals may propagate between the semiconductor die 204a and the transceiver conductive structure 256a through the semiconductor die 202. For example, the electrical signals may propagate between the semiconductor die 204a and the transceiver conductive structure 256a through one or more conductive pads 232, through one or more via structures 228, and/or through one or more metallization layers 220 of the semiconductor die 202” it is noted that after electrical signals propagate through 232, 228 and 220, the only remaining possible way to achieve an electrical connection, per the original specification, between 256a/258a and 204a/204b is through 236; there is no other connection route. Hence, even if the connection between 256a/258a and 204a/204b is achieved via 202 (or parts of 202), the only electrical connection path remaining is through 236.
Hence, the original disclosure always requires a presence of a TDV and TDV connections may not be claimed in an alternative manner because that causes the claim to encompass more embodiments than originally disclosed.
Dependent claims 16-20 do not address these deficiencies.
Regarding claim 19, “a third transceiver conductive structure, associated with the third semiconductor die, under the dielectric waveguide structure and in the first low-k dielectric layer” causes the claim to fail to comply to with the written description requirement. If referring to 258b, 258b is adjacent 252 and in 242 and it is not under 252 and in 238.
Also, “a fourth transceiver conductive structure, associated with the third semiconductor die, over the third transceiver conductive structure and in the second low-k dielectric layer” causes the claim to fail to comply to with the written description requirement, if referring to 256b, 256b is associated with 204a and over 256a and it is not associated with 204b and over 258b.
Allowable Subject Matter
Claims 21-26 are allowed.
The following is a statement of reasons for the indication of allowable subject matter: the prior art of record fails to disclose or suggest a first transceiver conductive structure electrically connected with the second semiconductor die through the first semiconductor die; and a second transceiver conductive structure electrically connected with the third semiconductor die through the first semiconductor die as recited within the context of claim 21; claims 22-26 are dependents of claim 21.
Response to Arguments
Applicant's arguments filed 5.18.2026 have been fully considered but they are not persuasive.
The applicant alleges:
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288
738
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This is not persuasive because after electrical signals propagate through 232, 228 and 220, the only remaining possible way to achieve an electrical connection, per the original specification, between 256a/258a and 204a/204b is through 236; there is no other connection route. Hence, even if the connection between 256a/258a and 204a/204b is achieved via 202 (or parts of 202), the only electrical connection path remaining is through 236. Hence, the original disclosure does not support alternative connection paths as now encompassed by claims 1 and 15.
The applicant alleges:
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246
742
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This is not persuasive because after electrical signals propagate through 232, 228 and 220, the only remaining possible way to achieve an electrical connection, per the original specification, between 256a/258a and 204a/204b is through 236; there is no other connection route. Hence, even if the connection between 256a/258a and 204a/204b is achieved via 202 (or parts of 202), the only electrical connection path remaining is through 236. Hence, the original disclosure does not support alternative connection paths as now encompassed by claims 1 and 15.
The applicant alleges:
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588
760
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Greyscale
This is not persuasive because after electrical signals propagate through 232, 228 and 220, the only remaining possible way to achieve an electrical connection, per the original specification, between 256a/258a and 204a/204b is through 236; there is no other connection route. Hence, even if the connection between 256a/258a and 204a/204b is achieved via 202 (or parts of 202), the only electrical connection path remaining is through 236. Hence, the original disclosure does not support alternative connection paths as now encompassed by claims 1 and 15.
The applicant alleges:
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266
750
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The examiner notes that rejoinder of claims will be done at a time when no rejections are pending.
The applicant alleges:
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368
728
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And,
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296
740
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This is not persuasive because after electrical signals propagate through 232, 228 and 220, the only remaining possible way to achieve an electrical connection, per the original specification, between 256a/258a and 204a/204b is through 236; there is no other connection route. Hence, even if the connection between 256a/258a and 204a/204b is achieved via 202 (or parts of 202), the only electrical connection path remaining is through 236. Hence, the original disclosure does not support alternative connection paths as now encompassed by claims 1 and 15.
The applicant alleges:
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334
744
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Greyscale
This is not persuasive because after electrical signals propagate through 232, 228 and 220, the only remaining possible way to achieve an electrical connection, per the original specification, between 256a/258a and 204a/204b is through 236; there is no other connection route. Hence, even if the connection between 256a/258a and 204a/204b is achieved via 202 (or parts of 202), the only electrical connection path remaining is through 236. Hence, the original disclosure does not support alternative connection paths as now encompassed by claims 1 and 15.
The applicant alleges:
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370
726
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Greyscale
This is not persuasive because after electrical signals propagate through 232, 228 and 220, the only remaining possible way to achieve an electrical connection, per the original specification, between 256a/258a and 204a/204b is through 236; there is no other connection route. Hence, even if the connection between 256a/258a and 204a/204b is achieved via 202 (or parts of 202), the only electrical connection path remaining is through 236. Hence, the original disclosure does not support alternative connection paths as now encompassed by claims 1 and 15.
Examiner Note
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808
755
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In view of the annotation above, it is noted that after electrical signals propagate through 232, 228 and 220, the only remaining possible way to achieve an electrical connection, per the original specification, between 256a/258a and 204a/204b is through 236; there is no other connection route. Hence, even if the connection between 256a/258a and 204a/204b is achieved via 202 (or parts of 202), the only electrical connection path remaining is through 236. Hence, the original disclosure does not support alternative connection paths as now encompassed by claims 1 and 15.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ANDRES MUNOZ whose telephone number is (571)270-3346. The examiner can normally be reached 8AM-5PM Central Time.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Eva Montalvo can be reached at (571)270-3829. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/Andres Munoz/ Primary Examiner, Art Unit 2818
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