Prosecution Insights
Last updated: July 17, 2026
Application No. 18/221,244

PREVENTING DEPOSITION ON PEDESTAL IN SEMICONDUCTOR SUBSTRATE PROCESSING

Non-Final OA §102§103
Filed
Jul 12, 2023
Priority
Jul 31, 2018 — provisional 62/712,436 +3 more
Examiner
MCDONALD, RODNEY GLENN
Art Unit
1794
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Lam Research Corporation
OA Round
2 (Non-Final)
63%
Grant Probability
Moderate
2-3
OA Rounds
4m
Est. Remaining
88%
With Interview

Examiner Intelligence

Grants 63% of resolved cases
63%
Career Allowance Rate
797 granted / 1260 resolved
-1.7% vs TC avg
Strong +24% interview lift
Without
With
+24.3%
Interview Lift
resolved cases with interview
Typical timeline
3y 4m
Avg Prosecution
47 currently pending
Career history
1306
Total Applications
across all art units

Statute-Specific Performance

§103
76.5%
+36.5% vs TC avg
§102
3.1%
-36.9% vs TC avg
§112
6.5%
-33.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1260 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1, 7, 9, 10 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Itaya et al. (JAPAN 2004-217956 A). INDEPENDENT CLAIM 1: Regarding claim 1, Itaya et al. teach utilizing a heat shield structure (5) for a substrate support (16) in a substrate processing system, the heat shield structure (5) comprising: an outer shield (5) configured to surround a stem (17) of the substrate support (16), wherein the outer shield (5) is further configured to, define an inner volume between the outer shield (5) and the stem (17) of the substrate support (16), and define an inner volume between the outer shield (5) and a lower surface of the substrate support (16); and an edge guard extending upward from the outer shield, wherein the edge guard is configured to, surround an outer perimeter of the substrate support, and define a gap between the edge guard and the substrate support. (See Abstract; Fig. 1) PNG media_image1.png 766 564 media_image1.png Greyscale DEPENDENT CLAIM 7: Regarding claim 7, Itaya et al. teaches wherein the outer shield is not in direct contact with either one of the stem and the lower surface of the substrate support. (See Fig. 1) DEPENDENT CLAIM 9: Regarding claim 9, Itaya et al. teach wherein the substrate support corresponds to a pedestal configured to support a substrate during at least one of chemical vapor deposition and atomic layer deposition. (See Abstract; Fig. 1) DEPENDENT CLAIM 10: Regarding claim 10, Itaya et al. teach the system further comprising a gas source (22) configured to flow a purge gas into the inner volume. (See Abstract; Fig. 1) Claim Rejections - 35 USC § 103 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention. Claim(s) 2, 3, 5, 6, 8 are rejected under 35 U.S.C. 103 as being unpatentable over Itaya et al. (JAPAN 2004-217956 A) in view of Horio et al. (JP 2013-131555A). DEPENDENT CLAIM 2: The difference not yet discussed is further comprising at least one heat shield plate configured to be arranged below the substrate support in the inner volume between the outer shield and the lower surface of the substrate support. Regarding claim 2, Horio et al. suggest at least one heat shield plate configured to be arranged below the substrate support in the inner volume between the outer shield and the lower surface of the substrate support. (See Abstract; Figs. 1, 4) DEPENDENT CLAIM 3: The difference not yet discussed is wherein the at least one heat shield plate includes a plurality of heat shield plates spaced apart within the inner volume between the outer shield and the lower surface of the substrate support. Regarding claim 3, Horio et al. teach wherein the at least one heat shield plate includes a plurality of heat shield plates spaced apart within the inner volume between the outer shield and the lower surface of the substrate support. (See Abstract; Figs. 1, 4) DEPENDENT CLAIM 5: The difference not yet discussed is further comprising an inner shield arranged between the outer shield and the stem. Regarding clam 5, Horio et al. teach further comprising an inner shield arranged between the outer shield and the stem. (See Abstract; Figs. 1, 4) DEPENDENT CLAIM 6: The difference not yet discussed is wherein the inner shield extends downward from the at least one heat shield plate and defines a second inner volume between the inner shield and the stem. Regarding claim 6, Horio et al. teach wherein the inner shield extends downward from the at least one heat shield plate and defines a second inner volume between the inner shield and the stem. (See Fig. 4) DEPENDENT CLAIM 8: The difference not yet discussed is wherein the heat shield plate is not in direct contact with any one of the lower surface of the substrate support, the stem of the substrate support, and the outer shield. Regarding claim 8, Horio et al. teach wherein the heat shield plate is not in direct contact with any one of the lower surface of the substrate support, the stem of the substrate support, and the outer shield. (See Abstract; Figs. 1, 4) The motivation for utilizing the features of Horio et al. is that it allows for suppressing generations of deposits. (See Abstract) Therefore, it would have been obvious to one of ordinary skill in the art at the time the invention was made to have modified Itaya et al. by utilizing the features of Horio et al. because it allows for suppressing generations of deposits. Claim(s) 4 is rejected under 35 U.S.C. 103 as being unpatentable over Itaya et al. in view of Horio et al. as applied to claims 2, 3, 5, 6, 8 above, and further in view of Emerson et al. (U.S. Pat. 7,645,342). DEPENDENT CLAIM 4: The difference not yet discussed is further comprising a plurality of insulator pins arranged between adjacent ones of the heat shield plates. Regarding claim 4, Emerson et al. teach utilizing a plurality of insulator pins to separate heat shield plates. (Fig. 4; Column 7 lines 53-60) The motivation for utilizing the features of Emerson et al. is that it allows for avoiding conducting heat among the shields. (Column 7 lines 53-60) Therefore, it would have been obvious to one of ordinary skill in the art at the time the invention was made to have utilized the features of Emerson et al. is that it allows for avoiding conducting heat among the shields. Response to Arguments Applicant's arguments filed January 2, 2026 have been fully considered but they are not persuasive. Applicant’s filing of a terminal disclaimer has overcome the obviousness type double patenting rejection. Applicant correcting priority overcomes the prior rejections. Newly cited references are applied to address the claims. This action will be made NON-FINAL based on the newly cited references. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to RODNEY GLENN MCDONALD whose telephone number is (571)272-1340. The examiner can normally be reached Hoteling: M-Th every Fri off. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, James Lin can be reached at 571-272-8902. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /RODNEY G MCDONALD/Primary Examiner, Art Unit 1794 RM May 18, 2026
Read full office action

Prosecution Timeline

Jul 12, 2023
Application Filed
Oct 01, 2025
Non-Final Rejection mailed — §102, §103
Jan 02, 2026
Response Filed
May 21, 2026
Non-Final Rejection mailed — §102, §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

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METHODS FOR SELECTIVELY SEPARATING SAMPLES FROM SUBSTRATE
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SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
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Patent 12662731
SPUTTERING MACHINES, SUBSTRATE HOLDERS, AND SPUTTERING PROCESSES WITH MAGNETIC BIASING
2y 4m to grant Granted Jun 23, 2026
Patent 12655518
WAFER SUSCEPTOR
3y 6m to grant Granted Jun 16, 2026
Patent 12644186
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
2y 11m to grant Granted Jun 02, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

2-3
Expected OA Rounds
63%
Grant Probability
88%
With Interview (+24.3%)
3y 4m (~4m remaining)
Median Time to Grant
Moderate
PTA Risk
Based on 1260 resolved cases by this examiner. Grant probability derived from career allowance rate.

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