119 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18865913 | THROTTLE VALVE FOR SUBSTRATE PROCESSING SYSTEMS | JELLETT, MATTHEW WILLIAM | 3753 | Non-Final OA | Nov 14, 2024 |
| 18936877 | UNIFORMITY CONTROL CIRCUIT FOR IMPEDANCE MATCH | HOUSTON, ADAM D | 2842 | Non-Final OA | Nov 04, 2024 |
| 18932475 | VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS | MAYY, MOHAMMAD | 1718 | Non-Final OA | Oct 30, 2024 |
| 18928852 | Systems and Methods for Extracting Process Control Information from Radiofrequency Supply System of Plasma Processing System | KAISER, SYED M | 2831 | Non-Final OA | Oct 28, 2024 |
| 18924479 | SHOWERHEAD FACEPLATES WITH ANGLED GAS DISTRIBUTION PASSAGES FOR SEMICONDUCTOR PROCESSING TOOLS | LE, MINH Q | 3753 | Non-Final OA | Oct 23, 2024 |
| 18854754 | HEAT GUARD | WANG, XIAOBEI | 1784 | Non-Final OA | Oct 07, 2024 |
| 18854240 | NONCONFORMAL OXIDE FILM DEPOSITION USING CARBON-CONTAINING INHIBITOR | TADAYYON ESLAMI, TABASSOM | 1718 | Non-Final OA | Oct 04, 2024 |
| 18847683 | REDUCING CAPACITANCE IN SEMICONDUCTOR DEVICES | MCCLURE, CHRISTINA D | 1718 | Non-Final OA | Sep 17, 2024 |
| 18847308 | FEEDBACK CONTROL SYSTEMS FOR IMPEDANCE MATCHING | FERNANDEZ, PEDRO C | 2844 | Non-Final OA | Sep 16, 2024 |
| 18847652 | LOW-K DIELECTRIC PROTECTION DURING PLASMA DEPOSITION OF SILICON NITRIDE | GAMBETTA, KELLY M | 1718 | Non-Final OA | Sep 16, 2024 |
| 18847173 | SEAM-FREE AND CRACK-FREE DEPOSITION | MCCLURE, CHRISTINA D | 1718 | Non-Final OA | Sep 13, 2024 |
| 18837560 | LOW RESISTANCE MOLYBDENUM DEPOSITION FOR LOGIC SOURCE/DRAIN CONTACTS | CHEN, BRET P | 1718 | Non-Final OA | Aug 09, 2024 |
| 18836329 | SYSTEMS AND METHODS FOR CENTRAL FREQUENCY TUNING | SATHIRAJU, SRINIVAS | 2844 | Non-Final OA | Aug 06, 2024 |
| 18834982 | METHOD AND APPARATUS FOR RADIO FREQUENCY GRID DESIGN IN AN ESC TO REDUCE FILM ASYMMETRY | PATEL, DHARTI HARIDAS | 2838 | Non-Final OA | Jul 31, 2024 |
| 18767915 | RF POWER COMPENSATION TO REDUCE DEPOSITION OR ETCH RATE CHANGES IN RESPONSE TO SUBSTRATE BULK RESISTIVITY VARIATIONS | BENNETT, CHARLEE | 1718 | Non-Final OA | Jul 09, 2024 |
| 18727065 | PLASMA RADICAL EDGE RING BARRIER SEAL | BYRD, EUGENE G | 3675 | Non-Final OA | Jul 05, 2024 |
| 18725961 | COMPOSITION MIXTURE CONTROL OF EFEM ENVIRONMENT | GRAY, PAUL J | 3753 | Non-Final OA | Jul 01, 2024 |
| 18757184 | ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTRAVIOLET LITHOGRAPHY RESIST IMPROVEMENT | DEO, DUY VU NGUYEN | 1713 | Non-Final OA | Jun 27, 2024 |
| 18747743 | Method for Manufacturing ScAlN Target | LIANG, ANTHONY M | 1734 | Non-Final OA | Jun 19, 2024 |
| 18740501 | Voltage Transient Detector and Current Transient Detector | BAUER, SCOTT ALLEN | 2838 | Non-Final OA | Jun 11, 2024 |
| 18662672 | METHOD FOR ETCHING AN ETCH LAYER | CULBERT, ROBERTS P | 1716 | Final Rejection | May 13, 2024 |
| 18708586 | NESTING ATMOSPHERIC ROBOT ARMS FOR HIGH THROUGHPUT | MCCLAIN, GERALD | 3652 | Non-Final OA | May 08, 2024 |
| 18707790 | SYSTEM FOR MONITORING PERFORMANCE OF ELECTROSTATIC CHUCKS IN SUBSTRATE PROCESSING SYSTEMS | AL-TAWEEL, MUAAMAR QAHTAN | 2838 | Non-Final OA | May 06, 2024 |
| 18637111 | ELECTROSTATIC CHUCK (ESC) PEDESTAL VOLTAGE ISOLATION | CHAN, LAUREEN | 1716 | Non-Final OA | Apr 16, 2024 |
| 18701808 | MICROCHANNEL ASSEMBLY COOLED POWER CIRCUITS FOR POWER BOXES OF SUBSTRATE PROCESSING SYSTEMS | VORTMAN, ANATOLY | 2835 | Non-Final OA | Apr 16, 2024 |
| 18701458 | VALVE FOR SEMICONDUCTOR EQUIPMENT | PRICE, CRAIG JAMES | 3753 | Non-Final OA | Apr 15, 2024 |
| 18691817 | REMOTE PLASMA DEPOSITION WITH ELECTROSTATIC CLAMPING | YU, YUECHUAN | 1718 | Non-Final OA | Mar 13, 2024 |
| 18689007 | Junction System for Direct-Drive Radiofrequency Power Supply | WELLS, KENNETH B | 2842 | Final Rejection | Mar 04, 2024 |
| 18581084 | TRANSFER ROBOT FOR REDUCED FOOTPRINT PLATFORM ARCHITECTURE | KEENAN, JAMES W | 3655 | Non-Final OA | Feb 19, 2024 |
| 18683501 | METHOD AND APPARATUS FOR ETCHING A CARBON CONTAINING LAYER | TRAN, BINH X | 1713 | Non-Final OA | Feb 13, 2024 |
| 18291444 | SUBSTRATE SUPPORTS WITH MESOCHANNEL ASSEMBLIES | NIEVES, NELSON J | 3763 | Non-Final OA | Jan 23, 2024 |
| 18572075 | IMAGE ANALYSIS OF PLASMA CONDITIONS | JIA, XIN | 2663 | Non-Final OA | Dec 19, 2023 |
| 18570061 | IN-LINE MACHINE VISION SYSTEM FOR PART TRACKING OF SUBSTRATE PROCESSING SYSTEM | COLLINS, MICHAEL | 3655 | Non-Final OA | Dec 13, 2023 |
| 18569100 | RADICAL-ACTIVATED CARBON FILM DEPOSITION | STARK, JARRETT J | 2898 | Non-Final OA | Dec 11, 2023 |
| 18385823 | DETERMINATION OF RECIPES FOR MANUFACTURING SEMICONDUCTOR DEVICES | NGUYEN, NHA T | 2851 | Non-Final OA | Oct 31, 2023 |
| 18557250 | APPARATUSES FOR MEASURING GAP BETWEEN A SUBSTRATE SUPPORT PLANE AND GAS DISTRIBUTION DEVICE | HO, ANTHONY | 2817 | Non-Final OA | Oct 25, 2023 |
| 18493614 | DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF | CHEN, KEATH T | 1716 | Non-Final OA | Oct 24, 2023 |
| 18379397 | PRECURSORS FOR DEPOSITION OF MOLYBDENUM-CONTAINING FILMS | HERNANDEZ-KENNEY, JOSE | 1717 | Non-Final OA | Oct 12, 2023 |
| 18550733 | CONTROL OF METALLIC CONTAMINATION FROM METAL-CONTAINING PHOTORESIST | MARKOFF, ALEXANDER | 1711 | Non-Final OA | Sep 15, 2023 |
| 18282021 | CONDUCTIVE COOLING OF A LOW TEMPERATURE PEDESTAL OPERATING IN A HIGH TEMPERATURE DEPOSITION SEQUENCE | BERMAN, JASON | 1794 | Non-Final OA | Sep 14, 2023 |
| 18244905 | REFLECTOMETER TO MONITOR SUBSTRATE MOVEMENT | MALKOWSKI, KENNETH J | 3667 | Non-Final OA | Sep 11, 2023 |
| 18463647 | TOOL FOR PREVENTING OR SUPPRESSING ARCING | NUCKOLS, TIFFANY Z | 1716 | Non-Final OA | Sep 08, 2023 |
| 18256893 | HIGH SELECTIVITY, LOW STRESS, AND LOW HYDROGEN CARBON HARDMASKS IN LOW-PRESSURE CONDITIONS WITH WIDE GAP ELECTRODE SPACING | LU, JIONG-PING | 1713 | Final Rejection | Jun 09, 2023 |
| 18256665 | MACHINE-LEARNING IN MULTI-STEP SEMICONDUCTOR FABRICATION PROCESSES | AZAD, MD ABUL K | 2119 | Non-Final OA | Jun 09, 2023 |
| 18265825 | ATOMIC LAYER DEPOSITION WITH MULTIPLE UNIFORMLY HEATED CHARGE VOLUMES | THOMAS, BINU | 1717 | Non-Final OA | Jun 07, 2023 |
| 18327558 | WAFER LEVEL UNIFORMITY CONTROL IN REMOTE PLASMA FILM DEPOSITION | TUROCY, DAVID P | 1718 | Non-Final OA | Jun 01, 2023 |
| 18253196 | LOW RESISTANCE PULSED CVD TUNGSTEN | LOHAKARE, PRATIKSHA JAYANT | 2818 | Final Rejection | May 18, 2023 |
| 18037537 | PROCESS KIT DE-BUBBLING | RUFO, LOUIS J | 1795 | Non-Final OA | May 17, 2023 |
| 18253038 | LOW RESISTIVITY CONTACTS AND INTERCONNECTS | LOUIE, MANDY C | 1718 | Final Rejection | May 16, 2023 |
| 18035200 | PEDESTAL INCLUDING SEAL | CHEN, KEATH T | 1716 | Non-Final OA | May 03, 2023 |
| 18034834 | SUBSTRATE PROCESSING SYSTEM TOOLS FOR MONITORING, ASSESSING AND RESPONDING BASED ON HEALTH INCLUDING SENSOR MAPPING AND TRIGGERED DATALOGGING | BAHLS, JENNIFER E. S. | 2853 | Non-Final OA | May 01, 2023 |
| 18250740 | Wear Compensating Confinement Ring | KACKAR, RAM N | 1716 | Non-Final OA | Apr 26, 2023 |
| 18250349 | LOCALIZED PLASMA ARC PREVENTION VIA PURGE RING | CHEN, KEATH T | 1716 | Final Rejection | Apr 24, 2023 |
| 18032154 | COLD EDGE LOW TEMPERATURE ELECTROSTATIC CHUCK | CHAN, LAUREEN | 1716 | Final Rejection | Apr 14, 2023 |
| 18247724 | SPARK PLASMA SINTERED COMPONENT FOR PLASMA PROCESSING CHAMBER | MCDONALD, RODNEY GLENN | 1794 | Non-Final OA | Apr 03, 2023 |
| 18247060 | DEPOSITION RATE ENHANCEMENT OF AMORPHOUS CARBON HARD MASK FILM BY PURELY CHEMICAL MEANS | TUROCY, DAVID P | 1718 | Non-Final OA | Mar 28, 2023 |
| 18246849 | COATED CONDUCTOR FOR HEATER EMBEDDED IN CERAMIC | WOLCOTT, BRIAN P | 3711 | Non-Final OA | Mar 27, 2023 |
| 18028638 | PREPLATING EDGE DRY | KURPLE, KARL | 1717 | Non-Final OA | Mar 27, 2023 |
| 18187342 | ELECTRON EXCITATION ATOMIC LAYER ETCH | KLUNK, MARGARET D | 1716 | Non-Final OA | Mar 21, 2023 |
| 18026431 | AXIALLY COOLED METAL SHOWERHEADS FOR HIGH TEMPERATURE PROCESSES | LEE, AIDEN Y | 1718 | Non-Final OA | Mar 15, 2023 |
| 18026322 | HEAT-TRANSFERRING VALVE FLEXURE AND METHODS | BASTIANELLI, JOHN | 3753 | Non-Final OA | Mar 14, 2023 |
| 18025197 | HYBRID SHOWERHEAD WITH SEPARATE FACEPLATE FOR HIGH TEMPERATURE PROCESS | LUND, JEFFRIE ROBERT | 1716 | Non-Final OA | Mar 08, 2023 |
| 18042198 | C-shroud Modification For Plasma Uniformity Without Impacting Mechanical Strength Or Lifetime Of The C-shroud | SWEELY, KURT D | 1718 | Final Rejection | Feb 17, 2023 |
| 18041391 | COMBINED SELF-FORMING BARRIER AND SEED LAYER BY ATOMIC LAYER DEPOSITION | KEBEDE, BROOK | 2818 | Non-Final OA | Feb 10, 2023 |
| 18006552 | LOW CEILING TEMPERATURE HOMOPOLYMERS AS SACRIFICIAL PROTECTION LAYERS FOR ENVIRONMENTALLY SENSITIVE SUBSTRATES | KIELIN, ERIK J | 2814 | Final Rejection | Jan 23, 2023 |
| 18017208 | THIN SHADOW RING FOR LOW-TILT TRENCH ETCHING | FORD, NATHAN K | 1716 | Non-Final OA | Jan 20, 2023 |
| 18003894 | REMOVABLE CVD POLYMER FILM FOR SURFACE PROTECTION AND QUEUE PERIOD EXTENSION | PHAM, THOMAS T | 1713 | Final Rejection | Dec 29, 2022 |
| 18013742 | FRICTION STIR PROCESSING FOR CORROSION RESISTANCE | STONER, KILEY SHAWN | 1735 | Non-Final OA | Dec 29, 2022 |
| 18013768 | SUBSTRATE SUPPORT WITH UNIFORM TEMPERATURE ACROSS A SUBSTRATE | FREY, KIMBERLY NEWMAN | 2817 | Non-Final OA | Dec 29, 2022 |
| 18013445 | SUBSTRATE SUPPORTS WITH MULTILAYER STRUCTURE INCLUDING COUPLED HEATER ZONES WITH LOCAL THERMAL CONTROL | LEE JR, WOODY A | 3761 | Non-Final OA | Dec 28, 2022 |
| 18013429 | MOVABLE DISK WITH APERTURE FOR ETCH CONTROL | KENDALL, BENJAMIN R | 2896 | Non-Final OA | Dec 28, 2022 |
| 18003137 | LOW RESISTANCE GATE OXIDE METALLIZATION LINER | TRAN, TIEN | 2812 | Final Rejection | Dec 22, 2022 |
| 18002788 | ATOMIC LAYER ETCHING OF A SEMICONDUCTOR, A METAL, OR A METAL OXIDE WITH SELECTIVITY TO A DIELECTRIC | LAOBAK, ANDREW KEELAN | 1713 | Final Rejection | Dec 21, 2022 |
| 18012194 | IN-SITU HYDROCARBON-BASED LAYER FOR NON-CONFORMAL PASSIVATION OF PARTIALLY ETCHED STRUCTURES | LAOBAK, ANDREW KEELAN | 1713 | Final Rejection | Dec 21, 2022 |
| 18011445 | Systems and Methods for Analyzing and Intelligently Collecting Sensor Data | GO, RICKY | 1716 | Non-Final OA | Dec 19, 2022 |
| 18002289 | MULTI-STATION PROCESSING TOOLS WITH STATION-VARYING SUPPORT FEATURES FOR BACKSIDE PROCESSING | BENNETT, CHARLEE | 1718 | Non-Final OA | Dec 19, 2022 |
| 18010990 | INTERMITTENT STAGNANT FLOW | MARKOFF, ALEXANDER | 1711 | Non-Final OA | Dec 16, 2022 |
| 18009903 | MATCHED CHEMISTRY COMPONENT BODY AND COATING FOR A SEMICONDUCTOR PROCESSING CHAMBER | SWEELY, KURT D | 1718 | Final Rejection | Dec 12, 2022 |
| 18001590 | REMOVAL OF TIN OXIDE IN CHAMBER CLEANING | LAOBAK, ANDREW KEELAN | 1713 | Non-Final OA | Dec 12, 2022 |
| 17928747 | MONOBLOC PEDESTAL FOR EFFICIENT HEAT TRANSFER | WEN, KEVIN GUANHUA | 3761 | Non-Final OA | Nov 30, 2022 |
| 17928426 | PHOTOELECTRON ASSISTED PLASMA IGNITION | YU, YUECHUAN | 1718 | Final Rejection | Nov 29, 2022 |
| 17994984 | Dual Gas Feed Showerhead for Deposition | BENNETT, CHARLEE | 1718 | Final Rejection | Nov 28, 2022 |
| 17927297 | ATOMIC LAYER DEPOSITION COATED POWDER COATING FOR PROCESSING CHAMBER COMPONENTS | KENDALL, BENJAMIN R | 2896 | Final Rejection | Nov 22, 2022 |
| 17927328 | DISTRIBUTED PLASMA SOURCE ARRAY | ALEJANDRO MULERO, LUZ L | 1716 | Non-Final OA | Nov 22, 2022 |
| 17999255 | LOW RESISTIVITY CONTACTS AND INTERCONNECTS | TRAN, TONY | 2893 | Final Rejection | Nov 18, 2022 |
| 17926093 | WET FUNCTIONALIZATION OF DIELECTRIC SURFACES | JEFFERSON, QUOVAUNDA | 2899 | Non-Final OA | Nov 17, 2022 |
| 17924618 | EVAPORATIVE COOLING OF ELECTROSTATIC CHUCKS | NUCKOLS, TIFFANY Z | 1716 | Non-Final OA | Nov 10, 2022 |
| 17924354 | MID-CHAMBER FLOW OPTIMIZER | KENDALL, BENJAMIN R | 2896 | Final Rejection | Nov 09, 2022 |
| 17998255 | METHODS TO IMPROVE WAFER WETTABILITY FOR PLATING - ENHANCEMENT THROUGH SENSORS AND CONTROL ALGORITHMS | CHUNG, HOSUNG CHARLES | 1794 | Non-Final OA | Nov 08, 2022 |
| 17997802 | INCREASING PLASMA UNIFORMITY IN A RECEPTACLE | LEE, WILSON | 2844 | Non-Final OA | Nov 02, 2022 |
| 17921930 | BLENDED CONTACT FINGERS FOR PREVENTING CRACKS DURING THIN SUBSTRATE HANDLING | CONTRERAS, CIEL P | 1794 | Non-Final OA | Oct 27, 2022 |
| 17920111 | FLOATING PCB DESIGN FOR SUBSTRATE SUPPORT ASSEMBLY | NUCKOLS, TIFFANY Z | 1716 | Non-Final OA | Oct 20, 2022 |
| 17995461 | LOSS PREVENTION DURING ATOMIC LAYER DEPOSITION | FAYETTE, NATHALIE RENEE | 2812 | Non-Final OA | Oct 04, 2022 |
| 17995243 | ELECTROFILL FROM ALKALINE ELECTROPLATING SOLUTIONS | WITTENBERG, STEFANIE S | 1795 | Non-Final OA | Sep 30, 2022 |
| 17995290 | SELECTIVE PRECISION ETCHING OF SEMICONDUCTOR MATERIALS | LAOBAK, ANDREW KEELAN | 1713 | Non-Final OA | Sep 30, 2022 |
| 17915573 | EDGE RING FOR LOCALIZED DELIVERY OF TUNING GAS | REYES, JOSHUA NATHANIEL PI | 1718 | Final Rejection | Sep 29, 2022 |
| 17914499 | SUBSTRATE SUPPORT TEMPERATURE PROBE DIAGNOSTICS AND MANAGEMENT | LIN, ERICA S Y | 2853 | Non-Final OA | Sep 26, 2022 |
| 17905754 | APPARATUS AND PROCESS FOR EUV DRY RESIST SENSITIZATION BY GAS PHASE INFUSION OF A SENSITIZER | WALKE, AMANDA C | 1722 | Final Rejection | Sep 06, 2022 |
| 17905632 | STRUCTURE AND METHOD TO ACHIEVE POSITIVE TONE DRY DEVELOP BY A HERMETIC OVERLAYER | CHACKO DAVIS, DABORAH | 1737 | Final Rejection | Sep 02, 2022 |
| 17905628 | RING STRUCTURE WITH COMPLIANT CENTERING FINGERS | SCHWENNING, LYNN E | 3652 | Non-Final OA | Sep 02, 2022 |
| 17908587 | METHOD FOR ARRANGING A SEMICONDUCTOR PROCESSING TOOL ON A PEDESTAL | KIM, PAUL D | 3729 | Final Rejection | Sep 01, 2022 |
| 17905321 | CONTROL OF WAFER BOW DURING INTEGRATED CIRCUIT PROCESSING | STEVENSON, ANDRE C | 2899 | Non-Final OA | Aug 30, 2022 |
| 17821107 | ATOMIC LAYER ETCHING AND SMOOTHING OF REFRACTORY METALS AND OTHER HIGH SURFACE BINDING ENERGY MATERIALS | NUCKOLS, TIFFANY Z | 1716 | Final Rejection | Aug 19, 2022 |
| 17800168 | PLANAR MULTI-LAYER RADIO FREQUENCY FILTERS INCLUDING STACKED COILS WITH STRUCTURAL CAPACITANCE | ALEJANDRO MULERO, LUZ L | 1716 | Non-Final OA | Aug 16, 2022 |
| 17799866 | HIGH TEMPERATURE SUBSTRATE SUPPORT WITH HEAT SPREADER | LEE, AIDEN Y | 1718 | Non-Final OA | Aug 15, 2022 |
| 17759673 | ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTORESIST-FREE FORMATION OF METAL FEATURES | FORTIN, RYAN TIMOTHY | 2897 | Final Rejection | Jul 28, 2022 |
| 17795188 | SEGMENTED GAS DISTRIBUTION PLATE FOR HIGH-POWER, HIGH-PRESSURE PROCESSES | ZERVIGON, RUDY | 1716 | Non-Final OA | Jul 25, 2022 |
| 17792996 | ALLOY FILM ETCH | ANGUIANO, MICHAEL | 2899 | Final Rejection | Jul 14, 2022 |
| 17790009 | MIXED METAL BASEPLATES FOR IMPROVED THERMAL EXPANSION MATCHING WITH THERMAL OXIDE SPRAYCOAT | MACARTHUR, SYLVIA | 1716 | Non-Final OA | Jun 29, 2022 |
| 17805081 | THERMAL ATOMIC LAYER ETCH WITH RAPID TEMPERATURE CYCLING | BENNETT, CHARLEE | 1718 | Final Rejection | Jun 02, 2022 |
| 17780011 | SYSTEMS AND METHODS FOR USING A TRANSFORMER TO ACHIEVE UNIFORMITY IN PROCESSING A SUBSTRATE | SEOANE, TODD MICHAEL | 1718 | Final Rejection | May 25, 2022 |
| 17753776 | SELECTIVE GRAPHENE DEPOSITION USING REMOTE PLASMA | TUROCY, DAVID P | 1718 | Final Rejection | Mar 14, 2022 |
| 17671211 | MOVEABLE EDGE RINGS WITH REDUCED CAPACITANCE VARIATION FOR SUBSTRATE PROCESSING SYSTEMS | MCCONNELL, AARON R | 3723 | Non-Final OA | Feb 14, 2022 |
| 17631984 | EDGE RING SYSTEMS FOR SUBSTRATE PROCESSING SYSTEMS | MOORE, KARLA A | 1716 | Non-Final OA | Feb 01, 2022 |
| 17612536 | SHOWERHEAD INSERT FOR UNIFORMITY TUNING | REYES, JOSHUA NATHANIEL PI | 1718 | Non-Final OA | Nov 18, 2021 |
| 17605264 | HIGH TEMPERATURE HEATING OF A SUBSTRATE IN A PROCESSING CHAMBER | MOORE, KARLA A | 1716 | Final Rejection | Oct 21, 2021 |
| 17604956 | ELECTROSTATIC CHUCK SYSTEM | CROWELL, ANNA M | 1716 | Non-Final OA | Oct 19, 2021 |
| 17593117 | PLASMA ETCH TOOL FOR HIGH ASPECT RATIO ETCHING | REYES, JOSHUA NATHANIEL PI | 1718 | Final Rejection | Sep 09, 2021 |
| 17429909 | ELECTROSTATIC CHUCK WITH POWDER COATING | DINH, TUAN T | 2847 | Non-Final OA | Aug 10, 2021 |
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