Prosecution Insights
Prosecution Insights
153 pending office actions • 40 art units • 111 examiners • 0 of 153 (0%) have an AI response strategy ready • 222 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 43 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 43 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 only | 2 (1%) |
| §103 only | 58 (38%) |
| §102 only | 4 (3%) |
| §112 only | 5 (3%) |
| Double-patenting only | 5 (3%) |
| Double-patenting + other | 7 (5%) |
| Multi-statute (no §101) | 72 (47%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| SWEELY, KURT D | 6 | 52.7% | +35.3% |
| KENDALL, BENJAMIN R | 5 | 32.9% | +22.8% |
| CHEN, KEATH T | 4 | 30.2% | +24.6% |
| FORD, NATHAN K | 4 | 32.5% | +35.0% |
| CHEN, BRET P | 3 | 84.5% | +16.7% |
| MCCLAIN, GERALD | 3 | 74.2% | +14.8% |
| REMAVEGE, CHRISTOPHER | 3 | 57.8% | +26.4% |
| KLUNK, MARGARET D | 3 | 44.1% | +31.7% |
| MILLER, JR, JOSEPH ALBERT | 3 | 68.3% | +16.2% |
| KACKAR, RAM N | 3 | 39.8% | +58.9% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18837560 | LOW RESISTANCE MOLYBDENUM DEPOSITION FOR LOGIC SOURCE/DRAIN CONTACTS | CHEN, BRET P | 22d |
| 18721457 | CONFORMAL SILICON OXIDE DEPOSITION USING AMINOSILANE AND CHLOROSILANE PRECURSORS | CHEN, BRET P | 84d |
| 19110207 | LAYERED METAL OXIDE-SILICON OXIDE FILMS | CHEN, BRET P | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17781447 | PRESSURE BATCH COMPENSATION TO STABILIZE CD VARIATION FOR TRIM AND DEPOSITION PROCESSES | ZERVIGON, RUDY | 317d overdue |
| 17907959 | REACTANT GAS PULSE DELIVERY | LAW, NGA LEUNG V | 147d overdue |
| 18247060 | DEPOSITION RATE ENHANCEMENT OF AMORPHOUS CARBON HARD MASK FILM BY PURELY CHEMICAL MEANS | TUROCY, DAVID P | 100d overdue |
| 18044336 | TEMPORARY CAPPING MATERIAL FOR OXIDE PREVENTION IN LOW TEMPERATURE DIRECT METAL-METAL BONDING | PHAM, THOMAS T | 60d overdue |
| 17927297 | ATOMIC LAYER DEPOSITION COATED POWDER COATING FOR PROCESSING CHAMBER COMPONENTS | KENDALL, BENJAMIN R | 45d overdue |
| 18572355 | DEVICE FOR HOLDING A WAFER-SHAPED ARTICLE | ZAWORSKI, JONATHAN R | 45d overdue |
| 18265825 | ATOMIC LAYER DEPOSITION WITH MULTIPLE UNIFORMLY HEATED CHARGE VOLUMES | THOMAS, BINU | 30d overdue |
| 18250349 | LOCALIZED PLASMA ARC PREVENTION VIA PURGE RING | CHEN, KEATH T | 30d overdue |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17927297 | ATOMIC LAYER DEPOSITION COATED POWDER COATING FOR PROCESSING CHAMBER COMPONENTS | KENDALL, BENJAMIN R | 45d overdue |
| 18250349 | LOCALIZED PLASMA ARC PREVENTION VIA PURGE RING | CHEN, KEATH T | 30d overdue |
| 17904005 | COOLING PLATE FOR SEMICONDUCTOR PROCESSING CHAMBER WINDOW | FORD, NATHAN K | 29d overdue |
| 18493614 | DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF | CHEN, KEATH T | 10d overdue |
| 18035200 | PEDESTAL INCLUDING SEAL | CHEN, KEATH T | 3d overdue |
| 18013429 | MOVABLE DISK WITH APERTURE FOR ETCH CONTROL | KENDALL, BENJAMIN R | 2d overdue |
| 18837560 | LOW RESISTANCE MOLYBDENUM DEPOSITION FOR LOGIC SOURCE/DRAIN CONTACTS | CHEN, BRET P | 22d |
| 18682869 | ION BEAM ETCH SYSTEM AND METHOD | SWEELY, KURT D | 56d |
| Art Unit | Apps |
|---|---|
| 1718 | 23 |
| 1716 | 20 |
| 1713 | 8 |
| 2896 | 5 |
| 1717 | 4 |
| 1712 | 3 |
| 2844 | 3 |
| 1795 | 3 |
| 2842 | 2 |
| 3652 | 2 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19186588 | Systems and Methods for Use of Low Frequency Harmonics in Bias Radiofrequency Supply to Control Uniformity of Plasma Process Results Across Substrate | LAM, TUAN THIEU | — | DP | Non-Final OA | — | Pending | Apr 22, 2025 |
| 19093111 | SYSTEMS AND METHODS FOR MULTI-LEVEL PULSING IN RF PLASMA TOOLS | SATHIRAJU, SRINIVAS | — | §102 | Non-Final OA | — | Pending | Mar 27, 2025 |
| 19079410 | PROTECTION SYSTEM FOR SWITCHES IN DIRECT DRIVE CIRCUITS OF SUBSTRATE PROCESSING SYSTEMS | KAISER, SYED M | — | §103Other | Non-Final OA | — | Pending | Mar 13, 2025 |
| 19110207 | LAYERED METAL OXIDE-SILICON OXIDE FILMS | CHEN, BRET P | 1718 | §103 | Non-Final OA | — | Pending | Mar 10, 2025 |
| 19109741 | PYROCHLORE COMPONENT FOR PLASMA PROCESSING CHAMBER | KING, MONICA C | — | §102§103§112 | Non-Final OA | — | Pending | Mar 07, 2025 |
| 19042816 | PEDESTAL THERMAL PROFILE TUNING USING MULTIPLE HEATED ZONES AND THERMAL VOID | WEDDLE, ALEXANDER MARION | 1712 | §102§103DP | Non-Final OA | — | Pending | Jan 31, 2025 |
| 18881353 | MOBILE SENSOR DEVICES FOR SEMICONDUCTOR FABRICATION EQUIPMENT | JEN, MINGJEN | 3657 | §103§112 | Non-Final OA | — | Pending | Jan 06, 2025 |
| 18881084 | MULTI-PLENUM GAS MANIFOLDS FOR SUBSTRATE PROCESSING SYSTEMS | LUONG, HENRY T | 2844 | §103 | Non-Final OA | — | Pending | Jan 03, 2025 |
| 18880670 | END EFFECTOR | LU, WILLIAM | — | §103 | Non-Final OA | — | Pending | Jan 02, 2025 |
| 18874526 | METAL-OXIDE VARISTOR (MOV) BASED SURGE PROTECTION CIRCUIT FOR PLASMA PROCESSING CHAMBER | WELLS, KENNETH B | 2842 | §102§103 | Non-Final OA | — | Pending | Dec 12, 2024 |
| 18871372 | CHUCKING SYSTEM WITH SILANE COUPLING AGENT | SREEVATSA, SREEYA | — | §103 | Non-Final OA | — | Pending | Dec 03, 2024 |
| 18959448 | HEAT AND VOLATILE-ORGANIC-COMPOUNDS DETECTING SYSTEMS | KIM, KIHO | — | §102§103 | Non-Final OA | — | Pending | Nov 25, 2024 |
| 18868349 | UNDERLAYER WITH BONDED DOPANTS FOR PHOTOLITHOGRAPHY | PERSAUD, DEORAM | 2882 | §102 | Non-Final OA | — | Pending | Nov 22, 2024 |
| 18956710 | EARLY WARNING SYSTEMS AND METHODS FOR DETERMINING CAPACITOR FAILURES | MONSUR, NASIMA | — | §102§103§112 | Non-Final OA | — | Pending | Nov 22, 2024 |
| 18955355 | LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELECTROSTATIC CHUCK WITH MULTIPLEXED HEATERS ARRAY | BERHANE, ADOLF D | — | DP | Non-Final OA | — | Pending | Nov 21, 2024 |
| 18936877 | UNIFORMITY CONTROL CIRCUIT FOR IMPEDANCE MATCH | HOUSTON, ADAM D | 2842 | §102§103 | Non-Final OA | 22d | Pending | Nov 04, 2024 |
| 18932475 | VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS | MAYY, MOHAMMAD | 1718 | §103 | Non-Final OA | 31d overdue | Pending | Oct 30, 2024 |
| 18861554 | MULTI-MODAL ELECTROSTATIC CHUCKING | THOMAS, LUCY M | — | §102§103 | Non-Final OA | — | Pending | Oct 29, 2024 |
| 18859433 | ORGANOCHLORIDE ETCH WITH PASSIVATION AND PROFILE CONTROL | DUCLAIR, STEPHANIE P. | — | §103§112DP | Non-Final OA | — | Pending | Oct 23, 2024 |
| 18857441 | SHALLOW-DEPTH EQUIPMENT FRONT END MODULE WITH ROBOT | MCCLAIN, GERALD | — | §103§112 | Non-Final OA | — | Pending | Oct 16, 2024 |
| 18854240 | NONCONFORMAL OXIDE FILM DEPOSITION USING CARBON-CONTAINING INHIBITOR | TADAYYON ESLAMI, TABASSOM | 1718 | §102§103§112 | Final Rejection | 10d overdue | Pending | Oct 04, 2024 |
| 18902729 | TEMPERATURE MONITORING | KAO, CHIH CHENG G | 2884 | §112Other | Non-Final OA | — | Pending | Sep 30, 2024 |
| 18847683 | REDUCING CAPACITANCE IN SEMICONDUCTOR DEVICES | MCCLURE, CHRISTINA D | 1718 | §103 | Final Rejection | 77d overdue | Pending | Sep 17, 2024 |
| 18847652 | LOW-K DIELECTRIC PROTECTION DURING PLASMA DEPOSITION OF SILICON NITRIDE | GAMBETTA, KELLY M | 1718 | §103 | Final Rejection | 23d overdue | Pending | Sep 16, 2024 |
| 18847308 | FEEDBACK CONTROL SYSTEMS FOR IMPEDANCE MATCHING | FERNANDEZ, PEDRO C | 2844 | §103 | Final Rejection | 24d overdue | Pending | Sep 16, 2024 |
| 18847173 | SEAM-FREE AND CRACK-FREE DEPOSITION | MCCLURE, CHRISTINA D | 1718 | §103 | Non-Final OA | 40d | Pending | Sep 13, 2024 |
| 18846229 | FAST ATOMIC LAYER ETCH | REMAVEGE, CHRISTOPHER | — | §103 | Non-Final OA | — | Pending | Sep 11, 2024 |
| 18846216 | SPATIALLY TUNABLE INDUCTIVELY COUPLED PLASMA ANTENNA | LE, TUNG X | — | §103 | Non-Final OA | — | Pending | Sep 11, 2024 |
| 18845733 | SIDEWALL PASSIVATION USING ALDEHYDE OR ISOCYANATE CHEMISTRY FOR HIGH ASPECT RATIO ETCH | BOWMAN, ANDREW J | 1717 | §102§103 | Non-Final OA | — | Pending | Sep 10, 2024 |
| 18813749 | MODEL-BASED SCHEDULING FOR SUBSTRATE PROCESSING SYSTEMS | PATEL, JIGNESHKUMAR C | 2116 | §103 | Non-Final OA | — | Pending | Aug 23, 2024 |
| 18811234 | CHILLER MAKE-BREAK CONNECTOR FOR SUBSTRATE PROCESSING SYSTEMS | MYERS, GLENN F | — | DP | Non-Final OA | — | Pending | Aug 21, 2024 |
| 18840453 | THERMAL FILM DEPOSITION | TADAYYON ESLAMI, TABASSOM | 1718 | §102§103 | Non-Final OA | — | Pending | Aug 21, 2024 |
| 18839177 | SELECTIVE PRECISION ETCHING OF SEMICONDUCTOR MATERIALS | DEO, DUY VU NGUYEN | — | DP | Non-Final OA | — | Pending | Aug 16, 2024 |
| 18806234 | SEMICONDUCTOR SUBSTRATE BEVEL CLEANING | GOLIGHTLY, ERIC WAYNE | 1714 | §102§103§112 | Non-Final OA | — | Pending | Aug 15, 2024 |
| 18837560 | LOW RESISTANCE MOLYBDENUM DEPOSITION FOR LOGIC SOURCE/DRAIN CONTACTS | CHEN, BRET P | 1718 | §103 | Non-Final OA | 22d | Pending | Aug 09, 2024 |
| 18836329 | SYSTEMS AND METHODS FOR CENTRAL FREQUENCY TUNING | SATHIRAJU, SRINIVAS | 2844 | §112 | Non-Final OA | 10d overdue | Pending | Aug 06, 2024 |
| 18836104 | RF ASSEMBLY FOR SUBSTRATE PROCESSING SYSTEMS | KIM, SEOKJIN | — | §102 | Non-Final OA | — | Pending | Aug 06, 2024 |
| 18834982 | METHOD AND APPARATUS FOR RADIO FREQUENCY GRID DESIGN IN AN ESC TO REDUCE FILM ASYMMETRY | PATEL, DHARTI HARIDAS | 2838 | §102§103 | Non-Final OA | 2d overdue | Pending | Jul 31, 2024 |
| 18771442 | EFFICIENT CLEANING AND ETCHING OF HIGH ASPECT RATIO STRUCTURES | DEO, DUY VU NGUYEN | 1713 | §112Other | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18728348 | SENSORS FOR SEMICONDUCTOR PROCESSING TOOLS | LIN, ERICA S Y | — | §102§103 | Non-Final OA | — | Pending | Jul 11, 2024 |
| 18727065 | PLASMA RADICAL EDGE RING BARRIER SEAL | BYRD, EUGENE G | 3675 | §103 | Non-Final OA | 31d overdue | Pending | Jul 05, 2024 |
| 18764079 | SELECTIVE SILICON DIOXIDE REMOVAL USING LOW PRESSURE LOW BIAS DEUTERIUM PLASMA | NUCKOLS, TIFFANY Z | — | §103 | Non-Final OA | — | Pending | Jul 03, 2024 |
| 18725503 | HIGH SELECTIVITY AND UNIFORM DIELECTRIC ETCH | CARTER, JONATHAN LANGDON | 1713 | §102§103§112 | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18758576 | EDGE RING ARRANGEMENT WITH MOVEABLE EDGE RINGS | KLUNK, MARGARET D | — | §103DP | Non-Final OA | — | Pending | Jun 28, 2024 |
| 18724531 | METHOD FOR REDUCING VARIATIONS IN MASK TOPOGRAPHY | REMAVEGE, CHRISTOPHER | 1713 | §102§103 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18721457 | CONFORMAL SILICON OXIDE DEPOSITION USING AMINOSILANE AND CHLOROSILANE PRECURSORS | CHEN, BRET P | 1718 | §103 | Final Rejection | 84d | Pending | Jun 18, 2024 |
| 18719362 | HEXAPOD-BASED PEDESTAL SYSTEMS FOR USE IN SEMICONDUCTOR PROCESSING OPERATIONS | BESLER, CHRISTOPHER JAMES | — | §102§112 | Non-Final OA | — | Pending | Jun 13, 2024 |
| 18719047 | IMPROVED THERMAL AND ELECTRICAL INTERFACE BETWEEN PARTS IN AN ETCH CHAMBER | JELLETT, MATTHEW WILLIAM | — | §103 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18718751 | WAFER TRANSFER PADDLES WITH MINIMUM CONTACT AREA STRUCTURES FOR REDUCED BACKSIDE MARKING | JOERGER, KAITLIN S | — | §102§103 | Non-Final OA | — | Pending | Jun 11, 2024 |
| 18717059 | TUNGSTEN WORDLINE FILL IN HIGH ASPECT RATIO 3D NAND ARCHITECTURE | HOANG, DZUNG T | — | §103 | Non-Final OA | — | Pending | Jun 06, 2024 |
| 18716846 | LOW TEMPERATURE MOLYBDENUM DEPOSITION ASSISTED BY SILICON-CONTAINING REACTANTS | MILLER, MICHAEL G | — | §103 | Non-Final OA | — | Pending | Jun 05, 2024 |
| 18713068 | DEPOSITION OF HIGH COMPRESSIVE STRESS THERMALLY STABLE NITRIDE FILM | EMPIE, NATHAN H | 1712 | §103 | Non-Final OA | — | Pending | May 23, 2024 |
| 18711773 | CONTROL OF ETCH PROFILES IN HIGH ASPECT RATIO HOLES VIA THERMAL ATOMIC LAYER ETCHING | LU, JIONG-PING | 1713 | §102§103 | Non-Final OA | — | Pending | May 20, 2024 |
| 18710946 | SELECTIVE ETCH USING FLUOROCARBON-BASED DEPOSITION OF A METALLOID OR METAL | REMAVEGE, CHRISTOPHER | 1713 | §103DP | Non-Final OA | — | Pending | May 16, 2024 |
| 18709780 | CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF | HARRISTON, WILLIAM A | — | §102Other | Non-Final OA | — | Pending | May 13, 2024 |
| 18663014 | LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM | KIELIN, ERIK J | — | §102§103 | Non-Final OA | — | Pending | May 13, 2024 |
| 18708586 | NESTING ATMOSPHERIC ROBOT ARMS FOR HIGH THROUGHPUT | MCCLAIN, GERALD | 3652 | §103 | Final Rejection | — | Pending | May 08, 2024 |
| 18656209 | LOW-K ALD GAP-FILL METHODS AND MATERIAL | GHEYAS, SYED I | 2893 | §112 | Non-Final OA | — | Pending | May 06, 2024 |
| 18655124 | MULTI-LAYER FEATURE FILL | SARKAR, ASOK K | 2891 | DPOther | Non-Final OA | 70d | Pending | May 03, 2024 |
| 18654271 | SUBSTRATE SUPPORT WITH IMPROVED PROCESS UNIFORMITY | BENNETT, CHARLEE | 1718 | §102§103 | Non-Final OA | — | Pending | May 03, 2024 |
| 18706772 | SUBSTRATE PROCESSING TOOL WITH RAPID AND SELECTIVE CONTROL OF PARTIAL PRESSURE OF WATER VAPOR AND OXYGEN | MYERS, GLENN F | 3652 | §102§103 | Non-Final OA | — | Pending | May 02, 2024 |
| 18705428 | ATOMIC LAYER DEPOSITION SEAM REDUCTION | LEE, WOO KYUNG | — | §102§103 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18703982 | SHOWERHEAD WITH HOLE SIZES FOR RADICAL SPECIES DELIVERY | MILLER, JR, JOSEPH ALBERT | — | §103 | Non-Final OA | — | Pending | Apr 23, 2024 |
| 18702320 | EXTREME EDGE FEATURE PROFILE TILT CONTROL BY ALTERING INPUT VOLTAGE WAVEFORM TO EDGE RING | BRAYTON, JOHN JOSEPH | 1713 | §103 | Non-Final OA | — | Pending | Apr 17, 2024 |
| 18637111 | ELECTROSTATIC CHUCK (ESC) PEDESTAL VOLTAGE ISOLATION | CHAN, LAUREEN | 1716 | §102§103§112 | Non-Final OA | 3d overdue | Pending | Apr 16, 2024 |
| 18701429 | MODULATING THERMAL CONDUCTIVITY TO CONTROL COOLING OF SHOWERHEAD | CHEN, KEATH T | — | §102§103 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18701384 | SYSTEM AND METHOD FOR CARBON PLUG FORMATION | VU, HUNG K | — | §103 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18701439 | VALVE MANIFOLD FOR SEMICONDUCTOR PROCESSING | MCDONALD, RODNEY GLENN | — | §103 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18701458 | VALVE FOR SEMICONDUCTOR EQUIPMENT | PRICE, CRAIG JAMES | 3753 | §112 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18700642 | APPARATUSES AND SYSTEMS FOR AMMONIA/CHLORINE CHEMISTRY SEMICONDUCTOR PROCESSING | MILLER, JR, JOSEPH ALBERT | — | §102§103 | Non-Final OA | — | Pending | Apr 11, 2024 |
| 18626025 | HIGH ENERGY ATOMIC LAYER ETCHING | CULBERT, ROBERTS P | 1716 | DP | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18696299 | MULTI-STATION PROCESSING MODULE AND REACTOR ARCHITECTURE | MILLER, JR, JOSEPH ALBERT | — | §102§103§112 | Non-Final OA | — | Pending | Mar 27, 2024 |
| 18617587 | RING STRUCTURES AND SYSTEMS FOR USE IN A PLASMA CHAMBER | KENDALL, BENJAMIN R | 2896 | §103§112 | Final Rejection | — | Pending | Mar 26, 2024 |
| 18694949 | EDGE CAPACITIVELY COUPLED PLASMA CHAMBER STRUCTURE | CHAN, WEI | — | §103 | Non-Final OA | — | Pending | Mar 22, 2024 |
| 18612005 | ATOMIC LAYER DEPOSITION ON 3D NAND STRUCTURES | SMITH, BRADLEY | — | §103 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18612809 | PECVD DEPOSITION SYSTEM FOR DEPOSITION ON SELECTIVE SIDE OF THE SUBSTRATE | BALDWIN, GORDON | 1718 | §103§112Other | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18690678 | PROCESS GAS RAMP DURING SEMICONDUCTOR PROCESSING | QUINTO, KEVIN V | 2893 | §103§112 | Non-Final OA | — | Pending | Mar 08, 2024 |
| 18688678 | TECHNIQUES AND APPARATUSES FOR PROCESSING CHALCOGENIDES | KIM, SU C | 2899 | §103 | Non-Final OA | — | Pending | Mar 01, 2024 |
| 18684086 | SHOWERHEAD TO PEDESTAL GAPPING WITH DIFFERENTIAL CAPACITIVE SENSOR SUBSTRATE | VELEZ, ROBERTO | 2858 | §102§103 | Non-Final OA | 62d | Pending | Feb 15, 2024 |
| 18682869 | ION BEAM ETCH SYSTEM AND METHOD | SWEELY, KURT D | 1718 | §103 | Final Rejection | 56d | Pending | Feb 09, 2024 |
| 18682021 | SUBSTRATE PROCESSING SYSTEM INCLUDING RF MATCHING CIRCUIT FOR MULTI-FREQUENCY, MULTI-LEVEL, MULTI-STATE PULSING | KACKAR, RAM N | — | §103§112 | Non-Final OA | — | Pending | Feb 07, 2024 |
| 18682020 | AUTO BIT CHECK FOR PNEUMATIC VALVE VERIFICATION | WILLIAMS, JAMEL E | 2855 | §103 | Non-Final OA | — | Pending | Feb 07, 2024 |
| 18291444 | SUBSTRATE SUPPORTS WITH MESOCHANNEL ASSEMBLIES | NIEVES, NELSON J | 3763 | §103§112 | Non-Final OA | — | Pending | Jan 23, 2024 |
| 18580384 | SHOWERHEAD TEMPERATURE BASED DEPOSITION TIME COMPENSATION FOR THICKNESS TRENDING IN PECVD DEPOSITION SYSTEM | LUND, JEFFRIE ROBERT | 1716 | §102§103 | Non-Final OA | — | Pending | Jan 18, 2024 |
| 18572075 | IMAGE ANALYSIS OF PLASMA CONDITIONS | JIA, XIN | 2663 | §103 | Final Rejection | 22d | Pending | Dec 19, 2023 |
| 18570061 | IN-LINE MACHINE VISION SYSTEM FOR PART TRACKING OF SUBSTRATE PROCESSING SYSTEM | COLLINS, MICHAEL | 3655 | §103 | Final Rejection | 12d | Pending | Dec 13, 2023 |
| 18569100 | RADICAL-ACTIVATED CARBON FILM DEPOSITION | STARK, JARRETT J | 2898 | §102§103 | Final Rejection | — | Pending | Dec 11, 2023 |
| 18525539 | INTEGRATED WAFER BOW MEASUREMENTS | HANEY, NOAH JAMES | 2877 | §103 | Final Rejection | — | Pending | Nov 30, 2023 |
| 18560334 | BLADE-TYPE END EFFECTOR WITH ANGULAR COMPLIANCE MECHANISM | LAZO, THOMAS E | — | §102§103§112 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18559313 | MULTI-SECTIONAL PLASMA CONFINEMENT RING STRUCTURE | LEE, AIDEN Y | 1718 | §102§103§112 | Non-Final OA | — | Pending | Nov 06, 2023 |
| 18288144 | USE OF SIGNAL FILTERING SCHEMES IN HIGH TCR BASED CONTROL | BACHNER, ROBERT G | — | §101 | Non-Final OA | — | Pending | Oct 24, 2023 |
| 18493614 | DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF | CHEN, KEATH T | 1716 | §103§112 | Final Rejection | 10d overdue | Pending | Oct 24, 2023 |
| 18490265 | PROTECTIVE COATING FOR ELECTROSTATIC CHUCKS | VETERE, ROBERT A | 1712 | §103DP | Non-Final OA | — | Pending | Oct 19, 2023 |
| 18287372 | BACKSIDE DEPOSITION PREVENTION ON SUBSTRATES | PENCE, JETHRO M | 1717 | §103§112 | Non-Final OA | — | Pending | Oct 18, 2023 |
| 18554622 | CONTROL OF DISSOLVED GAS CONCENTRATION IN ELECTROPLATING BATHS | FORRY, COLTON BUSA | — | §103 | Non-Final OA | — | Pending | Oct 09, 2023 |
| 18550664 | ADJUSTABLE DIELECTRIC CONSTANT CERAMIC WINDOW | SWEELY, KURT D | 1718 | §103 | Non-Final OA | — | Pending | Sep 14, 2023 |
| 18282021 | CONDUCTIVE COOLING OF A LOW TEMPERATURE PEDESTAL OPERATING IN A HIGH TEMPERATURE DEPOSITION SEQUENCE | BERMAN, JASON | 1794 | §102§103§112 | Final Rejection | 16d overdue | Pending | Sep 14, 2023 |
| 18546879 | HALOGEN-AND ALIPHATIC-CONTAINING ORGANOTIN PHOTORESISTS AND METHODS THEREOF | WALKE, AMANDA C | 1722 | §103 | Non-Final OA | — | Pending | Aug 17, 2023 |
| 18261734 | SPATIALLY AND DIMENSIONALLY NON-UNIFORM CHANNELLED PLATE FOR TAILORED HYDRODYNAMICS DURING ELECTROPLATING | WITTENBERG, STEFANIE S | 1795 | §103 | Non-Final OA | — | Pending | Jul 17, 2023 |
| 18261485 | ELECTROCHEMICAL ASSEMBLY FOR FORMING SEMICONDUCTOR FEATURES | WITTENBERG, STEFANIE S | 1795 | §102§103 | Non-Final OA | — | Pending | Jul 14, 2023 |
| 18221244 | PREVENTING DEPOSITION ON PEDESTAL IN SEMICONDUCTOR SUBSTRATE PROCESSING | MCDONALD, RODNEY GLENN | 1794 | §102§103 | Non-Final OA | — | Pending | Jul 12, 2023 |
| 18265825 | ATOMIC LAYER DEPOSITION WITH MULTIPLE UNIFORMLY HEATED CHARGE VOLUMES | THOMAS, BINU | 1717 | §102§103 | Final Rejection | 30d overdue | Pending | Jun 07, 2023 |
| 18037537 | PROCESS KIT DE-BUBBLING | RUFO, LOUIS J | 1795 | §102§112 | Final Rejection | — | Pending | May 17, 2023 |
| 18251977 | PREDICTIVE MAINTENANCE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT | BACA, MATTHEW WALTER | 2857 | §101 | Final Rejection | — | Pending | May 05, 2023 |
| 18035200 | PEDESTAL INCLUDING SEAL | CHEN, KEATH T | 1716 | §103 | Final Rejection | 3d overdue | Pending | May 03, 2023 |
| 18034635 | CERAMIC COMPONENT WITH CHANNELS | REYES, JOSHUA NATHANIEL PI | 1718 | §102§103§112Other | Non-Final OA | — | Pending | Apr 28, 2023 |
| 18250349 | LOCALIZED PLASMA ARC PREVENTION VIA PURGE RING | CHEN, KEATH T | 1716 | §103§112 | Non-Final OA | 30d overdue | Pending | Apr 24, 2023 |
| 18029963 | SHOWERHEAD WITH INTEGRAL DIVERT FLOW PATH | ZERVIGON, RUDY | 1716 | §102§103 | Non-Final OA | 47d | Pending | Apr 03, 2023 |
| 18247060 | DEPOSITION RATE ENHANCEMENT OF AMORPHOUS CARBON HARD MASK FILM BY PURELY CHEMICAL MEANS | TUROCY, DAVID P | 1718 | §103§112 | Final Rejection | 100d overdue | Pending | Mar 28, 2023 |
| 18246849 | COATED CONDUCTOR FOR HEATER EMBEDDED IN CERAMIC | WOLCOTT, BRIAN P | 3711 | §102§103§112 | Non-Final OA | 23d overdue | Pending | Mar 27, 2023 |
| 18026431 | AXIALLY COOLED METAL SHOWERHEADS FOR HIGH TEMPERATURE PROCESSES | LEE, AIDEN Y | 1718 | §103 | Final Rejection | 31d overdue | Pending | Mar 15, 2023 |
| 18044336 | TEMPORARY CAPPING MATERIAL FOR OXIDE PREVENTION IN LOW TEMPERATURE DIRECT METAL-METAL BONDING | PHAM, THOMAS T | 1713 | §103§112 | Non-Final OA | 60d overdue | Pending | Mar 07, 2023 |
| 18042198 | C-shroud Modification For Plasma Uniformity Without Impacting Mechanical Strength Or Lifetime Of The C-shroud | SWEELY, KURT D | 1718 | §103 | Non-Final OA | — | Pending | Feb 17, 2023 |
| 18006552 | LOW CEILING TEMPERATURE HOMOPOLYMERS AS SACRIFICIAL PROTECTION LAYERS FOR ENVIRONMENTALLY SENSITIVE SUBSTRATES | KIELIN, ERIK J | 2814 | §103 | Non-Final OA | 48d | Pending | Jan 23, 2023 |
| 18005571 | METAL CHELATORS FOR DEVELOPMENT OF METAL-CONTAINING PHOTORESIST | ANGEBRANNDT, MARTIN J | 1737 | §102§103§112DPOther | Non-Final OA | — | Pending | Jan 13, 2023 |
| 18005594 | PHOTORESISTS FROM SN(II) PRECURSORS | CHU, JOHN S Y | 1737 | §103 | Non-Final OA | — | Pending | Jan 13, 2023 |
| 18013768 | SUBSTRATE SUPPORT WITH UNIFORM TEMPERATURE ACROSS A SUBSTRATE | FREY, KIMBERLY NEWMAN | 2817 | §102§103 | Non-Final OA | 7d | Pending | Dec 29, 2022 |
| 18013736 | HYBRID LIQUID/AIR COOLING SYSTEM FOR TCP WINDOWS | SWEELY, KURT D | 1718 | §103 | Non-Final OA | — | Pending | Dec 29, 2022 |
| 18013742 | FRICTION STIR PROCESSING FOR CORROSION RESISTANCE | STONER, KILEY SHAWN | 1735 | §103§112 | Final Rejection | 12d | Pending | Dec 29, 2022 |
| 18013475 | CONTROLLING TEMPERATURE PROFILES OF PLASMA CHAMBER COMPONENTS USING STRESS ANALYSIS | KACKAR, RAM N | 1716 | §103§112 | Non-Final OA | — | Pending | Dec 28, 2022 |
| 18013480 | PLASMA DISCHARGE UNIFORMITY CONTROL USING MAGNETIC FIELDS | CHAN, LAUREEN | 1716 | §103§112 | Non-Final OA | — | Pending | Dec 28, 2022 |
| 18013477 | ADJUSTABLE GEOMETRY TRIM COIL | KENDALL, BENJAMIN R | 2896 | §102§103 | Non-Final OA | — | Pending | Dec 28, 2022 |
| 18013347 | DELIVERY OF HIGH CONCENTRATIONS OF MOLECULAR HYDROGEN AND OTHER GASES TO SUBSTRATE PROCESSING SYSTEMS | SWEELY, KURT D | 1718 | §102§103 | Non-Final OA | — | Pending | Dec 28, 2022 |
| 18013429 | MOVABLE DISK WITH APERTURE FOR ETCH CONTROL | KENDALL, BENJAMIN R | 2896 | §103 | Non-Final OA | 2d overdue | Pending | Dec 28, 2022 |
| 18013161 | SUBSTRATE TRANSFER DOOR ASSEMBLIES WITH RADIATING ELEMENTS FOR SUBSTRATE PROCESSING CHAMBERS | DANG, KET D | 3761 | §102§103 | Non-Final OA | — | Pending | Dec 27, 2022 |
| 18003139 | INTEGRATION OF VAPOR DEPOSITION PROCESS INTO PLASMA ETCH REACTOR | SWEELY, KURT D | 1718 | §102§103 | Final Rejection | — | Pending | Dec 22, 2022 |
| 18003137 | LOW RESISTANCE GATE OXIDE METALLIZATION LINER | TRAN, TIEN | 2812 | §103 | Non-Final OA | 14d | Pending | Dec 22, 2022 |
| 18002733 | ACCURATE DETERMINATION OF RADIO FREQUENCY POWER THROUGH DIGITAL INVERSION OF SENSOR EFFECTS | GEISS, BRIAN BUTLER | 2857 | §103 | Non-Final OA | — | Pending | Dec 21, 2022 |
| 18011707 | DRY BACKSIDE AND BEVEL EDGE CLEAN OF PHOTORESIST | FORD, NATHAN K | 1716 | §103 | Final Rejection | — | Pending | Dec 20, 2022 |
| 18010423 | OPTIMIZING EDGE RADICAL FLUX IN A DOWNSTREAM PLASMA CHAMBER | KENDALL, BENJAMIN R | 2896 | §103 | Non-Final OA | — | Pending | Dec 14, 2022 |
| 17927297 | ATOMIC LAYER DEPOSITION COATED POWDER COATING FOR PROCESSING CHAMBER COMPONENTS | KENDALL, BENJAMIN R | 2896 | §102§103 | Final Rejection | 45d overdue | Pending | Nov 22, 2022 |
| 17924618 | EVAPORATIVE COOLING OF ELECTROSTATIC CHUCKS | NUCKOLS, TIFFANY Z | 1716 | §102§103 | Final Rejection | — | Pending | Nov 10, 2022 |
| 17916852 | SLIDE AND PIVOT ASSEMBLIES FOR PROCESS MODULE BIAS ASSEMBLIES OF SUBSTRATE PROCESSING SYSTEMS | BURKMAN, JESSICA LYNN | 3653 | §103 | Non-Final OA | — | Pending | Oct 04, 2022 |
| 17995461 | LOSS PREVENTION DURING ATOMIC LAYER DEPOSITION | FAYETTE, NATHALIE RENEE | 2812 | §103 | Final Rejection | 22d | Pending | Oct 04, 2022 |
| 17915573 | EDGE RING FOR LOCALIZED DELIVERY OF TUNING GAS | REYES, JOSHUA NATHANIEL PI | 1718 | §103 | Final Rejection | 14d | Pending | Sep 29, 2022 |
| 17948350 | ULTRAHIGH SELECTIVE NITRIDE ETCH TO FORM FINFET DEVICES | PHAM, THOMAS T | 1713 | §103 | Non-Final OA | — | Pending | Sep 20, 2022 |
| 17907959 | REACTANT GAS PULSE DELIVERY | LAW, NGA LEUNG V | 1717 | §103§112 | Final Rejection | 147d overdue | Pending | Aug 29, 2022 |
| 17799866 | HIGH TEMPERATURE SUBSTRATE SUPPORT WITH HEAT SPREADER | LEE, AIDEN Y | 1718 | §102§103§112 | Non-Final OA | — | Pending | Aug 15, 2022 |
| 17904005 | COOLING PLATE FOR SEMICONDUCTOR PROCESSING CHAMBER WINDOW | FORD, NATHAN K | 1716 | §103 | Non-Final OA | 29d overdue | Pending | Aug 10, 2022 |
| 17795843 | ETCHING AND PLASMA UNIFORMITY CONTROL USING MAGNETICS | KACKAR, RAM N | 1716 | §102§103§112 | Non-Final OA | — | Pending | Jul 27, 2022 |
| 17793366 | Optimization of Radiofrequency Signal Ground Return in Plasma Processing System | KLUNK, MARGARET D | 1716 | §103§112 | Non-Final OA | — | Pending | Jul 15, 2022 |
| 17792996 | ALLOY FILM ETCH | ANGUIANO, MICHAEL | 2899 | §102§103 | Non-Final OA | — | Pending | Jul 14, 2022 |
| 17790009 | MIXED METAL BASEPLATES FOR IMPROVED THERMAL EXPANSION MATCHING WITH THERMAL OXIDE SPRAYCOAT | MACARTHUR, SYLVIA | 1716 | §103 | Final Rejection | 37d overdue | Pending | Jun 29, 2022 |
| 17781447 | PRESSURE BATCH COMPENSATION TO STABILIZE CD VARIATION FOR TRIM AND DEPOSITION PROCESSES | ZERVIGON, RUDY | 1716 | §102§103 | Final Rejection | 317d overdue | Pending | Jun 01, 2022 |
| 17774521 | FREQUENCY BASED IMPEDANCE ADJUSTMENT IN TUNING CIRCUITS | FORD, NATHAN K | 1716 | §103 | Non-Final OA | — | Pending | May 05, 2022 |
| 17671211 | MOVEABLE EDGE RINGS WITH REDUCED CAPACITANCE VARIATION FOR SUBSTRATE PROCESSING SYSTEMS | MCCONNELL, AARON R | 3723 | §103 | Final Rejection | 16d overdue | Pending | Feb 14, 2022 |
| 17631984 | EDGE RING SYSTEMS FOR SUBSTRATE PROCESSING SYSTEMS | MOORE, KARLA A | 1716 | §103 | Final Rejection | 150d overdue | Pending | Feb 01, 2022 |
| 17620201 | USE OF ROTATION TO CORRECT FOR AZIMUTHAL NON-UNIFORMITIES IN SEMICONDUCTOR SUBSTRATE PROCESSING | MILLS JR., JOE E | 3761 | §102§103 | Non-Final OA | — | Pending | Dec 17, 2021 |
| 17419841 | METAL ATOMIC LAYER ETCH AND DEPOSITION APPARATUSES AND PROCESSES WITH METAL-FREE LIGANDS | FORD, NATHAN K | 1716 | §103§112 | Non-Final OA | — | Pending | Jun 30, 2021 |
| 18874572 | SYSTEM FOR PROCESSING WAFER-SHAPED ARTICLES | MCCLAIN, GERALD | — | §102§103§112 | Non-Final OA | — | Pending | Dec 12, 2024 |
| 18572355 | DEVICE FOR HOLDING A WAFER-SHAPED ARTICLE | ZAWORSKI, JONATHAN R | 3723 | §102§103§112 | Final Rejection | 45d overdue | Pending | Dec 20, 2023 |
| 18032397 | APPARATUS FOR PROCESSING A WAFER-SHAPED ARTICLE | KLUNK, MARGARET D | 1716 | §102§103 | Non-Final OA | — | Pending | Apr 18, 2023 |
| 18028957 | APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES | WILCZEWSKI, MARY A | 2898 | §102§103§112 | Non-Final OA | — | Pending | Mar 28, 2023 |
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