Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1713 1724 1756 1794 1795
This examiner grants 63% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18597432 | SENSOR APPARATUS, PLASMA PROCESSING APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18520360 | PLASMA MONITORING SYSTEM | Non-Final OA | Samsung Display Co., LTD. |
| 18417549 | PLASMA MULTI-WAFER ASHING SYSTEM | Non-Final OA | Rockwell Collins, Inc. |
| 18691276 | WAFER PROCESSING APPARATUS | Non-Final OA | HITACHI HIGH-TECH CORPORATION |
| 18411398 | COMPONENT FOR SEMICONDUCTOR PRODUCTION APPARATUS AND METHOD FOR PRODUCING SUCH COMPONENT | Non-Final OA | AGC Inc. |
| 18939220 | DUAL COLLIMATOR PHYSICAL VAPOR DEPOSITIONS PROCESSING CHAMBER | Final Rejection | Applied Materials, Inc. |
| 18144747 | HIGH EFFICIENCY MICROWAVE PLASMA APPLICATOR | Final Rejection | Applied Materials, Inc, |
| 18144745 | MICROWAVE PLASMA APPLICATOR WITH REPLACEABLE DIELECTRIC PLATE | Final Rejection | Applied Materials, Inc. |
| 18639975 | PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT BODY | Non-Final OA | Tokyo Electron Limited |
| 18518696 | PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT | Non-Final OA | Tokyo Electron Limited |
| 18383637 | SUBSTRATE PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18612425 | SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 18980228 | ARTICLES COATED WITH CRACK-RESISTANT FLUORO-ANNEALED FILMS AND METHODS OF MAKING | Non-Final OA | ENTEGRIS, INC. |
| 18701439 | VALVE MANIFOLD FOR SEMICONDUCTOR PROCESSING | Non-Final OA | Lam Research Corporation |
| 18221244 | PREVENTING DEPOSITION ON PEDESTAL IN SEMICONDUCTOR SUBSTRATE PROCESSING | Non-Final OA | LAM RESEARCH CORPORATION |
| 18871809 | GALLIUM NITRIDE SINTERED BODY AND METHOD FOR PRODUCING THE SAME | Final Rejection | TOSOH CORPORATION |
| 19017900 | HIGH PURITY SULFUR-DOPED COPPER SPUTTERING TARGET ASSEMBLY AND METHOD FOR PRODUCING SAME | Non-Final OA | TOSOH SMD, INC. |
| 18562072 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | Non-Final OA | SCREEN Holdings Co., Ltd. |
| 19012216 | Method for producing a coated object and coated object | Final Rejection | Kennametal Inc. |
| 18021537 | CHARGED-PARTICLE INSPECTION APPARATUS | Final Rejection | ASML Netherlands B.V. |
| 18492149 | SUBSTRATE TREATMENT APPARATUS USING SUPERCRITICAL FLUID | Final Rejection | SEMES CO., LTD. |
| 18679972 | Perpendicular MR SAF | Non-Final OA | Allegro MicroSystems, LLC |
| 18704378 | SUSCEPTOR | Non-Final OA | POINT ENGINEERING CO., LTD. |
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