Tech Center 1700 • Art Units: 1724 1756 1794 1795
This examiner grants 63% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18469590 | APPARATUS AND METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18971510 | MULTICATHODE PVD SYSTEM FOR HIGH ASPECT RATIO BARRIER SEED DEPOSITION | Non-Final OA | Applied Materials, Inc. |
| 18484767 | GAS FLOW IMPROVEMENT FOR PROCESS CHAMBER | Non-Final OA | Applied Materials, Inc. |
| 18144745 | MICROWAVE PLASMA APPLICATOR WITH REPLACEABLE DIELECTRIC PLATE | Non-Final OA | Applied Materials, Inc. |
| 18144747 | HIGH EFFICIENCY MICROWAVE PLASMA APPLICATOR | Non-Final OA | Applied Materials, Inc, |
| 18108432 | TRANSFER APPARATUS, AND RELATED COMPONENTS AND METHODS, FOR TRANSFERRING SUBSTRATES | Non-Final OA | Applied Materials, Inc. |
| 18099277 | COMPOSITE PVD TARGETS | Final Rejection | Applied Materials, Inc. |
| 18959678 | FILM FORMING APPARATUS | Non-Final OA | SUMITOMO HEAVY INDUSTRIES, LTD. |
| 19010611 | SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18327590 | PLASMA PROCESSING APPARATUS AND METHOD | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18518696 | PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT | Non-Final OA | Tokyo Electron Limited |
| 18383637 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18359275 | SYSTEMS AND METHODS FOR DEPOSITING METAL | Non-Final OA | Tokyo Electron Limited |
| 19033192 | METHOD AND APPARATUS FOR METAL AND CERAMIC NANOLAYERING FOR ACCIDENT TOLERANT NUCLEAR FUEL, PARTICLE ACCELERATORS, AND AEROSPACE LEADING EDGES | Non-Final OA | Starfire Industries LLC |
| 19001089 | DEPOSITION SYSTEM AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 19017900 | HIGH PURITY SULFUR-DOPED COPPER SPUTTERING TARGET ASSEMBLY AND METHOD FOR PRODUCING SAME | Non-Final OA | TOSOH SMD, INC. |
| 18109003 | HIGH PURITY SULFUR-DOPED COPPER SPUTTERING TARGET ASSEMBLY AND METHOD FOR PRODUCING SAME | Non-Final OA | TOSOH SMD, INC. |
| 18992526 | Co-Cr-Pt-OXIDE-BASED SPUTTERING TARGET | Non-Final OA | TANAKA PRECIOUS METAL TECHNOLOGIES, LTD. |
| 19012216 | Method for producing a coated object and coated object | Non-Final OA | Kennametal Inc. |
| 18090242 | APPARATUS AND METHOD FOR PERFORMING PLASMA ENHANCED ATOMIC LAYER DEPOSITION EMPLOYING VERY HIGH FREQUENCY | Final Rejection | AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION |
| 18513560 | SUBSTRATE TREATING APPARATUS AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME | Non-Final OA | SEMES CO., LTD. |
| 18492149 | SUBSTRATE TREATMENT APPARATUS USING SUPERCRITICAL FLUID | Non-Final OA | SEMES CO., LTD. |
| 18021537 | CHARGED-PARTICLE INSPECTION APPARATUS | Non-Final OA | ASML Netherlands B.V. |
| 18872170 | METHOD FOR CONTROLLING SPECIFIC RESISTIVITY AND STRESS OF TUNGSTEN THROUGH PVD SPUTTERING METHOD | Non-Final OA | ULVAC, INC. |
| 18100238 | CHEMICAL VAPOR INFILTRATION APPARATUS AND ASSEMBLY FOR GAS INFLOW IN REACTION CHAMBER | Non-Final OA | Zimmer, Inc. |
| 18868585 | ELECTRON BEAM DEVICE FOR SURFACE TREATMENT | Non-Final OA | CAMECA |
| 18866558 | METALLIC SPUTTERING TARGET, PRODUCTION METHOD THEREFOR, AND METALLIC MATERIAL AND PRODUCTION METHOD THEREFOR | Non-Final OA | TOSOH CORPORATION |
| 18247724 | SPARK PLASMA SINTERED COMPONENT FOR PLASMA PROCESSING CHAMBER | Non-Final OA | Lam Research Corporation |
| 18393836 | SYSTEMS AND METHODS FOR UNIFORM COATING OF ROLLING SPHERES | Non-Final OA | Lawrence Livermore National Security, LLC |
| 17776806 | METHOD OF DEPOSITING MATERIAL ON A SUBSTRATE | Non-Final OA | Dyson Technology Limited |
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