Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1713 1724 1753 1756 1794 1795
This examiner grants 64% of resolved cases
Rodney Glenn McDonald is a high-volume examiner in Tech Center 1700 and Art Unit 1713, with 1278 resolved cases. The examiner has an allowance rate of 63.6%, which is moderately high and favorable for applicants. This 63.6% rate suggests that a majority of applications handled by this examiner result in a grant. The large sample size of 1278 cases makes this a very reliable metric for practitioners in Art Unit 1713.
The interview lift is 24.3%, indicating that direct communication with the examiner is a productive way to increase the likelihood of allowance. An interview provides a meaningful boost to the 63.6% baseline. The median days to allowance is 1227, representing a moderate and efficient prosecution cycle. This 1227-day timeline is consistent with expectations for this tech center. For those appearing before this examiner, the combination of a 63.6% allowance rate and a 24.3% interview lift suggests that proactive engagement can effectively navigate the 1227-day path to issuance. The 1278 resolved cases demonstrate a consistent and predictable examination style in Tech Center 1700.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18520360 | PLASMA MONITORING SYSTEM | Non-Final OA | Samsung Display Co., LTD. |
| 18417549 | PLASMA MULTI-WAFER ASHING SYSTEM | Non-Final OA | Rockwell Collins, Inc. |
| 18807038 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Non-Final OA | Kioxia Corporation |
| 18704173 | DEGAS SYSTEM USING INERT PURGE GAS AT CONTROLLED PRESSURE FOR A LIQUID DELIVERY SYSTEM OF A SUBSTRATE PROCESSING SYSTEM | Non-Final OA | LAM RESEARCH CORPORATION |
| 19230034 | PHYSICAL VAPOR DEPOSITION (PVD) WITH TARGET EROSION PROFILE MONITORING | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18327590 | PLASMA PROCESSING APPARATUS AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18939220 | DUAL COLLIMATOR PHYSICAL VAPOR DEPOSITIONS PROCESSING CHAMBER | Final Rejection | Applied Materials, Inc. |
| 18655748 | THIN FILM, IN-SITU MEASUREMENT THROUGH TRANSPARENT CRYSTAL AND TRANSPARENT SUBSTRATE WITHIN PROCESSING CHAMBER WALL | Non-Final OA | Applied Materials, Inc. |
| 18407142 | HEATERS AND PLASMA GENERATORS FOR GAS ACTIVATION, AND RELATED CHAMBER AND FOR SEMICONDUCTOR MANUFACTURING | Non-Final OA | Applied Materials, Inc. |
| 18391176 | ELECTRODE CONFIGURATIONS AND MAGNET CONFIGURATIONS FOR PROCESSING CHAMBERS, AND RELATED METHODS AND APPARATUS, FOR SEMICONDUCTOR MANUFACTURING | Non-Final OA | Applied Materials, Inc. |
| 18144747 | HIGH EFFICIENCY MICROWAVE PLASMA APPLICATOR | Final Rejection | Applied Materials, Inc, |
| 18887050 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18518696 | PLASMA PROCESSING APPARATUS AND SUBSTRATE SUPPORT | Non-Final OA | Tokyo Electron Limited |
| 18612425 | SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 18411398 | COMPONENT FOR SEMICONDUCTOR PRODUCTION APPARATUS AND METHOD FOR PRODUCING SUCH COMPONENT | Non-Final OA | AGC Inc. |
| 18612678 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Non-Final OA | SHIBAURA MECHATRONICS CORPORATION |
| 18021537 | CHARGED-PARTICLE INSPECTION APPARATUS | Non-Final OA | ASML Netherlands B.V. |
| 18916864 | SHOWERHEAD ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS COMPRISING THE SAME | Non-Final OA | SEMES CO., LTD. |
| 18513560 | SUBSTRATE TREATING APPARATUS AND SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME | Final Rejection | SEMES CO., LTD. |
| 18492149 | SUBSTRATE TREATMENT APPARATUS USING SUPERCRITICAL FLUID | Final Rejection | SEMES CO., LTD. |
| 19012216 | Method for producing a coated object and coated object | Final Rejection | Kennametal Inc. |
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