DETAILED ACTION
This Office action responds to the application filed on 07/28/2023.
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . In the event the determination of the status of the application as subject to AIA is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for a rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
Election/Restrictions
Applicant’s election without traverse of Species 1, reading on figures 1a-c, in the reply filed on November 25, 2025, is acknowledged. The applicant indicates that claims 1-20 read on the elected species. The examiner disagrees.
The limitation “wherein the elevations of the end portions of the seed layers gradually decreases along a direction toward the conductive via with respect to the bottom surface of the conductive via” recited in Claim 13 reads on figure 2a of non-elected species 2a.
In figure 2a of species 2a, the end portions of the plurality of seed layers 311-312 decrease as approaching the conductive via. In figure 1b of species 1, the end portions of the plurality of seed layers 311-313 increase and then decrease as approaching the conductive via.
Accordingly, claim 13 is withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected species, there being no allowable generic or linking claim.
Claims 1-12 & 14-20 will be examined in this Office action.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claim 17 is rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Claim 17 recites the limitation "the second end portion" in line 8. There is insufficient antecedent basis for this limitation in the claim.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claims 1-9, 11, 14, 15, & 18-20 are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Arvin (US 20170162536).
Regarding Claim 1, Arvin (see, e.g., fig. 6) shows a bond structure, comprising:
a seed layer 135 (see, e.g., para.0029);
and a conductive structure comprising
a via portion 150 (see, e.g., para.0030) over the seed layer
and a plurality of wires 170 (see, e.g., para.0030) protruding from the via portion.
Regarding Claim 2, Arvin (see, e.g., annotated figure 6) shows the bond structure in claim 1,
wherein the seed layer 135 laterally covers at least one lateral surface of the via portion 150 (vertical left or right surfaces).
Regarding Claim 3, Arvin (see, e.g., annotated figure 6) shows the bond structure in claim 2,
wherein an end portion of the seed layer 135 (top right corner) is outside of a vertical projection of the plurality of wires 170,
wherein the vertical projection is along a direction or axis perpendicular to at least one of a surface of the seed layer 135 or a surface of the via portion.
Regarding Claim 4, Arvin (see, e.g., annotated figure 6) shows the bond structure in claim 2,
wherein one of the plurality of wires 170 comprises an end portion connected to the via portion 150 and at an elevation respect to a bottom surface of the via portion 150 higher than an elevation of a top end portion of the seed layer with respect to the bottom surface of the via portion.
Regarding Claim 5, Arvin (see, e.g., fig. 7) shows the bond structure in claim 1, further comprising
a dielectric layer 250 (see, e.g., para.0032) laterally encapsulating
at least one lateral surface of the via portion and at least one lateral surface of the plurality of wires (see, e.g., fig. 7).
Regarding Claim 6, Arvin (see, e.g., annotated figure 7) shows the bond structure in claim 5,
wherein a portion of the dielectric layer 250 (vertically between 210 & 150) vertically overlaps a portion of the seed layer 135 along a direction or axis perpendicular to at least one of a surface of the seed layer 135 or a surface of the via portion 150.
Regarding Claim 7, Arvin (see, e.g., annotated figure 7) shows the bond structure in claim 6,
wherein a space (portion of 150) is formed between the dielectric layer 250 and the seed layer 135.
Since the claim limitation “a space” does not have a specific definition in the art, under broadest reasonable interpretation Examiner interprets any space between the dielectric layer 250 and the seed layer 135 as anticipating the limitation (see, e.g., annotated figure 7). Thus, Arvin anticipates claim 7.
Regarding Claim 8, Arvin (see, e.g., fig. 7) shows the bond structure in claim 6,
wherein the dielectric layer directly contacts a lateral surface of one of the plurality of wires.
Regarding Claim 9, Arvin (see, e.g., fig. 6, fig. 7) shows a bond structure, comprising:
a conductive structure comprising
a conductive via 150 (see, e.g., para.0026) and a plurality of wires 170 (see, e.g., para.0030) extending from the conductive via;
and a seed layer structure 135 (see, e.g., para.0029) on a lateral surface of the conductive via,
wherein the seed layer structure comprises a first material different from a second material of the wires (see, e.g., para.0024, para.0026).
Regarding Claim 11, Arvin (see, e.g., annotated figure 6) shows the bond structure in claim 9,
wherein the plurality of wires 170 extend from a top surface of the conductive via 150,
and a top end of the seed layer structure 135 (top right corner) with respect to a bottom surface of the conductive via is lower than the top surface of the conductive via (surface near 170) with respect to the bottom surface of the conductive via.
Regarding Claim 14, Arvin (see, e.g., fig. 6, fig. 7) shows a bond structure, comprising:
a first conductive structure comprising
a first via portion 150 (see, e.g., para.0026)
and a plurality of first wires 170 (see, e.g., para.0030) extending from the first via portion;
a second conductive structure 210 & 220 (see, e.g., para.0030) over the first conductive structure and electrically connected to the first conductive structure via the first wires;
and a dielectric layer 250 (see, e.g., para.0032) laterally covering the first wires and comprising
a first portion 250 (vertically between 210 & 150) contacting a portion of a lateral surface of one of the first wires 170 (leftmost or rightmost surface, see, e.g., annotated figure 7).
Regarding Claim 15, Arvin (see, e.g., fig. 7) shows the bond structure in claim 14,
wherein the second conductive structure comprises a plurality of second wires 220 (see, e.g., para.0030) electrically connected to the plurality of first wires,
and the dielectric layer laterally covers the plurality of second wires (see, e.g., fig. 7).
Regarding Claim 18, Arvin (see, e.g., annotated figure 7) shows the bond structure in claim 14,
wherein the dielectric layer 250 comprises a second portion P2 spaced apart from the plurality of first wires.
Regarding the limitation “the dielectric layer 250 comprises a second portion,” Examiner interprets any portion of the dielectric layer other than the first portion 250 (vertically between 210 & 150) as the second portion P2.
Regarding Claim 19, Arvin (see, e.g., annotated figure 7) shows the bond structure in claim 18,
wherein the second portion of the dielectric layer P2 is closer to the first via portion 150 than the first portion of the dielectric layer 250 (vertically between 210 & 150) is to the first via portion 150.
Regarding Claim 20, Arvin (see, e.g., annotated figure 7) shows the bond structure in claim 14,
wherein a portion of the first wires 170 (middle portion) in a region over a central area of the first via portion 150 are spaced apart from the dielectric layer.
Claims 9-12, & 14-16 are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Hsu (US 20240063159).
Regarding Claim 9, Hsu (see, e.g., fig. 1a) shows a bond structure, comprising:
a conductive structure comprising
a conductive via 11 (see, e.g., para.0036-0037) and a plurality of wires 12 (see, e.g., para.0039) extending from the conductive via;
and a seed layer structure 10s (see, e.g., para.0035) on a lateral surface of the conductive via,
wherein the seed layer structure comprises a first material different from a second material of the wires (see, e.g., para.0035, para.0042).
Regarding Claim 10, Hsu (see, e.g., annotated figure 1a) shows the bond structure in claim 9,
wherein a portion of the lateral surface of the conductive via 11 (vertical right surface) is exposed by the seed layer structure 10s.
Regarding Claim 11, Hsu (see, e.g., annotated figure 1a) shows the bond structure in claim 9,
wherein the plurality of wires 12 extend from a top surface of the conductive via 11,
and a top end of the seed layer structure 10s (uppermost surface)with respect to a bottom surface of the conductive via 11 is lower than the top surface of the conductive via with respect to the bottom surface of the conductive via (see, e.g., annotated figure 1a).
Regarding Claim 12, Hsu (see, e.g., fig. 1a, annotated figure 1a, para.0035) shows the bond structure in claim 11,
wherein the seed layer structure comprises a plurality of seed layers 10s1 & 10s2 having end portions at different elevations with respect to the bottom surface of the conductive via (see, e.g., annotated figure 1a).
Regarding Claim 14, Hsu (see, e.g., fig. 1a) shows a bond structure, comprising:
a first conductive structure comprising
a first via portion 11 (see. e.g., para.0036-0037)
and a plurality of first wires 12 (see, e.g., para.0039) extending from the first via portion;
a second conductive structure 13s, 14, 15i, & 15 over the first conductive structure and electrically connected to the first conductive structure via the first wires;
and a dielectric layer 16 (see, e.g., para0056) laterally covering the first wires and comprising
a first portion contacting a portion of a lateral surface of one of the first wires (see, e.g., fig. 1a).
Regarding Claim 15, Hsu (see, e.g., fig. 1a, para.0048) shows the bond structure in claim 14,
wherein the second conductive structure comprises a plurality of second wires 15 (see, e.g., para.0048) electrically connected to the plurality of first wires,
and the dielectric layer laterally covers the plurality of second wires (see, e.g., fig. 1a).
Regarding Claim 16, Hsu (see, e.g., fig. 1a, annotated figure 1a) shows the bond structure in claim 15,
wherein the dielectric layer 16 vertically overlaps a portion of the plurality of first wires 12 or a portion of the plurality of second wires 15 (see, e.g., annotated figure 1a).
Allowable Subject Matter
Claim 17 is objected to as being dependent upon a rejected base claim. Claim 17 would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims, and the claim is revised to overcome the 112 (b) rejection in paragraphs 6-9 of this Office action.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to FERNANDO JOSE RAMOS-DIAZ whose telephone number is (571) 270-5855. The examiner can normally be reached Mon-Fri 8am-5pm.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Wael Fahmy can be reached on 571-272-1705. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/F.R.D./ Examiner, Art Unit 2814
Examiner, Art Unit 2814
/WAEL M FAHMY/Supervisory Patent Examiner, Art Unit 2814