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Last updated: August 17, 2026

Examiner: RAMOS-DIAZ, FERNANDO JOSE

Tech Center 4100 • Art Units: 2814 2818 4100

This examiner grants 81% of resolved cases

Performance Statistics

81.3%

Allow Rate

+21.3% vs TC avg

59

Total Applications

+3.3%

Interview Lift

1197

Avg Prosecution Days

Based on 16 resolved cases, 2023–2026

Rejection Statute Breakdown

0%

§101 Eligibility

39.4%

§102 Novelty

46.3%

§103 Obviousness

14.3%

§112 Clarity

Currently Pending Office Actions

App #	Title	Status	Assignee
18593359	SEMICONDUCTOR PACKAGES AND SUBSTRATES FOR PACKAGES	Non-Final OA	SAMSUNG ELECTRONICS CO., LTD.
18375812	SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME	Non-Final OA	Samsung Electronics Co., Ltd.
18236143	SEMICONDUCTOR DEVICE	Non-Final OA	Samsung Electronics Co., Ltd.
18330657	INTEGRATED CIRCUIT DEVICE INCLUDING MULTI-LAYER INTERCONNECT PILLAR	Final Rejection	QUALCOMM Incorporated
18391692	ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF	Non-Final OA	InnoLux Corporation
18060080	INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES	Non-Final OA	Intel Corporation
17707708	GLASS SUBSTRATE PACKAGE WITH HYBRID BONDED DIE	Non-Final OA	Intel Corporation
18233863	MULTI-DIE PACKAGE ON PACKAGE	Non-Final OA	MEDIATEK INC.
17582563	SEMICONDUCTOR DEVICE AND METHOD	Non-Final OA	Taiwan Semiconductor Manufacturing Co., Ltd.
17855411	STACKED COMBSHEET FIELD EFFECT TRANSISTOR	Non-Final OA	International Business Machines Corporation

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