:30DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of Group I (Claims 1-17) in the reply filed on 12/2/2025 is acknowledged.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 2-4 are rejected under 35 U.S.C. 102(a) (1) as being anticipated by Yukiiri et al (US 2009/0100673).
With respect to Claim 2, Yukiiri et al discloses a method for manufacturing a wiring board (Figure 18) comprising: preparing a structure body (Figure 18, 82) in which a resin sheet (Figure 18, 96 and 95, paragraph 165) sequentially including a first resin layer region (Figure 18, 96) positioned outside and a high elasticity layer region (Figure 18, 95) positioned inside with an elastic modulus higher than that of the first resin layer region (inherent as the same components are disclosed, organic resin and glass fiber) is attached onto a support body having a metal layer (Figure 25, 81) provided on a surface thereof or onto a built -in wiring layer provided on the support body; forming a recess (Figure 25, left 100, left recess) by laser (paragraph 181-183) or imprinting in the first resin layer region on a surface side of the resin sheet; forming an opening portion (Figure 25, right 100, right opening) reaching the metal layer (Figure 25, 81) on the support body from the surface of the resin sheet; and forming a wiring layer (Figure 26, 85) in the recess and the opening portion. See Figures 18-26 and corresponding text, especially paragraphs 146-186.
With respect to Claim 3, Yukiiri et al discloses wherein the high elasticity layer region is formed by arranging at least one of an inorganic fiber and an organic fiber in an organic resin material. See paragraph 165.
With respect to Claim 4, Yukiiri et al discloses wherein wherein the inorganic fiber is at least one of a glass fiber. See paragraph 165.
Allowable Subject Matter
Claims 1 and 5-17 are allowed.
The following is an examiner’s statement of reasons for allowance: The closest prior art known to the Examiner is listed on the IDS and PTO 892 forms of record.
With respect to Claims 1 and 5-17, the cited prior art does not anticipate or make obvious inter alia “ forming a recess by excimer laser in a first resin layer region in which the glass cloth does not exist on a surface side of the resin sheet;” .
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ALEXANDER G GHYKA whose telephone number is (571)272-1669. The examiner can normally be reached Monday-Friday 9-6.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Christine Kim can be reached at 571 272-8458. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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AGG
January 8, 2025
/ALEXANDER G GHYKA/Primary Examiner, Art Unit 2812