Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2812
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18491996 | DISPLAY DEVICE | Non-Final OA | LG ELECTRONICS INC. |
| 18664776 | CAPACITOR AND ELECTRONIC DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18403022 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18392481 | SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND SUBSTRATE DICING METHOD | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18537536 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18487430 | INTEGRATED CIRCUIT AND IMAGE SENSOR INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18742080 | PSEUDOMORPHIC HIGH ELECTRON MOBILITY TRANSISTOR, LOW NOISE AMPLIFIER, AND RELATED APPARATUS | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18487166 | LIGHT EMITTING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18192601 | INTEGRATED CIRCUIT DEVICE WITH HETEROGENOUS TRANSISTORS | Non-Final OA | Intel Corporation |
| 18393107 | MONITORING OF ELECTRONIC PACKAGES | Non-Final OA | SK Hynix NAND Product Solutions Corp. (dba Solidigm) |
| 17576142 | INTEGRATED SCHOTTKY DIODE WITH GUARD RING | Non-Final OA | Texas Instruments Incorporated |
| 18786573 | SEMICONDUCTOR PACKAGES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18312012 | WAFER BONDING APPARATUS AND METHOD | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18789598 | SYSTEMS AND METHODS FOR WAFER BOND MONITORING | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18785156 | Chip Package Structure with Bump | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18783614 | FORMING LOW-STRESS SILICON NITRIDE LAYER THROUGH HYDROGEN TREATMENT | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18777198 | SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18774289 | BOTTOM-UP FORMATION OF CONTACT PLUGS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18402778 | SYSTEMS FOR IMPROVED PLACEMENT OF REDISTRIBUTION LAYERS IN MULTI-DIE PACKAGES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18486576 | THREE-DIMENSIONAL MEMORY DEVICE WORDLINES WITH REDUCED BLOCKING LAYER DAMAGE | Final Rejection | Applied Materials, Inc. |
| 17997158 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR MANUFACTURING DEVICE, AND SYSTEM | Final Rejection | Tokyo Electron Limited |
| 18771063 | LIGHT-EMITTING DEVICE AND LIGHT-EMITTING APPARATUS | Non-Final OA | TIANJIN SANAN OPTOELECTRONICS CO., LTD. |
| 18456309 | ION BEAM INSPECTION AND REPAIR WITH INCREASED SECONDARY ELECTRON YIELD | Non-Final OA | Carl Zeiss SMT GmbH |
| 18248169 | METHOD FOR PRODUCING A SUBSTRATE FOR EPITAXIAL GROWTH OF A GALLIUM-BASED III-N ALLOY LAYER | Final Rejection | Soitec |
| 18663570 | LIGHT EMITTING DEVICE AND DISPLAY APPARATUS HAVING THE SAME | Non-Final OA | SEOUL VIOSYS CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy