Tech Center 2800 • Art Units: 2812
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18308401 | MAGNETIC MEMORY DEVICES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18371738 | COVER MODULE AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 17957983 | THIN FILM RESISTOR MISMATCH IMPROVEMENT USING A SELF-ALIGNED DOUBLE PATTERN (SADP) TECHNIQUE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18373094 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18235245 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18486576 | THREE-DIMENSIONAL MEMORY DEVICE WORDLINES WITH REDUCED BLOCKING LAYER DAMAGE | Non-Final OA | Applied Materials, Inc. |
| 18364507 | NEUTRAL STRESS DIAMOND-LIKE CARBON | Non-Final OA | Applied Materials, Inc. |
| 18321343 | SEMICONDUCTOR STRUCTURE INCLUDING VERTICAL DIODE DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18315672 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE WITH THROUGH SEMICONDUCTOR VIA | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18312718 | TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18312012 | WAFER BONDING APPARATUS AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18173526 | METHOD FOR MANUFACTURING A CARRIER SUBSTRATE ON A SEMICONDUCTOR WAFER AND DEVICE INCLUDING A SEMICONDUCTOR WAFER | Non-Final OA | Robert Bosch GmbH |
| 18285902 | MULTILAYER BODY FOR IMAGE DISPLAY DEVICE AND IMAGE DISPLAY DEVICE | Non-Final OA | DAI NIPPON PRINTING CO., LTD. |
| 18350774 | DISPLAY DEVICE, METHOD FOR MANUFACTURING DISPLAY DEVICE, AND METHOD FOR INSPECTING DISPLAY DEVICE | Non-Final OA | Japan Display Inc. |
| 17997158 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR MANUFACTURING DEVICE, AND SYSTEM | Non-Final OA | Tokyo Electron Limited |
| 18247077 | METHOD FOR MANUFACTURING WIRING BOARD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RESIN SHEET | Non-Final OA | Resonac Corporation |
| 17953516 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 18298709 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | NEXPERIA B.V. |
| 18248169 | METHOD FOR PRODUCING A SUBSTRATE FOR EPITAXIAL GROWTH OF A GALLIUM-BASED III-N ALLOY LAYER | Non-Final OA | Soitec |
| 17927620 | A Memory Device Comprising an Electrically Floating Body Transistor | Non-Final OA | Zeno Semiconductor, Inc. |
| 18123357 | TEST KEY STRUCTURE | Non-Final OA | United Semiconductor (Xiamen) Co., Ltd. |
| 18455755 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE | Non-Final OA | NIKKISO CO., LTD. |
| 17965691 | SUBSTRATE STRUCTURE FOR LIGHT-EMITTING DIODES AND METHOD OF MAKING THE SAME | Non-Final OA | BOLB INC. |
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