Prosecution Insights
Last updated: May 29, 2026
Application No. 18/296,019

BONDING STRUCTURE AND DISPLAY DEVICE HAVING THE SAME

Final Rejection §103
Filed
Apr 05, 2023
Priority
Apr 11, 2022 — RE 10-2022-0044749
Examiner
LIU, BENJAMIN T
Art Unit
2893
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Samsung Display Co., Ltd.
OA Round
2 (Final)
74%
Grant Probability
Favorable
3-4
OA Rounds
0m
Est. Remaining
87%
With Interview

Examiner Intelligence

Grants 74% — above average
74%
Career Allowance Rate
515 granted / 692 resolved
+6.4% vs TC avg
Moderate +13% lift
Without
With
+12.8%
Interview Lift
resolved cases with interview
Typical timeline
2y 11m
Avg Prosecution
24 currently pending
Career history
739
Total Applications
across all art units

Statute-Specific Performance

§101
0.3%
-39.7% vs TC avg
§103
86.6%
+46.6% vs TC avg
§102
11.2%
-28.8% vs TC avg
§112
1.8%
-38.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 692 resolved cases

Office Action

§103
DETAILED ACTION Response to Arguments Applicant’s arguments with respect to claim 13 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 13 and 15 are rejected under 35 U.S.C. 103 as being unpatentable over Ohno et al. (US 11,054,687) (“Ohno”) in view of Shin (US 10,884,532). With regard to claim 13, fig. 2-3 of Ohno discloses a display device 300 comprising: a display module (layers below 121 in fig. 3) comprising: a pad region 311c, a base layer 220 in which a first open region (opening in 63 for 242 to connect to 311c) corresponding to the pad region 311c is defined, a pixel 30 on the base layer 200, and a signal line 365 which is on the base layer 200 and electrically connected to the pixel 30, the signal line 365 including a pad portion 311c corresponding to the first open region (opening in 63 for 242 to connect to 311c), a flexible circuit board 372 electrically connected to the display module 220, at the pad region 311c of the display module 220; a window 131 facing the display module (layers below 121 in fig. 3); an upper layer 121 between the window 131 and the display module (layers below 121 in fig. 3) and bonds the window 131 to the display module (layers below 121 in fig. 3), the upper layer 121 comprising a first resin structure (“acrylic resin”, col. 23 ll. 50); and a second resin structure 242 which bonds the flexible circuit board 372 to the display module (layers below 121 in fig. 3), at the pad region 311c. Ohno does not disclose a first resin structure overlapping the pad region. However, fig. 6 of Shin discloses a first resin structure (70 in 23) overlapping the pad region 23. Therefore, it would have been obvious to one of ordinary skill in the art to form the connection portion of Ohno overlapping the bonding layer as taught in Shin in order to improve the connection reliability. See col. 11 ll. 26 of Shin. With regard to claim 15, figs. 2-3 of Ohno discloses that the pad portion 311c of the signal line 365 is exposed (“conductive layer 311c is exposed”, col. 34 ll. 2-3) to outside the base layer 220, through the first open region (opening in 63 for 242 to connect to 311c) defined in the base layer 220. Allowable Subject Matter Claims 1-12 are allowed. The following is a statement of reasons for the indication of allowable subject matter: The primary reason for the allowance of claim 1 is that closest prior art Ohno et al. (US 11,054,687) (“Ohno”), Park et al. (US 2019/0312095) (“Park”), and Shin (US 10,884,532) do not disclose the inclusion of the limitation a lower layer which faces the upper layer with the display module therebetween, the lower layer non-overlapping the pad region; the resin structure contacts each of the display module and the lower layer, at the end surfaces thereof. Claim 2-10 depend on claim 1 and are allowed. The primary reason for the allowance of claim 9 is that closest prior art Ohno et al. (US 11,054,687) (“Ohno”), Park et al. (US 2019/0312095) (“Park”), and Shin (US 10,884,532) do not disclose the limitation the pad portion of the signal line defines an end surface of the pad portion which is exposed to outside the display module, and the resin structure contacts the pad portion at the end surface thereof. Claim 10 depend on claim 9 and are allowed. Claims 14 and 16-20 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Conclusion Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to BENJAMIN T LIU whose telephone number is (571)272-6009. The examiner can normally be reached Monday-Friday 11:00am-7:30pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Yara J Green can be reached at 571 270-3035. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /BENJAMIN TZU-HUNG LIU/Primary Examiner, Art Unit 2893
Read full office action

Prosecution Timeline

Apr 05, 2023
Application Filed
Oct 02, 2025
Non-Final Rejection mailed — §103
Dec 29, 2025
Response Filed
Apr 07, 2026
Final Rejection mailed — §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12641823
SEMICONDUCTOR COMPONENT AND METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT
4y 5m to grant Granted May 26, 2026
Patent 12641788
Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Cells, Methods Used In Forming Integrated Circuitry, And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells
3y 9m to grant Granted May 26, 2026
Patent 12642098
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
3y 1m to grant Granted May 26, 2026
Patent 12628674
SEMICONDUCTOR PACKAGE
3y 2m to grant Granted May 12, 2026
Patent 12622047
SCHOTTKY DIODE INTEGRATED INTO SUPERJUNCTION POWER MOSFETS
3y 6m to grant Granted May 05, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.
Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

3-4
Expected OA Rounds
74%
Grant Probability
87%
With Interview (+12.8%)
2y 11m (~0m remaining)
Median Time to Grant
Moderate
PTA Risk
Based on 692 resolved cases by this examiner. Grant probability derived from career allowance rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month