Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2893
This examiner grants 74% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18511553 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18374310 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18360056 | SEMICONDUCTOR PACKAGES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18296019 | BONDING STRUCTURE AND DISPLAY DEVICE HAVING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18117959 | DISPLAY PANEL, FABRICATION METHOD OF DISPLAY PANEL, AND DISPLAY DEVICE | Non-Final OA | Xiamen Tianma Display Technology Co., Ltd. |
| 18463332 | IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18550693 | IMAGING ELEMENT AND IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18550419 | PHOTOELECTRIC CONVERSION ELEMENT, METHOD FOR MANUFACTURING THE SAME, AND IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17555489 | MULTI-CHIP HIGH MEMORY BANDWIDTH CONFIGURATION | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18471933 | IMAGE DISPLAY DEVICE AND METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE | Non-Final OA | NICHIA CORPORATION |
| 18084844 | DIELECTRIC BARRIER FOR BACKSIDE INTERCONNECT SEPARATION | Non-Final OA | Intel Corporation |
| 17470961 | SEMICONDUCTOR DIE MODULE PACKAGES WITH VOID-DEFINED SECTIONS IN A METAL STRUCTURE(S) IN A PACKAGE SUBSTRATE TO REDUCE DIE-SUBSTRATE MECHANICAL STRESS, AND RELATED METHODS | Final Rejection | QUALCOMM Incorporated |
| 18454444 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18505845 | LIGHT-EMITTING DEVICE AND LIGHT-EMITTING APPARATUS | Non-Final OA | TIANJIN SANAN OPTOELECTRONICS CO., LTD. |
| 18491036 | LIGHT-EMITTING DEVICE AND LIGHT-EMITTING APPARATUS | Non-Final OA | TIANJIN SANAN OPTOELECTRONICS CO., LTD. |
| 18027382 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, MOTOR DRIVE DEVICE, AND VEHICLE | Final Rejection | ROHM CO., LTD. |
| 18521913 | FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18302466 | SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17410600 | Back Biasing of FD-SOI Circuit Block | Final Rejection | ADEIA SEMICONDUCTOR INC. |
| 18374410 | POWER MODULE | Non-Final OA | UT-Battelle, LLC |
| 18557008 | ON-CHIP SPECTROMETER WITH TUNABLE PHOTODETECTION LAYER | Non-Final OA | Yale University |
| 17508660 | PATTERNING OXIDATION RESISTANT ELECTRODE IN CROSSBAR ARRAY CIRCUITS | Non-Final OA | TetraMem Inc. |
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