Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2893
This examiner grants 75% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18743372 | INTEGRATED CIRCUIT DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18604875 | SEMICONDUCTOR PACKAGE INCLUDING THERMAL INTERFACIAL MATERIAL PATTERNS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18557952 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18610113 | ORGANIC LIGHT-EMITTING DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18418675 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18310277 | PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON CORE OF THE PACKAGE SUBSTRATE | Final Rejection | QUALCOMM Incorporated |
| 18126833 | FOR MEMORY ON PACKAGE WITH REDUCED THICKNESS | Non-Final OA | Intel Corporation |
| 18091264 | STACKED MULTICHIP IC DEVICE PACKAGES INCLUDING A GLASS SUBSTRATE | Non-Final OA | Intel Corporation |
| 18089865 | INTEGRATED CIRCUIT STRUCTURES HAVING TWO-LEVEL MEMORY | Non-Final OA | Intel Corporation |
| 17823602 | THREE-DIMENSIONAL PACKAGE ARCHITECTURE WITH FACE DOWN BRIDGE DIES | Final Rejection | Intel Corporation |
| 17856185 | ALIGNMENT VIA-PAD AND VIA-PLANE STRUCTURES | Final Rejection | Intel Corporation |
| 17852039 | SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT | Non-Final OA | Intel Corporation |
| 18234335 | ENHANCED INTERCONNECTION BALL GRID ARRAY DESIGN, SEMICONDUCTOR STRUCTURE, AND FABRICATING METHOD THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18275930 | SEMICONDUCTOR PACKAGE | Final Rejection | LG INNOTEK CO., LTD. |
| 18509052 | GAN-BASED, LATERAL-CONDUCTION, ELECTRONIC DEVICE WITH IMPROVED METALLIC LAYERS LAYOUT | Final Rejection | STMICROELECTRONICS S.R.L. |
| 18512140 | SECOND-LEVEL METALLIZATION TESTABLE FULLY INTEGRATED AND MULTI-FUNCTIONAL STATIC RANDOM ACCESS MEMORY AND SCANNABLE LATCHES | Non-Final OA | International Business Machines Corporation |
| 18519254 | LEADFRAME-BASED INTEGRATED TRANSFORMER PACKAGES | Non-Final OA | Allegro MicroSystems, LLC |
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