Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2893
This examiner grants 75% of resolved cases
Benjamin T. Liu is an examiner in Tech Center 2800, working in Art Unit 2812. The examiner has 721 resolved cases. The allowance rate is 75.0 percent. This rate indicates a favorable environment for applicants, with three-quarters of resolved cases resulting in a grant. The 721 resolved cases provide a robust data set for understanding the examiner's prosecution style.
The median days to allowance is 1081. This duration represents the typical time from filing to the issuance of a patent. The interview lift is 12.3 percent. This figure shows the increased chance of allowance when an interview is held. Compared to the 75.0 percent allowance rate, the 12.3 percent lift suggests that interviews are a helpful supplement to the standard prosecution process.
In Art Unit 2812, the 75.0 percent allowance rate and 1081 median days to allowance define a predictable prosecution path. The 721 resolved cases reflect a significant level of experience. The 12.3 percent interview lift is a valuable strategic option for practitioners. Overall, the data points to a consistent and generally favorable environment for applicants working with this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18604875 | SEMICONDUCTOR PACKAGE INCLUDING THERMAL INTERFACIAL MATERIAL PATTERNS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18752850 | QUANTUM DEVICE AND MANUFACTURING METHOD | Non-Final OA | NEC Corporation |
| 18686647 | Thin Film Transistor, Display Panel and Display Device | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18418675 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18434199 | Surface Treatment Compositions and Methods | Non-Final OA | Fujifilm Electronic Materials U.S.A., Inc. |
| 18508373 | ANCHORED LIGHT MIXING STRUCTURES IN LED PACKAGES AND RELATED METHODS | Final Rejection | CreeLED, Inc. |
| 18605021 | INTERPOSER SUBSTRATE WITH INTEGRATED STEP DIE CAVITY, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18310277 | PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON CORE OF THE PACKAGE SUBSTRATE | Final Rejection | QUALCOMM Incorporated |
| 18091264 | STACKED MULTICHIP IC DEVICE PACKAGES INCLUDING A GLASS SUBSTRATE | Non-Final OA | Intel Corporation |
| 17823602 | THREE-DIMENSIONAL PACKAGE ARCHITECTURE WITH FACE DOWN BRIDGE DIES | Non-Final OA | Intel Corporation |
| 17871443 | MULTI-DIE PANEL-LEVEL HIGH PERFORMANCE COMPUTING COMPONENTS | Non-Final OA | Intel Corporation |
| 17852039 | SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT | Non-Final OA | Intel Corporation |
| 18512140 | SECOND-LEVEL METALLIZATION TESTABLE FULLY INTEGRATED AND MULTI-FUNCTIONAL STATIC RANDOM ACCESS MEMORY AND SCANNABLE LATCHES | Non-Final OA | International Business Machines Corporation |
| 18604588 | SEMICONDUCTOR MODULE HAVING A SUBSTRATE WITH AN INSULATING CERAMIC LAYER AND A METHOD FOR FABRICATING THEREOF | Non-Final OA | Infineon Technologies Austria AG |
| 18584933 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18668478 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18605034 | THERMALLY REGULATED SEMICONDUCTOR DEVICE | Non-Final OA | Micron Technology, Inc. |
| 18731031 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18433509 | TRAPPING FILM FOR DEEP TRENCH ISOLATION STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18521913 | FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18760800 | EPITAXY REGIONS WITH LARGE LANDING AREAS FOR CONTACT PLUGS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18420719 | HIGH CAPACITY HIGH BANDWIDTH NON-VOLATILE MEMORY DEVICE | Non-Final OA | Sandisk Technologies, Inc. |
| 18557008 | ON-CHIP SPECTROMETER WITH TUNABLE PHOTODETECTION LAYER | Final Rejection | Yale University |
| 18505845 | LIGHT-EMITTING DEVICE AND LIGHT-EMITTING APPARATUS | Final Rejection | TIANJIN SANAN OPTOELECTRONICS CO., LTD. |
| 18515259 | METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18374410 | POWER MODULE | Final Rejection | UT-Battelle, LLC |
| 18519254 | LEADFRAME-BASED INTEGRATED TRANSFORMER PACKAGES | Non-Final OA | Allegro MicroSystems, LLC |
| 18485547 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR | Non-Final OA | ENKRIS SEMICONDUCTOR, INC. |
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