Prosecution Insights
Last updated: April 19, 2026
Application No. 18/341,782

DEPOSITION DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Non-Final OA §103
Filed
Jun 27, 2023
Examiner
KACKAR, RAM N
Art Unit
1716
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Nanya Technology Corporation
OA Round
1 (Non-Final)
39%
Grant Probability
At Risk
1-2
OA Rounds
4y 0m
To Grant
98%
With Interview

Examiner Intelligence

Grants only 39% of cases
39%
Career Allow Rate
197 granted / 501 resolved
-25.7% vs TC avg
Strong +59% interview lift
Without
With
+58.9%
Interview Lift
resolved cases with interview
Typical timeline
4y 0m
Avg Prosecution
35 currently pending
Career history
536
Total Applications
across all art units

Statute-Specific Performance

§101
0.9%
-39.1% vs TC avg
§103
56.1%
+16.1% vs TC avg
§102
14.1%
-25.9% vs TC avg
§112
23.5%
-16.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 501 resolved cases

Office Action

§103
DETAILED ACTION The present application, filed on (6/27/2023), is being examined under the first inventor to file provisions of the AIA . Claims (1-8) are pending and being examined in response to an election without traverse dated 11/28/2025. Claim Rejections - 35 USC § 103 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 1-5 and 8 are rejected under 35 U.S.C. 103 as being unpatentable over Paterson et al (US 20080193673) in view of Yuda et al (US 20020000202). Paterson et al disclose a deposition device (Fig 1), comprising: a first chamber (15b) comprising a diffusion zone (near the showerhead) and a reaction zone (near the substrate), wherein the diffusion zone is above the reaction zone; a substrate support disposed in the reaction zone (25); a second chamber disposed over the first chamber (15a); a showerhead disposed between the first chamber and the second chamber (10); a first reactant inlet communicating with the second chamber (Fig 2, 112); and a precursor inlet communicating with the showerhead (76, 78). Regarding a second reactant inlet communicating with the reaction zone of the first chamber, it is noted that gas coming off the showerhead would communicate with the reaction zone. However, Yuda et al disclose a similar plasma processing chamber with an upper chamber and a lower chamber where reactant inlet could be an independent source like (Fig 1 or Fig 4, 22)) or introduced through the showerhead as an alternative arrangement (Fig 6 or Fig 9). Therefore, it would have been obvious for one of ordinary skill in the art to have second reactant inlet communicating with the reaction zone of the first chamber as an alternative arrangement according to Yuda. Regarding claims 2-5 associated RF power supplies are disclosed in Paterson et al as disclosed (Fig 1). Regarding claim 8 a vacuum pump (160) is disclosed in Paterson et al as disclosed (Fig 1). Claims 6-7 are rejected under 35 U.S.C. 103 as being unpatentable over Paterson et al (US 20080193673) in view of Yuda et al (US 20020000202) as applied to claim 1 and further in view of Batzer et al (US 20210269918) and Choi et al (US 20090071403). Regarding claims 6 and 7 Paterson or Yuda do not disclose fluid conduit partially covering an outside of the showerhead for temperature control. Batzer et al disclose a similar plasma processing apparatus (Fig 1) with first chamber near the substrate (30), a second chamber (20) disposed over the first chamber; a showerhead disposed between the first chamber and the second chamber and cooling system (86) to cool the showerhead (Para 28). Regarding fluid conduit partially covering an outside of the showerhead, it is noted that fluid conduit in thermal contact for cooling purpose was well known in the prior art. For example, Choi et al disclose fluid conduit in thermal transfer contact with a cooling backing plate (See claim 2). Having cooling system for Paterson showerhead for temperature control would have been obvious before the filing date of the application according to the teaching of Batzer as supplemented by Choi. Regarding claim 7 cooling fluid as being perfluoropolyether is disclosed in Batzer (Para 30). Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Hudson et al (US 9039911 Fig 1) disclose a first chamber (primary plasma 102) near the substrate, a substrate support disposed in the reaction zone; a second chamber (secondary plasma 120) disposed over the first chamber; a showerhead disposed between the first chamber and the second chamber and associated process gases and RF power. Nguyen et al (US 20150170924 Fig 2) disclose a first chamber (270) near the substrate, a substrate support disposed in the reaction zone; a second chamber (292) disposed over the first chamber; a showerhead disposed between the first chamber and the second chamber and associated process gases and RF power. Any inquiry concerning this communication or earlier communications from the examiner should be directed to RAM N KACKAR whose telephone number is (571)272-1436. The examiner can normally be reached 09:00 AM-05:00 PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Parviz Hassanzadeh can be reached at 5712721435. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. RAM N. KACKAR Primary Examiner Art Unit 1716 /RAM N KACKAR/Primary Examiner, Art Unit 1716
Read full office action

Prosecution Timeline

Jun 27, 2023
Application Filed
Mar 07, 2026
Non-Final Rejection — §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12603251
HYBRID CHAMBER
2y 5m to grant Granted Apr 14, 2026
Patent 12597586
PLASMA PROCESSING APPARATUS AND MATCHING METHOD
2y 5m to grant Granted Apr 07, 2026
Patent 12594577
ROTARY REACTOR FOR DEPOSITION OF FILMS ONTO PARTICLES
2y 5m to grant Granted Apr 07, 2026
Patent 12571097
LIQUID SOURCE VAPORIZATION APPARATUS, CONTROL METHOD FOR A LIQUID SOURCE VAPORIZATION APPARATUS AND PROGRAM RECORDING MEDIUM ON WHICH IS RECORDED A PROGRAM FOR A LIQUID SOURCE VAPORIZATION APPARATUS
2y 5m to grant Granted Mar 10, 2026
Patent 12555748
SYMMETRIC PLASMA PROCESS CHAMBER
2y 5m to grant Granted Feb 17, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
39%
Grant Probability
98%
With Interview (+58.9%)
4y 0m
Median Time to Grant
Low
PTA Risk
Based on 501 resolved cases by this examiner. Grant probability derived from career allow rate.

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