Prosecution Insights
Prosecution Insights
Tech Center 2600 • Art Units: 1713 1716 1792 2615
This examiner grants 39% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18136448 | PLASMA PROCESSING APPARATUS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18354058 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Final Rejection | Panasonic Intellectual Property Management Co., Ltd. |
| 18619752 | SIDE BLOCKS FOR GAS ACTIVATION, AND RELATED PROCESSING CHAMBERS, PROCESS KITS, AND METHODS | Final Rejection | Applied Materials, Inc. |
| 18206847 | CCP GAS DELIVERY NOZZLE | Non-Final OA | Applied Materials, Inc. |
| 18142654 | LARGE-AREA HIGH-DENSITY PLASMA PROCESSING CHAMBER FOR FLAT PANEL DISPLAYS | Non-Final OA | Applied Materials, Inc. |
| 18102055 | RF GROUNDING CONFIGURATION FOR PEDESTALS | Final Rejection | Applied Materials, Inc. |
| 17984201 | WAFER PROFILING FOR ETCHING SYSTEM | Non-Final OA | Applied Materials, Inc. |
| 17893018 | GROUND PATH SYSTEMS FOR PROVIDING A SHORTER AND SYMMETRICAL GROUND PATH | Non-Final OA | Applied Materials, Inc. |
| 17898168 | PLASMA TREATMENT APPARATUS AND PLASMA TREATMENT METHOD | Final Rejection | KIOXIA CORPORATION |
| 18230049 | PLASMA PROCESSING APPARATUS AND POWER SUPPLY CONTROL METHOD | Non-Final OA | Tokyo Electron Limited |
| 18353757 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | TOKYO ELECTRON LIMITED |
| 18114998 | ETCHING METHOD AND PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18109632 | PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 17278423 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Final Rejection | Hitachi High-Tech Corporation |
| 18328656 | ETCHING APPARATUS AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18396470 | APPARATUS AND METHOD FOR CONTROLLING TEMPERATURE OF CHAMBER | Non-Final OA | SEMES CO. LTD. |
| 18309285 | PLASMA PROCESSING APPARATUS | Non-Final OA | SEMES CO., LTD. |
| 16971012 | METHOD AND APPARATUS FOR FORMING A PATTERNED LAYER OF MATERIAL | Non-Final OA | ASML NETHERLANDS B.V. |
| 18250740 | Wear Compensating Confinement Ring | Non-Final OA | Lam Research Corporation |
| 18006531 | HIGH-CONDUCTANCE VACUUM VALVES FOR WAFER PROCESSING SYSTEMS | Final Rejection | Lam Research Corporation |
| 18375238 | Method and Apparatus for Plasma Etching Dielectric Substrates | Non-Final OA | SPTS Technologies Limited |
| 18099616 | ATMOSPHERIC COLD PLASMA JET COATING AND SURFACE TREATMENT | Final Rejection | Starfire Industires, LLC |
| 17465635 | PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION OF CARBON-BASED COATINGS ON SURFACES | Final Rejection | AGM CONTAINER CONTROLS, INC. |
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