Prosecution Insights
Last updated: August 18, 2026

Examiner: KACKAR, RAM N

Tech Center 2600 • Art Units: 1713 1716 1718 1792 2615

This examiner grants 40% of resolved cases

Performance Statistics

39.8%
Allow Rate
-22.2% vs TC avg
544
Total Applications
+58.9%
Interview Lift
1438
Avg Prosecution Days
Based on 510 resolved cases, 2023–2026

Rejection Statute Breakdown

0.8%
§101 Eligibility
15.0%
§102 Novelty
57.1%
§103 Obviousness
23.6%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18380144 SEMICONDUCTOR PROCESSING APPARATUS Non-Final OA Samsung Electronics Co., Ltd.
18136448 PLASMA PROCESSING APPARATUS Final Rejection SAMSUNG ELECTRONICS CO., LTD.
18354058 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD Final Rejection Panasonic Intellectual Property Management Co., Ltd.
17147827 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD FOR MONITORING INTEGRATED VALUE Non-Final OA ASM IP Holding B.V.
17278423 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD Non-Final OA Hitachi High-Tech Corporation
18512146 WAFER CHUCK ASSEMBLY Final Rejection Taiwan Semiconductor Manufacturing Co., Ltd.
18630981 BACKING PLATE AND DIFFUSER PLATE ASSEMBLY Non-Final OA Applied Materials, Inc.
18206847 CCP GAS DELIVERY NOZZLE Final Rejection Applied Materials, Inc.
18201698 EDGE RING OR PROCESS KIT FOR SEMICONDUCTOR PROCESS MODULE Final Rejection Applied Materials, Inc.
18647077 PLASMA PROCESSING SYSTEM AND PLASMA PROCESSING APPARATUS Non-Final OA Tokyo Electron Limited
18589071 RESONANT PHASE-CONTROLLED OSCILLATOR Non-Final OA Tokyo Electron Limited
18345665 GAS FLOW DIFFUSORS FOR REMOTE PLASMA SOURCES Final Rejection Advanced Energy Industries, Inc.
18682021 SUBSTRATE PROCESSING SYSTEM INCLUDING RF MATCHING CIRCUIT FOR MULTI-FREQUENCY, MULTI-LEVEL, MULTI-STATE PULSING Non-Final OA LAM RESEARCH CORPORATION
18013475 CONTROLLING TEMPERATURE PROFILES OF PLASMA CHAMBER COMPONENTS USING STRESS ANALYSIS Non-Final OA LAM RESEARCH CORPORATION
17795843 ETCHING AND PLASMA UNIFORMITY CONTROL USING MAGNETICS Non-Final OA Lam Research Corporation
18341782 DEPOSITION DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Final Rejection NANYA TECHNOLOGY CORPORATION
16971012 METHOD AND APPARATUS FOR FORMING A PATTERNED LAYER OF MATERIAL Non-Final OA ASML NETHERLANDS B.V.
18142442 SUBSTRATE PROCESSING APPARATUS Final Rejection SEMES CO., LTD.
17895266 APPARATUS FOR TREATING SUBSTRATES AND TEMPERATURE CONTROL METHOD OF HEATING ELEMENTS Final Rejection SEMES CO., LTD.

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