Prosecution Insights
Prosecution Insights
Tech Center 2600 • Art Units: 1711 1713 1716 1718 1792 2615
This examiner grants 40% of resolved cases
Ram N. Kackar is an examiner within Tech Center 2600 and Art Unit 1711, having managed 517 resolved cases. The examiner maintains an allowance rate of 40.2 percent, which reflects the standard that applications must meet. The median days to allowance is 1435, indicating a prosecution process that requires persistent effort from legal counsel. This timeline is a consideration for applicants in the communications and information processing sectors who are operating under the 40.2 percent allowance rate.
A feature of this examiner's profile is the interview lift of 57.9 percent, which is higher than the 40.2 percent allowance rate. This figure demonstrates that engaging in direct dialogue with the examiner is an effective strategy, increasing the likelihood of a grant compared to cases without an interview. Given the 517 resolved cases of experience, the 57.9 percent interview lift suggests that rejections can be addressed through verbal clarification. Practitioners should use interviews to navigate the 1435-day median pendency and improve their chances within Art Unit 1711.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18508704 | PROCESS CHAMBER CLEANING APPARATUS AND METHOD | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18136448 | PLASMA PROCESSING APPARATUS | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 17147827 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD FOR MONITORING INTEGRATED VALUE | Non-Final OA | ASM IP Holding B.V. |
| 17278423 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Hitachi High-Tech Corporation |
| 18250740 | Wear Compensating Confinement Ring | Final Rejection | Lam Research Corporation |
| 18013475 | CONTROLLING TEMPERATURE PROFILES OF PLASMA CHAMBER COMPONENTS USING STRESS ANALYSIS | Non-Final OA | LAM RESEARCH CORPORATION |
| 17795843 | ETCHING AND PLASMA UNIFORMITY CONTROL USING MAGNETICS | Non-Final OA | Lam Research Corporation |
| 18630981 | BACKING PLATE AND DIFFUSER PLATE ASSEMBLY | Non-Final OA | Applied Materials, Inc. |
| 18206847 | CCP GAS DELIVERY NOZZLE | Final Rejection | Applied Materials, Inc. |
| 18142654 | LARGE-AREA HIGH-DENSITY PLASMA PROCESSING CHAMBER FOR FLAT PANEL DISPLAYS | Final Rejection | Applied Materials, Inc. |
| 18102055 | RF GROUNDING CONFIGURATION FOR PEDESTALS | Non-Final OA | Applied Materials, Inc. |
| 17893018 | GROUND PATH SYSTEMS FOR PROVIDING A SHORTER AND SYMMETRICAL GROUND PATH | Final Rejection | Applied Materials, Inc. |
| 18353757 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Final Rejection | TOKYO ELECTRON LIMITED |
| 18296944 | PLASMA PROCESSING SYSTEMS WITH MATCHING NETWORK AND METHODS | Non-Final OA | Tokyo Electron Limited |
| 18416832 | PROCESS GAS SUPPLY DEVICE AND SUBSTRATE PROCESSING SYSTEM HAVING THE SAME | Final Rejection | EUGENE TECHNOLOGY CO., LTD. |
| 18391599 | SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING SYSTEM INCLUDING THE SAME | Final Rejection | SEMES CO., LTD. |
| 18206089 | ESC TEMPERATURE CONTROL UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME | Non-Final OA | SEMES CO., LTD. |
| 17895266 | APPARATUS FOR TREATING SUBSTRATES AND TEMPERATURE CONTROL METHOD OF HEATING ELEMENTS | Final Rejection | SEMES CO., LTD. |
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