Prosecution Insights
Prosecution Insights
Technology area: Semiconductors, Circuits & Optics
112 pending office actions • 25 art units • 88 examiners • 0 of 112 (0%) have an AI response strategy ready • 296 patents granted in the last 365 days
NANYA TECHNOLOGY Corporation maintains a large-scale patent portfolio within the Semiconductors, Circuits & Optics technology area, currently managing 102 pending office actions. These actions are distributed across 80 distinct examiners, indicating a very broad engagement with the patent office. The workload spans 25 distinct art units, reflecting the diverse technical nature of the company's semiconductor innovations.
The distribution of 102 pending office actions among 80 distinct examiners suggests that most examiners are handling only a limited number of cases for the company. This wide dispersion across 25 distinct art units requires a robust management strategy to handle the various procedural and technical requirements of different examination groups. The high volume of actions highlights the company's significant ongoing investment in intellectual property.
MAZUMDER, DIDARUL A is the busiest examiner for the portfolio, with 5 pending office actions currently under review. Although this is the highest concentration for any single examiner, these 5 actions represent a small portion of the total workload. This confirms that the company's prosecution risk is well-diversified across the 80 distinct examiners involved.
Based on the USPTO statutory response window for each pending office action. 21 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 21 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 1 (1%) |
| §103 only | 42 (38%) |
| §102 only | 8 (7%) |
| §112 only | 6 (5%) |
| Double-patenting only | 2 (2%) |
| Double-patenting + other | 4 (4%) |
| Multi-statute (no §101) | 48 (43%) |
| No statute on record | 1 (1%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| MAZUMDER, DIDARUL A | 5 | 86.5% | +7.8% |
| GOODWIN, DAVID J | 5 | 67.4% | +16.5% |
| FREY, KIMBERLY NEWMAN | 3 | 73.3% | +22.2% |
| MOJADDEDI, OMAR F | 3 | 89.4% | +10.4% |
| MULERO FLORES, ERIC MANUEL | 3 | 83.3% | +16.4% |
| BLACKWELL, ASHLEY NICOLE | 2 | 97.2% | -1.1% |
| TRAN, BINH X | 2 | 81.7% | +12.0% |
| PARENDO, KEVIN A | 2 | 72.2% | +11.5% |
| KARIMY, TIMOR | 2 | 82.2% | +9.6% |
| HAIDER, WASIUL | 2 | 92.0% | +6.4% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18813036 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | TRAN, BINH X | — |
| 18742098 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | KARIMY, TIMOR | — |
| 18741062 | SEMICONDUCTOR DEVICE HAVING LANDING PAD AND METHOD FOR MANUFACTURING THE SAME | HAIDER, WASIUL | — |
| 18739600 | SEMICONDUCTOR DEVICE INCLUDING DOUBLE SIDE WORD LINE AND METHOD OF MANUFACTURING THE SAME | MAZUMDER, DIDARUL A | — |
| 18678395 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | KARIMY, TIMOR | — |
| 18648641 | SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING THE SAME | BLACKWELL, ASHLEY NICOLE | — |
| 18624147 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MULERO FLORES, ERIC MANUEL | — |
| 18381889 | PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE | MULERO FLORES, ERIC MANUEL | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 17741593 | MEMORY DEVICE HAVING PROTRUDING CHANNEL STRUCTURE | LI, MEIYA | 78d overdue |
| 18523109 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | NEWTON, VALERIE N | 30d overdue |
| 17879981 | METAL STRUCTURE HAVING FUNNEL-SHAPED INTERCONNECT AND METHOD OF MANUFACTURING THE SAME | LIN, JOHN | 8d overdue |
| 18105340 | SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC LINER PORTIONS AND METHOD FOR PREPARING THE SAME | KIELIN, ERIK J | 5d overdue |
| 18326018 | TEST SYSTEM AND TEST METHOD TO WAFERS | LEE, HWA S | 1d overdue |
| 18129204 | PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE | MULERO FLORES, ERIC MANUEL | 7d |
| 18140085 | CIRCUIT PROBING PAD DESIGN IN SCRIBE LINE STRUCTURE AND METHOD FOR FABRICATING A SEMICONDUCTOR CHIP | GOODWIN, DAVID J | 26d |
| 17879995 | WIRING STRUCTURE WITH CONDUCTIVE FEATURES HAVING DIFFERENT CRITICAL DIMENSIONS, AND METHOD OF MANUFACTURING THE SAME | JUNGE, BRYAN R. | 27d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18129204 | PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE | MULERO FLORES, ERIC MANUEL | 7d |
| 18061476 | TEST ELEMENT GROUP FOR METAL ROUTING LAYER AND MANUFACTURING METHOD THEREOF | GOODWIN, DAVID J | 23d |
| 18140085 | CIRCUIT PROBING PAD DESIGN IN SCRIBE LINE STRUCTURE AND METHOD FOR FABRICATING A SEMICONDUCTOR CHIP | GOODWIN, DAVID J | 26d |
| 18974866 | SEMICONDUCTOR DEVICE INCLUDING DIELECTRIC LAYER WITH UNEVEN THICKNESS | FREY, KIMBERLY NEWMAN | — |
| 18813036 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | TRAN, BINH X | — |
| 18791464 | METHOD OF PLASMA ETCHING | TRAN, BINH X | — |
| 18765112 | SEMICONDUCTOR STRUCTURE HAVING A MEMORY STRUCTURE AND METHOD OF MANUFACTURING THE SAME | MOJADDEDI, OMAR F | — |
| 18744946 | MEMORY DEVICE HAVING MEMORY CELL WITH REDUCED PROTRUSION | PARENDO, KEVIN A | — |
| Art Unit | Apps |
|---|---|
| 2817 | 10 |
| 2897 | 10 |
| 2898 | 10 |
| 2811 | 7 |
| 2812 | 6 |
| 2814 | 5 |
| 2818 | 5 |
| 2892 | 3 |
| 2899 | 2 |
| 2877 | 2 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19262117 | MEMORY MODULE AND METHOD FOR TESTING MEMORY MODULE | BUTLER, SARAI E | — | §103 | Non-Final OA | — | Pending | Jul 08, 2025 |
| 19175689 | SYSTEM AND METHOD FOR TESTING MEMORY DEVICE | ALSHACK, OSMAN M | — | §101DP | Non-Final OA | — | Pending | Apr 10, 2025 |
| 19071780 | SYSTEM AND METHOD FOR TESTING MEMORY DEVICE | YANG, HAN | — | §112 | Non-Final OA | — | Pending | Mar 06, 2025 |
| 19049232 | METHOD OF PROCESSING A SUBSTRATE AND METHOD OF FABRICATING BIT LINE CONTACTS OVER THE SUBSTRATE | IQBAL, HAMNA FATHIMA | 2817 | §103 | Final Rejection | — | Pending | Feb 10, 2025 |
| 19000707 | MEMORY TESTING SYSTEM AND MEMORY TESTING METHOD | TRAN, MICHAEL THANH | — | §102Other | Non-Final OA | — | Pending | Dec 24, 2024 |
| 18987803 | MEMORY-PAIRED SYSTEM FOR MULTIPLE STACKED SEMICONDUCTOR DEVICES AND REPAIR METHOD THEREOF | LUU, PHO M | 2824 | §102 | Non-Final OA | — | Pending | Dec 19, 2024 |
| 18974866 | SEMICONDUCTOR DEVICE INCLUDING DIELECTRIC LAYER WITH UNEVEN THICKNESS | FREY, KIMBERLY NEWMAN | 2817 | §102§112 | Non-Final OA | — | Pending | Dec 10, 2024 |
| 18944317 | METHOD FOR FABRICATING PHOTOMASK AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH DAMASCENE STRUCTURE | ONUTA, TIBERIU DAN | 2814 | §112 | Final Rejection | — | Pending | Nov 12, 2024 |
| 18906159 | TEMPERATURE DETECTION APPARATUS AND METHOD | FATIMA, UROOJ | 2676 | §102§103 | Non-Final OA | — | Pending | Oct 03, 2024 |
| 18888508 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | ABDELAZIEZ, YASSER A | — | §102 | Non-Final OA | — | Pending | Sep 18, 2024 |
| 18882731 | SEMICONDUCTOR DEVICE | MIHALIOV, DMITRI | — | §102§103Other | Non-Final OA | — | Pending | Sep 11, 2024 |
| 18816164 | SEMICONDUCTOR DEVICE WITH ISOLATION STRUCTURE AND METHOD FOR FABRICATING THE SAME | MAZUMDER, DIDARUL A | 2812 | §102§103 | Non-Final OA | — | Pending | Aug 27, 2024 |
| 18814870 | SEMICONDUCTOR DEVICE WITH SELF-ALIGNING CONTACT AND METHOD FOR FABRICATING THE SAME | BLACKWELL, ASHLEY NICOLE | 2897 | §103§112 | Non-Final OA | — | Pending | Aug 26, 2024 |
| 18813036 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | TRAN, BINH X | 1713 | §103 | Non-Final OA | — | Pending | Aug 23, 2024 |
| 18804340 | SEMICONDUCTOR DEVICE WITH LEAKAGE CURRENT GUIDE PATH AND METHOD FOR FABRICATING THE SAME | ESKRIDGE, CORY W | — | DP | Non-Final OA | — | Pending | Aug 14, 2024 |
| 18804397 | CONDUCTIVE STRUCTURE INCLUDING CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | ELLIOTT, DANIEL KURT | 2899 | §102§103DP | Non-Final OA | — | Pending | Aug 14, 2024 |
| 18797617 | SEMICONDUCTOR STRUCTURE INCLUDING A BIT LINE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | MALSAWMA, LALRINFAMKIM HMAR | — | §102 | Non-Final OA | — | Pending | Aug 08, 2024 |
| 18791464 | METHOD OF PLASMA ETCHING | TRAN, BINH X | — | §102§103Other | Non-Final OA | — | Pending | Aug 01, 2024 |
| 18770906 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING SUPPORTING LAYER | PHAM, HOAI V | 2892 | §102§103 | Non-Final OA | — | Pending | Jul 12, 2024 |
| 18766663 | SEMICONDUCTOR CAPACITOR AND METHOD OF FORMING THE SAME | PARVEZ, AZM A | 2892 | §103§112 | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18766956 | SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME | ALBRECHT, PETER M | 2811 | §112 | Non-Final OA | — | Pending | Jul 09, 2024 |
| 18765112 | SEMICONDUCTOR STRUCTURE HAVING A MEMORY STRUCTURE AND METHOD OF MANUFACTURING THE SAME | MOJADDEDI, OMAR F | — | §102§103 | Non-Final OA | — | Pending | Jul 05, 2024 |
| 18765102 | SEMICONDUCTOR DEVICE WITH SPACER AND METHOD FOR FABRICATING THE SAME | DINKE, BITEW A | 2812 | §102§103 | Non-Final OA | — | Pending | Jul 05, 2024 |
| 18764368 | MEMORY STRUCTURE AND METHOD OF FORMING THEREOF | QUINTO, KEVIN V | — | §102§112 | Non-Final OA | — | Pending | Jul 05, 2024 |
| 18763037 | VERTICAL MEMORY STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING THE SAME | TRAN, TONY | — | §103 | Final Rejection | — | Pending | Jul 03, 2024 |
| 18744946 | MEMORY DEVICE HAVING MEMORY CELL WITH REDUCED PROTRUSION | PARENDO, KEVIN A | — | §112 | Non-Final OA | — | Pending | Jun 17, 2024 |
| 18742098 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | KARIMY, TIMOR | 2818 | §103 | Non-Final OA | — | Pending | Jun 13, 2024 |
| 18741826 | WAREHOUSE ACCESS CONTROL SYSTEM AND METHOD OF OPERATING THE SAME | STRAUB, D'ARCY WINSTON | 2491 | §103 | Non-Final OA | 34d | Pending | Jun 13, 2024 |
| 18741062 | SEMICONDUCTOR DEVICE HAVING LANDING PAD AND METHOD FOR MANUFACTURING THE SAME | HAIDER, WASIUL | — | §103DP | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18740524 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | NGUYEN, NIKI HOANG | 2818 | §103§112 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18741098 | PACKAGE STRUCTURE INCLUDING HEAT SINK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | WHALEN, DANIEL B | — | §102§103Other | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18739600 | SEMICONDUCTOR DEVICE INCLUDING DOUBLE SIDE WORD LINE AND METHOD OF MANUFACTURING THE SAME | MAZUMDER, DIDARUL A | — | §103 | Final Rejection | — | Pending | Jun 11, 2024 |
| 18736859 | SEMICONDUCTOR DEVICE STRUCTURE WITH STACKED CONDUCTIVE PLUGS AND METHOD FOR PREPARING THE SAME | KUSUMAKAR, KAREN M | — | §102§103 | Non-Final OA | — | Pending | Jun 07, 2024 |
| 18736843 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING NITROGEN TREATMENT AND SEMICONDUCTOR STRUCTURE THEREOF | HARBOTTLE, CHARLOTTE ELIZABETH | — | §103§112 | Final Rejection | — | Pending | Jun 07, 2024 |
| 18733103 | SEMICONDUCTOR STRUCTURE HAVING A MEMORY STRUCTURE AND METHOD OF MANUFACTURING THE SAME | MOJADDEDI, OMAR F | — | §102§103§112 | Non-Final OA | — | Pending | Jun 04, 2024 |
| 18678395 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | KARIMY, TIMOR | 2818 | §103 | Non-Final OA | — | Pending | May 30, 2024 |
| 18675166 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MOHAMED-ALY, KAREEM M | — | §103 | Non-Final OA | — | Pending | May 28, 2024 |
| 18674906 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE | SANDVIK, BENJAMIN P | — | §103 | Non-Final OA | — | Pending | May 26, 2024 |
| 18673298 | INTERCONNECT STRUCTURE | LE, THAO P | — | §103 | Non-Final OA | — | Pending | May 23, 2024 |
| 18668441 | SEMICONDUCTOR DEVICE HAVING LANDING PAD AND METHOD FOR MANUFACTURING THE SAME | HAIDER, WASIUL | — | §102§103§112 | Final Rejection | — | Pending | May 20, 2024 |
| 18664628 | METHOD AND APPARATUS FOR WAFER MEASUREMENT | FREDERIKSEN, DAVID B | 2812 | §103 | Final Rejection | — | Pending | May 15, 2024 |
| 18653129 | SEMICONDUCTOR DEVICE INCLUDING DOUBLE SIDE WORD LINE AND METHOD OF MANUFACTURING THE SAME | MAZUMDER, DIDARUL A | — | §102§103 | Final Rejection | — | Pending | May 02, 2024 |
| 18652774 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | WALL, VINCENT | — | §103 | Non-Final OA | — | Pending | May 01, 2024 |
| 18651931 | METHOD FOR FORMING CONDUCTORS AND THEIR CONTACTS WHICH CARRY SIGNALS FOR ADVANCED SEMICONDUCTOR MEMORY DEVICES | TYNES JR., LAWRENCE C | — | §112 | Non-Final OA | — | Pending | May 01, 2024 |
| 18648641 | SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING THE SAME | BLACKWELL, ASHLEY NICOLE | — | §103 | Final Rejection | — | Pending | Apr 29, 2024 |
| 18640236 | SEMICONDUCTOR DEVICE HAVING BIT LINE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | PARK, SAMUEL | — | §103 | Final Rejection | — | Pending | Apr 19, 2024 |
| 18635343 | RECESS GATE AND INTERCONNECTOR STRUCTURE AND METHOD FOR PREPARING THE SAME | YASMEEN, NISHATH | 2811 | §102§103 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18631791 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | PAGE, STEVEN MITCHELL CHR | — | §102 | Non-Final OA | — | Pending | Apr 10, 2024 |
| 18630913 | SEMICONDUCTOR STRUCTURE AND METHOD MANUFACTURING THE SAME | JANG, BO BIN | — | §102§103§112 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18630165 | PACKAGE STRUCTURE INCLUDING INACTIVE ELEMENT, ASSEMBLY STRUCTURE AND METHOD OF MANUFACTURING THE SAME | AHMAD, KHAJA | 2811 | §102§103 | Non-Final OA | — | Pending | Apr 09, 2024 |
| 18628693 | OVERHEAD HOIST TRANSPORT AND ITS VOICE CONTROL SYSTEM AND METHOD | MEIS, JON CHRISTOPHER | 2654 | §103 | Non-Final OA | — | Pending | Apr 06, 2024 |
| 18628587 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | PARENDO, KEVIN A | — | §102§103 | Non-Final OA | — | Pending | Apr 05, 2024 |
| 18626571 | INSPECTING EQUIPMENT AND METHOD THEREOF | TON, TRI T | 2877 | §103 | Final Rejection | 56d | Pending | Apr 04, 2024 |
| 18625431 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | JEAN BAPTISTE, WILNER | — | §103 | Non-Final OA | — | Pending | Apr 03, 2024 |
| 18624147 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MULERO FLORES, ERIC MANUEL | 2898 | §103 | Non-Final OA | — | Pending | Apr 02, 2024 |
| 18619273 | SEMICONDUCTOR TEST STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | BENTON, CHLOE ELAINE | 2899 | §103§112 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18612241 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | — | §103 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18611773 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | HRNJIC, ADIN | 2897 | §102§103 | Non-Final OA | — | Pending | Mar 21, 2024 |
| 18610833 | MEMORY DEVICE AND METHOD FOR OPERATING THE SAME | DARE, RYAN A | 2132 | §103 | Non-Final OA | 34d | Pending | Mar 20, 2024 |
| 18607472 | TEST SYSTEM AND TEST METHOD | LIN, JESSICA YIFANG | 2668 | §103 | Non-Final OA | — | Pending | Mar 17, 2024 |
| 18602039 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | DULKA, JOHN P | 2817 | §102§103§112 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18599255 | RECESS GATE AND INTERCONNECTOR STRUCTURE AND METHOD FOR PREPARING THE SAME | YASMEEN, NISHATH | — | §102§103 | Final Rejection | — | Pending | Mar 08, 2024 |
| 18596957 | MEMORY DEVICE INCLUDING RECESSED GATE STRUCTURE HAVING HIGH-K GATE DIELECTRIC LAYER AND METHOD FOR PREPARING THE SAME | CROSS, XIA L | 2892 | §103 | Final Rejection | — | Pending | Mar 06, 2024 |
| 18593865 | SEMICONDUCTOR MEMORY DEVICE MANUFACTURING METHOD | MATTABONI, TIMOTHY JAMES | 2897 | §103 | Final Rejection | — | Pending | Mar 02, 2024 |
| 18593904 | MEMORY DEVICE AND FABRICATING METHOD THEREOF | MATTABONI, TIMOTHY JAMES | 2897 | §103 | Non-Final OA | — | Pending | Mar 02, 2024 |
| 18593863 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | KEAGY, ROSE ALYSSA | 2818 | §103 | Non-Final OA | — | Pending | Mar 02, 2024 |
| 18588670 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM | ASFAW, MESFIN T | 2882 | §102 | Non-Final OA | 56d | Pending | Feb 27, 2024 |
| 18584075 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | ENAD, CHRISTINE A | 2811 | §103 | Non-Final OA | — | Pending | Feb 22, 2024 |
| 18581773 | SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AIR GAP AND METHOD OF MANUFACTURING THE SAME | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | — | Pending | Feb 20, 2024 |
| 18443683 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | MOJADDEDI, OMAR F | 2898 | §102§103 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18438499 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | MAZUMDER, DIDARUL A | 2812 | §102§103 | Non-Final OA | — | Pending | Feb 11, 2024 |
| 18427897 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE | ISAAC, STANETTA D | 2898 | §103 | Final Rejection | — | Pending | Jan 31, 2024 |
| 18428119 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | WARD, ERIC A | 2891 | §103 | Final Rejection | — | Pending | Jan 31, 2024 |
| 18428127 | SEMICONDUCTOR DEVICE HAVING TRENCH CAPACITORS FORMED ON CHANNEL STRUCTURES AND METHODS FOR FABRICATING THE SAME | GREEN, TELLY D | 2898 | §103§112 | Final Rejection | — | Pending | Jan 31, 2024 |
| 18424322 | METHOD FOR REMOVING DEFECT ON EUV MASK | MALLOY, ANNA E | — | §103 | Non-Final OA | — | Pending | Jan 26, 2024 |
| 18395797 | SEMICONDUCTOR DEVICE INCLUDING DIELECTRIC LAYER WITH UNEVEN THICKNESS | FREY, KIMBERLY NEWMAN | 2817 | — | Final Rejection | — | Pending | Dec 26, 2023 |
| 18540989 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | MAZUMDER, DIDARUL A | 2812 | §102§103 | Final Rejection | — | Pending | Dec 15, 2023 |
| 18523109 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | NEWTON, VALERIE N | 2897 | §102§103 | Final Rejection | 30d overdue | Pending | Nov 29, 2023 |
| 18523402 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | CHOWDHARY, NIMARTA KAUR | 2898 | DP | Non-Final OA | — | Pending | Nov 29, 2023 |
| 18515291 | CAPACITOR AND METHOD OF MANUFACTURING THEREOF | ANDERSON, JOSHUA D | 3729 | §103§112 | Non-Final OA | — | Pending | Nov 21, 2023 |
| 18504426 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF | CUNNINGHAM, KIERAN MURRAY | 2893 | §103 | Final Rejection | — | Pending | Nov 08, 2023 |
| 18500605 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | MARIN, JACOB RAUL | 2818 | §102§103 | Non-Final OA | — | Pending | Nov 02, 2023 |
| 18491777 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | WATTS, JEREMY DANIEL | 2897 | §103 | Final Rejection | 56d | Pending | Oct 22, 2023 |
| 18382218 | SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FUSE STRUCTURE EMBEDDED IN SUBSTRATE | GRAY, AARON J | 2897 | §102§103 | Final Rejection | 60d | Pending | Oct 20, 2023 |
| 18381889 | PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE | MULERO FLORES, ERIC MANUEL | 2898 | §112 | Non-Final OA | — | Pending | Oct 19, 2023 |
| 18380345 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | BERRY, PAUL ANTHONY | 2898 | §103 | Final Rejection | 61d | Pending | Oct 16, 2023 |
| 18487617 | METHOD OF FORMING LINE PATTERN IN SEMICONDUCTOR DEVICE | CHU, JOHN S Y | 1737 | §102§103 | Non-Final OA | — | Pending | Oct 16, 2023 |
| 18379837 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING BONDING ELEMENT | HANUMASAGAR, SHAMITA S | 2814 | §102§112 | Final Rejection | — | Pending | Oct 13, 2023 |
| 18369148 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FREY, KIMBERLY NEWMAN | 2817 | §102§103 | Non-Final OA | — | Pending | Sep 16, 2023 |
| 18464287 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | BOULGHASSOUL, YOUNES | 2814 | §102 | Final Rejection | 7d | Pending | Sep 11, 2023 |
| 18239231 | CIRCUIT PROBING PAD DESIGN IN SCRIBE LINE STRUCTURE AND METHOD FOR FABRICATING A SEMICONDUCTOR CHIP | GOODWIN, DAVID J | 2817 | §102§103 | Non-Final OA | — | Pending | Aug 29, 2023 |
| 18237015 | SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING THE SAME | BEARDSLEY, JONAS TYLER | 2811 | §103 | Final Rejection | 41d | Pending | Aug 23, 2023 |
| 18223166 | SEMICONDUCTOR DEVICE INCLUDING MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | ZHU, SHENG-BAI | 2897 | §103 | Final Rejection | 23d | Pending | Jul 18, 2023 |
| 18222607 | METHOD AND TOOL FOR FILM DEPOSITION | SWEELY, KURT D | 1718 | §102 | Final Rejection | — | Pending | Jul 17, 2023 |
| 18219243 | SEMICONDUCTOR DEVICE HAVING FUNNEL-SHAPED INTERCONNECT AND METHOD OF MANUFACTURING THE SAME | LIN, JOHN | 2815 | §103§112 | Final Rejection | — | Pending | Jul 07, 2023 |
| 18219245 | WIRING STRUCTURE WITH CONDUCTIVE FEATURES HAVING DIFFERENT CRITICAL DIMENSIONS, AND METHOD OF MANUFACTURING THE SAME | JUNGE, BRYAN R. | 2897 | §103§112DP | Final Rejection | — | Pending | Jul 07, 2023 |
| 18214662 | SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR CARBON NANOTUBE AND MANUFACTURING METHOD THEREOF | RAHMAN, MOIN M | 2898 | §103 | Non-Final OA | 33d | Pending | Jun 27, 2023 |
| 18326018 | TEST SYSTEM AND TEST METHOD TO WAFERS | LEE, HWA S | 2877 | §103§112 | Final Rejection | 1d overdue | Pending | May 31, 2023 |
| 18140085 | CIRCUIT PROBING PAD DESIGN IN SCRIBE LINE STRUCTURE AND METHOD FOR FABRICATING A SEMICONDUCTOR CHIP | GOODWIN, DAVID J | 2817 | §102§103§112 | Final Rejection | 26d | Pending | Apr 27, 2023 |
| 18129204 | PROBING PAD DESIGN IN SCRIBE LINE FOR FLIP CHIP PACKAGE | MULERO FLORES, ERIC MANUEL | 2898 | §103§112 | Non-Final OA | 7d | Pending | Mar 31, 2023 |
| 18105340 | SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC LINER PORTIONS AND METHOD FOR PREPARING THE SAME | KIELIN, ERIK J | 2814 | §102§103§112 | Final Rejection | 5d overdue | Pending | Feb 03, 2023 |
| 18147684 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | SRINIVASAN, SESHA SAIRAMAN | 2812 | §103 | Non-Final OA | — | Pending | Dec 28, 2022 |
| 18061476 | TEST ELEMENT GROUP FOR METAL ROUTING LAYER AND MANUFACTURING METHOD THEREOF | GOODWIN, DAVID J | 2817 | §103 | Final Rejection | 23d | Pending | Dec 04, 2022 |
| 17973641 | WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE | MCCOY, THOMAS WILSON | 2814 | §103 | Final Rejection | — | Pending | Oct 26, 2022 |
| 17973202 | SEMICONDUCTOR DEVICE INCLUDING MEMORY STRUCTURE | MCDONALD, JASON ANDREW | 2898 | §102§103 | Non-Final OA | — | Pending | Oct 25, 2022 |
| 17954752 | ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING THE SAME | GOODWIN, DAVID J | 2817 | §103 | Non-Final OA | — | Pending | Sep 28, 2022 |
| 17879981 | METAL STRUCTURE HAVING FUNNEL-SHAPED INTERCONNECT AND METHOD OF MANUFACTURING THE SAME | LIN, JOHN | 2815 | §103§112 | Final Rejection | 8d overdue | Pending | Aug 03, 2022 |
| 17879995 | WIRING STRUCTURE WITH CONDUCTIVE FEATURES HAVING DIFFERENT CRITICAL DIMENSIONS, AND METHOD OF MANUFACTURING THE SAME | JUNGE, BRYAN R. | 2897 | §103§112 | Final Rejection | 27d | Pending | Aug 03, 2022 |
| 17808917 | DEPOSITION METHOD FOR FABRICATING SEMICONDUCTOR DEVICE STRUCTURE | CHEN, JACK S J | 2893 | §112DP | Non-Final OA | — | Pending | Jun 24, 2022 |
| 17845849 | METHOD FOR PREPARING MEMORY DEVICE WITH MULTILAYERED CAPACITOR DIELECTRIC STRUCTURE | LI, MEIYA | 2811 | §103§112 | Final Rejection | — | Pending | Jun 21, 2022 |
| 17741593 | MEMORY DEVICE HAVING PROTRUDING CHANNEL STRUCTURE | LI, MEIYA | 2811 | §103§112 | Final Rejection | 78d overdue | Pending | May 11, 2022 |
| 17735293 | METHOD FOR CONTROLLING IMPLANTING TOOL | LANE, THOMAS BERNARD | 2142 | §103 | Final Rejection | 8d | Pending | May 03, 2022 |
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