Prosecution Insights
Last updated: May 04, 2026
Application No. 18/347,702

PADS FOR IMAGE SENSORS AND RELATED METHODS

Non-Final OA §102
Filed
Jul 06, 2023
Examiner
GEYER, SCOTT B
Art Unit
2812
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Semiconductor Components Industries LLC
OA Round
1 (Non-Final)
94%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
98%
With Interview

Examiner Intelligence

Grants 94% — above average
94%
Career Allowance Rate
665 granted / 707 resolved
+26.1% vs TC avg
Minimal +4% lift
Without
With
+4.4%
Interview Lift
resolved cases with interview
Fast prosecutor
1y 10m
Avg Prosecution
17 currently pending
Career history
724
Total Applications
across all art units

Statute-Specific Performance

§101
0.7%
-39.3% vs TC avg
§103
21.0%
-19.0% vs TC avg
§102
42.7%
+2.7% vs TC avg
§112
24.1%
-15.9% vs TC avg
Black line = Tech Center average estimate • Based on career data from 707 resolved cases

Office Action

§102
DETAILED ACTION Election/Restrictions Applicant’s election without traverse of Group I (claims 1-7) in the reply filed on November 3, 2025 is acknowledged. Information Disclosure Statement The references cited within the IDS document (dated July 6, 2023) have been considered. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 1-7 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Yanagita et al. (US 2012/0086092 A1, hereinafter referred to as ‘Yanagita’). As to claim 1, Yanagita teaches a pad for an image sensor comprising: a pad base (24) coupled in a pad opening (23) formed in an image sensor die (1, 12); and a layer of metal (21a) directly coupled to the pad base extending to a top surface of the pad opening; wherein the pad base directly (electrically) couples with a first metallization layer (1M-3M) of the image sensor die. See figure 2. As to claim 2, Yanagita teaches the layer of metal (21a) is a single layer of metal. See figure 2. As to claim 3, Yanagita teaches a layer of metal (21a). The method by which the layer of metal is formed does not add any patentable weight to the instant device claim. (However, Yanagita does teach electroless plating in paragraph 0060). As to claim 4, Yanagita teaches the pad base (24) comprises aluminum. See paragraph 0046. As to claim 5, Yanagita teaches the layer of metal (21a) is nickel. See paragraph 0060. As to claim 6, Yanagita teaches a layer of gold (21c) directly (electrically) coupled to the layer of metal (21a). As to claim 7, Yanagita teaches a perimeter of the layer of metal (21a) is within a perimeter of the pad base (24). See figure 2. // Claims 1, 2, 4, and 7 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Huang et al. (US 2017/0186802 A1, hereinafter referred to as ‘Huang’). As to claim 1, Huang teaches a pad for an image sensor comprising: a pad base (306) coupled in a pad opening formed in an image sensor die (416); and a layer of metal (307) directly coupled to the pad base extending to a top surface of the pad opening; wherein the pad base directly couples with a first metallization layer (214a, 214b) of the image sensor die. See figure 4. As to claim 2, Huang teaches the layer of metal (307) is a single layer of metal. See figure 4. As to claim 4, Huang teaches the pad base (306) comprises aluminum. See paragraph 0034. As to claim 7, Huang teaches a perimeter of the layer of metal (307) is within a perimeter of the pad base (306). See figure 4. // Claims 1, 2, 4, 5, and 7 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Shin et al. (US 2019/0148439 A1, hereinafter referred to as ‘Shin’). As to claim 1, Shin teaches a pad for an image sensor comprising: a pad base (152) coupled in a pad opening (150T) formed in an image sensor die (die shown in figure 13, e.g.); and a layer of metal (154) directly coupled to the pad base extending to a top surface of the pad opening; wherein the pad base directly (electrically) couples with a first metallization layer (130, 174) of the image sensor die. See figures 16-21. As to claim 2, Shin teaches the layer of metal (154) is a single layer of metal. See figures 20-21. As to claim 4, Shin teaches the pad base (152) comprises aluminum. See paragraph 0121. As to claim 5, Shin teaches the layer of metal (154) is nickel. See paragraph 0122. As to claim 7, Shin teaches a perimeter of the layer of metal (154) is within a perimeter of the pad base (152). See figure 21. Cited Prior Art The prior art made of record and not relied upon is considered pertinent to applicant's disclosure: see the attached form PTO-892 for pertinent cited art. Contact Information Any inquiry concerning this communication or earlier communications from the examiner should be directed to Scott B. Geyer (telephone: 571-272-1958). The examiner can normally be reached on Monday to Friday, 10AM - 4PM (ET). Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at: http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Christine S. Kim (telephone: 571-272-8458). The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://pair-direct.uspto.gov. Should you have questions on access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative or access to the automated information system, call 800-786-9199 (in U.S.A. or Canada) or 571-272-1000. /SCOTT B GEYER/ Primary Examiner, Art Unit 2812
Read full office action

Prosecution Timeline

Jul 06, 2023
Application Filed
Dec 03, 2025
Non-Final Rejection — §102 (current)

Precedent Cases

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
94%
Grant Probability
98%
With Interview (+4.4%)
1y 10m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 707 resolved cases by this examiner. Grant probability derived from career allowance rate.

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