Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812
This examiner grants 94% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18231594 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18453720 | PACKAGE ASSEMBLY FOR INTEGRATED CIRCUIT | Non-Final OA | Cisco Technology, Inc. |
| 18773795 | APPARATUS AND METHOD FOR IMPROVING YIELD OF ADVANCED PACKAGES | Non-Final OA | Chipletz, Inc. |
| 18061181 | INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) | Non-Final OA | Intel Corporation |
| 18610979 | INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE | Final Rejection | VueReal Inc. |
| 18358634 | Integrated Circuits Having Protruding Interconnect Conductors | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18499345 | HIGH VOLTAGE CAPACITOR FORMED IN PCB FABRICATION | Non-Final OA | Allegro MicroSystems, LLC |
| 18458157 | PACKAGING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Absolics Inc. |
| 18400579 | Electrolytic Capacitor | Non-Final OA | Nippon Chemi-Con Corporation |
| 18513535 | CATHODE AND ELECTROLYTIC CAPACITOR | Non-Final OA | Nippon Chemi-Con Corporation |
| 18183091 | QUANTUM PROCESSING SYSTEMS AND METHODS | Non-Final OA | Silicon Quantum Computing Pty Limited |
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