61 pending office actions
| App # | Title | Examiner | Art Unit | Status | Filed |
|---|---|---|---|---|---|
| 18926782 | METHOD AND SYSTEM FOR CONCEALING PACKET LOSS IN A COMMUNICATION SYSTEM | CHASE, SHELLY A | 2112 | Non-Final OA | Oct 25, 2024 |
| 18902442 | MULTIDIE SUPPORTS AND RELATED METHODS | ARORA, AJAY | 2892 | Non-Final OA | Sep 30, 2024 |
| 18806582 | SELF-CLEANING ULTRASONIC SENSORS | WALKER, CHRISTOPHER RICHARD | 3645 | Non-Final OA | Aug 15, 2024 |
| 18796912 | CIRCUITRY AND METHODS FOR MITIGATING IMBALANCE IN IMAGE SENSORS WITH MULTIPLE READOUT PATHS | NAZRUL, SHAHBAZ | 2638 | Non-Final OA | Aug 07, 2024 |
| 18791299 | LOW ENERGY PHOTON DETECTION WITH CMOS IMAGERS | DANG, PHILIP | 2488 | Non-Final OA | Jul 31, 2024 |
| 18766902 | SCINTILLATOR CRYSTAL AND PHOTOMULTIPLIER ASSEMBLIES WITH IMPROVED EMISSION DETECTION | FAYE, MAMADOU | 2884 | Non-Final OA | Jul 09, 2024 |
| 18753608 | OVERLAPPING RETICLE PLACEMENT FOR LITHOGRAPHIC FABRICATION OF A DIE | ASFAW, MESFIN T | 2882 | Non-Final OA | Jun 25, 2024 |
| 18748818 | Photon Counting Image Sensor | TRAN, NHAN T | 2638 | Non-Final OA | Jun 20, 2024 |
| 18742151 | IMAGE SENSORS WITH INTEGRATED VISIBLE AND INFRARED LIGHT PIXELS | WERNER, DAVID N | 2487 | Non-Final OA | Jun 13, 2024 |
| 18667217 | HIGH SPEED DYNAMIC COMPARTOR | NGUYEN, LONG T | 2842 | Final Rejection | May 17, 2024 |
| 18664567 | SEMICONDUCTOR LEADFRAME PACKAGES AND RELATED METHODS | LEE, PETE T | 2847 | Non-Final OA | May 15, 2024 |
| 18631649 | HIDDEN ULTRASONIC SENSING SYSTEMS SUITABLE FOR ADVANCED DRIVER ASSISTANCE | ABULABAN, ABDALLAH | 3645 | Final Rejection | Apr 10, 2024 |
| 18444221 | PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCTURES | PETERSON, ERIK T | 2898 | Non-Final OA | Feb 16, 2024 |
| 18430787 | ROTOR FOR INDUCTIVE POSITION SENSOR | ISLA, RICHARD | 2858 | Final Rejection | Feb 02, 2024 |
| 18397847 | HIGH DNAMIC RANGE OPTICAL SENSOR USING TRENCH CAPACITORS WITH SIDEWALL STRUCTURES | ASSOUMAN, HERVE-LOUIS Y | 2812 | Non-Final OA | Dec 27, 2023 |
| 18543644 | WIRE BONDING USING A FLOATING PAD | WALL, VINCENT | 2898 | Non-Final OA | Dec 18, 2023 |
| 18534065 | SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES | HENRY, CALEB E | 2818 | Non-Final OA | Dec 08, 2023 |
| 18532236 | CHARGE-TO-VOLTAGE CONVERSION CIRCUIT WITH INLINE AMPLIFICATION | TRAN, NHAN T | 2638 | Non-Final OA | Dec 07, 2023 |
| 18522821 | Backside Illumination Global Shutter Image Sensor with Trench Storage Gate | HARRISTON, WILLIAM A | 2899 | Non-Final OA | Nov 29, 2023 |
| 18506269 | OPTICAL SENSOR PACKAGE | YEMELYANOV, DMITRIY | 2891 | Non-Final OA | Nov 10, 2023 |
| 18492867 | ELECTROLESS PLATING METHODS | IMTIAZ, S M SOHEL | 2812 | Non-Final OA | Oct 24, 2023 |
| 18491369 | MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES | TIVARUS, CRISTIAN ALEXANDRU | 2899 | Non-Final OA | Oct 20, 2023 |
| 18490923 | PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE | PETERSON, ERIK T | 2898 | Non-Final OA | Oct 20, 2023 |
| 18487835 | ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED METHODS | LEE, EUGENE | 2815 | Non-Final OA | Oct 16, 2023 |
| 18485966 | POWER MODULE PACKAGE HAVING MIRRORED LEADS | NADAV, ORI | 2811 | Non-Final OA | Oct 12, 2023 |
| 18485565 | SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED METHODS | LEE, KYOUNG | 2817 | Non-Final OA | Oct 12, 2023 |
| 18480897 | FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE | JONES, ERIC W | 2892 | Non-Final OA | Oct 04, 2023 |
| 18479530 | SEMICONDUCTOR DEVICES WITH ORTHOGONAL VOLTAGE BLOCKING STRUCTURES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | SPALLA, DAVID C | 2893 | Non-Final OA | Oct 02, 2023 |
| 18479316 | IMAGE SENSOR CHARGE DIRECTION STRUCTURES AND METHODS | BRADFORD, PETER | 2897 | Non-Final OA | Oct 02, 2023 |
| 18473659 | BLACK MASK ON GLASS SYSTEMS AND RELATED METHODS | SELBY, GEVELL V | 2638 | Non-Final OA | Sep 25, 2023 |
| 18471703 | LEADFRAME-LESS SEMICONDUCTOR DEVICE ASSEMBLIES WITH DUAL-SIDED COOLING | TOBERGTE, NICHOLAS J | 2817 | Non-Final OA | Sep 21, 2023 |
| 18446127 | COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS | STEPHENSON, KENNETH STEPHEN | 2898 | Non-Final OA | Aug 08, 2023 |
| 18350474 | PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE | AHMADI, MOHSEN | 2896 | Non-Final OA | Jul 11, 2023 |
| 18347702 | PADS FOR IMAGE SENSORS AND RELATED METHODS | GEYER, SCOTT B | 2812 | Non-Final OA | Jul 06, 2023 |
| 18346976 | DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES | VALENZUELA, PATRICIA D | 2812 | Non-Final OA | Jul 05, 2023 |
| 18345308 | TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE | CHAMBLISS, ALONZO | 2897 | Non-Final OA | Jun 30, 2023 |
| 18344292 | FLIP CHIP AND PRE-MOLDED CLIP POWER MODULES | CHAMBLISS, ALONZO | 2897 | Non-Final OA | Jun 29, 2023 |
| 18341958 | ELECTROPLATING SYSTEMS AND METHODS | MENDEZ, ZULMARIAM | 1794 | Non-Final OA | Jun 27, 2023 |
| 18324362 | METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP | SEVEN, EVREN | 2812 | Non-Final OA | May 26, 2023 |
| 18324526 | SILICON CARBIDE TRENCH POWER DEVICE | PIZARRO CRESPO, MARCOS D | 2814 | Non-Final OA | May 26, 2023 |
| 18309933 | CHIP STACKING WITH BOND PAD ABOVE A BONDLINE | NGUYEN, DAO H | 2818 | Non-Final OA | May 01, 2023 |
| 18308467 | MOLDED POWER MODULES | KLEIN, JORDAN M | 2893 | Non-Final OA | Apr 27, 2023 |
| 18295217 | POWER MODULE UTILIZING INJECTABLE CONDUCTIVE COMPONENT FOR DIRECT COOLING | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | Final Rejection | Apr 03, 2023 |
| 18182552 | INTEGRATED SUBSTRATES AND RELATED METHODS | HIBBERT, DANIEL JOHNATHAN | 2899 | Final Rejection | Mar 13, 2023 |
| 18179744 | OPTICAL SENSOR PACKAGE | INOUSSA, MOULOUCOULAY | 2818 | Final Rejection | Mar 07, 2023 |
| 18172904 | PROTECTION DAM FOR A POWER MODULE WITH SPACERS | ASSOUMAN, HERVE-LOUIS Y | 2812 | Non-Final OA | Feb 22, 2023 |
| 18169780 | SEMICONDUCTOR DEVICE HAVING A SUPER JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME | PARENDO, KEVIN A | 2896 | Non-Final OA | Feb 15, 2023 |
| 18148558 | ANTI-BLOOMING CONTROL IN OVERFLOW IMAGE SENSOR PIXEL | BELOUSOV, ALEXANDER | 2818 | Final Rejection | Dec 30, 2022 |
| 18066738 | SELF-ALIGNED JFET DEVICE | HAIDER, WASIUL | 2812 | Non-Final OA | Dec 15, 2022 |
| 18055123 | POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET | CIESLEWICZ, ANETA B | 2893 | Non-Final OA | Nov 14, 2022 |
| 18053796 | SEMICONDUCTOR CRYSTAL GROWTH USING SOURCE POWDER FROM CRUCIBLE WALL | QI, HUA | 1714 | Non-Final OA | Nov 09, 2022 |
| 18053177 | TRANSISTORS WITH SELECTIVELY LANDED GATE ARRAY | NGUYEN, CUONG B | 2818 | Non-Final OA | Nov 07, 2022 |
| 17931770 | SIC MOSFET WITH BUILT-IN SCHOTTKY DIODE | WARD, ERIC A | 2891 | Final Rejection | Sep 13, 2022 |
| 17930111 | IMAGE SENSOR PACKAGES AND RELATED METHODS | LUKE, DANIEL M | 2896 | Final Rejection | Sep 07, 2022 |
| 17822405 | SIDEWALL PROTECTED IMAGE SENSOR PACKAGE | PRASAD, NEIL R | 2897 | Non-Final OA | Aug 25, 2022 |
| 17820960 | SENSOR READOUT CIRCUIT AND METHOD | PINERO, JOSE E | 2843 | Final Rejection | Aug 19, 2022 |
| 17816455 | SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE | CRUM, JACOB R | 2835 | Final Rejection | Aug 01, 2022 |
| 17814566 | HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | Non-Final OA | Jul 25, 2022 |
| 17813972 | STACKED CHIP SCALE OPTICAL SENSOR PACKAGE | JEAN BAPTISTE, WILNER | 2899 | Non-Final OA | Jul 21, 2022 |
| 17653235 | FORMING SHIELD CONTACTS IN A SHIELDED-GATE TRENCH POWER MOSFET | HSIEH, HSIN YI | 2899 | Final Rejection | Mar 02, 2022 |
| 17137773 | SEMICONDUCTOR DESIGN OPTIMIZATION USING AT LEAST ONE NEURAL NETWORK | WU, NICHOLAS S | 2148 | Final Rejection | Dec 30, 2020 |
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