Prosecution Insights
Prosecution Insights
Technology area: Semiconductors, Circuits & Optics
66 pending office actions • 23 art units • 62 examiners • 0 of 66 (0%) have an AI response strategy ready • 156 patents granted in the last 365 days
Semiconductor Components Industries LLC manages a portfolio with 62 pending office actions in the Semiconductors, Circuits & Optics technology area. This activity is distributed across 23 distinct art units, reflecting the technical sub-specialties within the semiconductor field. The prosecution involves 59 distinct examiners, which indicates that the company must navigate many individual examiner styles and interpretations of patent law. With 62 pending office actions, the administrative task of tracking deadlines and examiner communications is a primary factor for the legal team.
Sue A Purvis is the busiest examiner for this portfolio, currently overseeing 2 pending office actions. Given that there are the 59 distinct examiners, the majority of examiners are handling only an individual application for the company. This dispersion across 23 art units and the various individuals requires an organized approach to maintain consistency in claim language. The distribution across the art units shows that the company's intellectual property strategy covers a spectrum of semiconductor and circuit technologies. The 2 pending actions with the busiest examiner indicate the concentration of cases per person.
Based on the USPTO statutory response window for each pending office action. 17 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 17 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 1 (2%) |
| §103 only | 18 (27%) |
| §102 only | 3 (5%) |
| §112 only | 1 (2%) |
| Double-patenting only | 2 (3%) |
| Multi-statute (no §101) | 40 (61%) |
| No statute on record | 1 (2%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| BENTON, CHLOE ELAINE | 2 | — | — |
| PURVIS, SUE A | 2 | 64.0% | +11.8% |
| TIVARUS, CRISTIAN ALEXANDRU | 2 | 76.0% | +26.1% |
| ARROYO, TERESA M | 2 | 71.9% | +23.2% |
| SAAD, ERIN BARRY | 1 | 72.4% | +11.5% |
| JEAN PIERRE, PEGUY | 1 | 94.3% | -0.8% |
| ALLGOOD, ALESA M | 1 | 82.5% | +18.6% |
| NGUYEN, LINH V | 1 | 89.1% | +2.4% |
| GONZALEZ, MILTON | 1 | 77.7% | +12.7% |
| KHAN, USMAN A | 1 | 74.9% | +11.7% |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18766902 | SCINTILLATOR CRYSTAL AND PHOTOMULTIPLIER ASSEMBLIES WITH IMPROVED EMISSION DETECTION | FAYE, MAMADOU | 28d overdue |
| 18350474 | PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE | AHMADI, MOHSEN | 18d overdue |
| 18055123 | POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET | CIESLEWICZ, ANETA B | 16d overdue |
| 17930111 | IMAGE SENSOR PACKAGES AND RELATED METHODS | LUKE, DANIEL M | 6d |
| 18341958 | ELECTROPLATING SYSTEMS AND METHODS | MENDEZ, ZULMARIAM | 12d |
| 17814566 | HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL | BULLARD-CONNOR, GENEVIEVE GRACE | 23d |
| 17814750 | POWER DEVICE INCLUDING METAL LAYER | NGUYEN, THANH T | 79d |
| 19049380 | REFLOW JIG DESIGNS AND RELATED METHODS | SAAD, ERIN BARRY | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18491369 | MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES | TIVARUS, CRISTIAN ALEXANDRU | 4d overdue |
| 19049380 | REFLOW JIG DESIGNS AND RELATED METHODS | SAAD, ERIN BARRY | — |
| 19034535 | INDUCTIVE ANGULAR POSITION SENSOR | ALLGOOD, ALESA M | — |
| 19018146 | HARMONIC DISTORTION REDUCTION IN INDUCTIVE POSITION SENSORS | GONZALEZ, MILTON | — |
| 19010521 | AUTOMATED MUTLI-MODAL SENSING SYNCHRONIZATION | KHAN, USMAN A | — |
| 18619594 | ELECTRONIC DEVICE INCLUDING A POLYMER SUPPORT LAYER | PURVIS, SUE A | — |
| 18444251 | FLUIDIC-CHANNEL COOLED SUBSTRATES | TIVARUS, CRISTIAN ALEXANDRU | — |
| 18529657 | METHODS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES AND POWER SEMICONDUDCTOR STRUCTURES | ARROYO, TERESA M | — |
| Art Unit | Apps |
|---|---|
| 2899 | 7 |
| 2893 | 6 |
| 2898 | 5 |
| 2812 | 4 |
| 2896 | 4 |
| 2818 | 3 |
| 2845 | 2 |
| 1714 | 2 |
| 1735 | 1 |
| 2637 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19049380 | REFLOW JIG DESIGNS AND RELATED METHODS | SAAD, ERIN BARRY | 1735 | §102§103 | Final Rejection | — | Pending | Feb 10, 2025 |
| 19042666 | LOW POWER PHASE DETECTION | JEAN PIERRE, PEGUY | 2845 | §102§103 | Non-Final OA | — | Pending | Jan 31, 2025 |
| 19034535 | INDUCTIVE ANGULAR POSITION SENSOR | ALLGOOD, ALESA M | — | §103§112 | Non-Final OA | — | Pending | Jan 22, 2025 |
| 19021792 | BOOTSTRAPPED SWITCH CIRCUIT WITH HIGH LINEARITY | NGUYEN, LINH V | 2845 | §102§103 | Non-Final OA | — | Pending | Jan 15, 2025 |
| 19018146 | HARMONIC DISTORTION REDUCTION IN INDUCTIVE POSITION SENSORS | GONZALEZ, MILTON | — | Other | Non-Final OA | — | Pending | Jan 13, 2025 |
| 19010521 | AUTOMATED MUTLI-MODAL SENSING SYNCHRONIZATION | KHAN, USMAN A | 2637 | §102§103 | Non-Final OA | — | Pending | Jan 06, 2025 |
| 18955820 | FAULT PROTECTION TESTING IN A HIGH-POWER SWITCHING SYSTEM | JACKSON, STEPHEN W | — | DP | Non-Final OA | — | Pending | Nov 21, 2024 |
| 18954353 | INDUCTIVE ANGULAR POSITION SENSOR | YENINAS, STEVEN LEE | — | §102§112 | Non-Final OA | — | Pending | Nov 20, 2024 |
| 18917293 | SECURE SERIAL BUS WITH AUTOMOTIVE APPLICATIONS | LIN, AMIE CHINYU | 2436 | §101§102§103 | Final Rejection | — | Pending | Oct 16, 2024 |
| 18891830 | IMPROVED VOLTAGE BUFFER | RETEBO, METASEBIA T | 2836 | §102§103 | Non-Final OA | — | Pending | Sep 20, 2024 |
| 18799472 | IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER | RAHMAN, KHATIB A | — | §102§103 | Non-Final OA | — | Pending | Aug 09, 2024 |
| 18795699 | TAPE HEATING METHODS | VU, VU A | — | §103 | Non-Final OA | — | Pending | Aug 06, 2024 |
| 18791299 | LOW ENERGY PHOTON DETECTION WITH CMOS IMAGERS | DANG, PHILIP | 2488 | §103 | Non-Final OA | 26d | Pending | Jul 31, 2024 |
| 18787369 | OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES | MIHALIOV, DMITRI | — | §103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18784012 | SWITCHING POWER CONVERTERS, AND METHODS AND CONTROL MODULES FOR OPERATING SAME | ZHANG, JUE | 2838 | §102§103 | Final Rejection | — | Pending | Jul 25, 2024 |
| 18775336 | METHOD OF FABRICATING SUPER-JUNCTION BASED VERTICAL GALLIUM NITRIDE JFET AND MOSFET POWER DEVICES | BOOTH, RICHARD A | — | DP | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18766902 | SCINTILLATOR CRYSTAL AND PHOTOMULTIPLIER ASSEMBLIES WITH IMPROVED EMISSION DETECTION | FAYE, MAMADOU | 2884 | §102§103 | Non-Final OA | 28d overdue | Pending | Jul 09, 2024 |
| 18755366 | SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING | MUSE, ISMAIL A | — | §102§103 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18753608 | OVERLAPPING RETICLE PLACEMENT FOR LITHOGRAPHIC FABRICATION OF A DIE | ASFAW, MESFIN T | 2882 | §102§103 | Non-Final OA | — | Pending | Jun 25, 2024 |
| 18738193 | MANAGING THE GROWTH OF SILICON CARBIDE CRYSTALS | SONG, MATTHEW J | — | §102§103 | Non-Final OA | — | Pending | Jun 10, 2024 |
| 18668408 | SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH INTERPOSER AND OPPOSING SUBSTRATES | YEUNG LOPEZ, FEIFEI | 2899 | §102§103 | Non-Final OA | — | Pending | May 20, 2024 |
| 18661875 | MANAGING GROWTH OF SILICON CARBIDE CRYSTALS | BRATLAND JR, KENNETH A | 1714 | §102§103§112 | Non-Final OA | — | Pending | May 13, 2024 |
| 18652203 | HIGH PHOTON RATE SPAD DEVICE | FLORES, MARK ANTHONY | — | §102§103 | Non-Final OA | — | Pending | May 01, 2024 |
| 18649686 | c/o onsemi | CHI, SUBERR L | — | §102§103§112 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18641773 | Image Sensor with Visible Light and Short Wave Infrared Detection | MENZ, DOUGLAS M | — | §102§103 | Non-Final OA | — | Pending | Apr 22, 2024 |
| 18637256 | Image Sensor with Visible Light and Short Wave Infrared Detection | LEE, KYOUNG | — | §102 | Non-Final OA | — | Pending | Apr 16, 2024 |
| 18701585 | TERMINATION STRUCTURES FOR MOSFETS | BENTON, CHLOE ELAINE | — | §102§103§112 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18634120 | SPLIT-GATE TRENCH SEMICONDUCTOR DEVICE HAVING STEPPED SHIELD ELECTRODE AND METHOD OF MANUFACTURING | SQUIRES, BRETT STEPHEN | — | §102§103 | Non-Final OA | — | Pending | Apr 12, 2024 |
| 18621338 | PARTITIONED LEADFRAME FOR MULTI-DIE DISCRETE ELECTRONIC COMPONENTS | ARMAND, MARC ANTHONY | — | §103 | Non-Final OA | — | Pending | Mar 29, 2024 |
| 18621005 | METHODS AND SYSTEMS OF LIGHT DETECTING AND RANGING | HULKA, JAMES R | — | §102§103 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18619594 | ELECTRONIC DEVICE INCLUDING A POLYMER SUPPORT LAYER | PURVIS, SUE A | 2800 | §103 | Final Rejection | — | Pending | Mar 28, 2024 |
| 18606922 | METHODS FOR SINGULATING SEMICONDUCTOR DIE FROM SILICON CARBIDE SUBSTRATES | ZARNEKE, DAVID A | 2891 | §102§103 | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18602261 | IMAGE SENSOR PACKAGES AND RELATED METHODS | ABDELAZIEZ, YASSER A | 2898 | §103 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18592273 | MULTI-CHIP SEMICONDUCTOR MODULE WITH BALANCED SWITCHING | SANDVIK, BENJAMIN P | 2812 | §103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18444251 | FLUIDIC-CHANNEL COOLED SUBSTRATES | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103§112 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18444221 | PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCTURES | PETERSON, ERIK T | 2898 | §103§112 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18441484 | DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES | MUNOZ, ANDRES F | 2818 | §102§103 | Non-Final OA | — | Pending | Feb 14, 2024 |
| 18439823 | PROCESS OF FORMING A THIN SEMICONDUCTOR LAYER BONDED TO A PROCESSING SUBSTRATE AND AN ELECTRONIC DEVICE INCLUDING THE THIN SEMICONDUCTOR LAYER | LASASSO, VICTOR JOSEPH | 2898 | §102§103§112 | Non-Final OA | — | Pending | Feb 13, 2024 |
| 18397847 | HIGH DNAMIC RANGE OPTICAL SENSOR USING TRENCH CAPACITORS WITH SIDEWALL STRUCTURES | ASSOUMAN, HERVE-LOUIS Y | 2812 | §103 | Final Rejection | 1d overdue | Pending | Dec 27, 2023 |
| 18543644 | WIRE BONDING USING A FLOATING PAD | WALL, VINCENT | 2898 | §103 | Final Rejection | 9d overdue | Pending | Dec 18, 2023 |
| 18538533 | OPTICAL SENSOR PACKAGE | BENTON, CHLOE ELAINE | 2899 | §102§103 | Non-Final OA | — | Pending | Dec 13, 2023 |
| 18534065 | SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES | HENRY, CALEB E | 2818 | §102 | Final Rejection | 22d | Pending | Dec 08, 2023 |
| 18529657 | METHODS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES AND POWER SEMICONDUDCTOR STRUCTURES | ARROYO, TERESA M | 2893 | §103 | Non-Final OA | — | Pending | Dec 05, 2023 |
| 18558593 | STACKED INTEGRATED CIRCUIT DIES AND INTERCONNECT STRUCTURES | WINTERS, SEAN AYERS | 2892 | §102§103§112 | Final Rejection | — | Pending | Nov 02, 2023 |
| 18491369 | MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103 | Final Rejection | 4d overdue | Pending | Oct 20, 2023 |
| 18485966 | POWER MODULE PACKAGE HAVING MIRRORED LEADS | NADAV, ORI | 2811 | §103 | Final Rejection | 21d | Pending | Oct 12, 2023 |
| 18479316 | IMAGE SENSOR CHARGE DIRECTION STRUCTURES AND METHODS | BRADFORD, PETER | 2897 | §103 | Non-Final OA | — | Pending | Oct 02, 2023 |
| 18478296 | WIRE-IN-DAM PACKAGES AND RELATED SYSTEMS AND METHODS | SWANSON, ANDREW L | 2896 | §102 | Non-Final OA | — | Pending | Sep 29, 2023 |
| 18473998 | POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER | SRINIVASAN, SESHA SAIRAMAN | 2812 | §103 | Final Rejection | — | Pending | Sep 25, 2023 |
| 18462082 | IMAGE SENSOR PACKAGES AND RELATED METHODS | KOLB, THADDEUS J | 2817 | §102§103 | Final Rejection | — | Pending | Sep 06, 2023 |
| 18446127 | COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS | STEPHENSON, KENNETH STEPHEN | 2898 | §103 | Final Rejection | 19d overdue | Pending | Aug 08, 2023 |
| 18350474 | PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE | AHMADI, MOHSEN | 2896 | §102§103 | Final Rejection | 18d overdue | Pending | Jul 11, 2023 |
| 18346976 | DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | — | Pending | Jul 05, 2023 |
| 18341958 | ELECTROPLATING SYSTEMS AND METHODS | MENDEZ, ZULMARIAM | 1794 | §102§103 | Non-Final OA | 12d | Pending | Jun 27, 2023 |
| 18308467 | MOLDED POWER MODULES | KLEIN, JORDAN M | 2893 | §103 | Final Rejection | 28d | Pending | Apr 27, 2023 |
| 18194811 | CLIPS WITH ALIGNMENT FEATURES AND RELATED METHODS | BOYLE, ABBIGALE A | 2899 | §102§112 | Non-Final OA | — | Pending | Apr 03, 2023 |
| 18193847 | SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS | ARROYO, TERESA M | 2893 | §102§103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18185548 | EDGE SEALS FOR SEMICONDUCTOR DEVICES | PURVIS, SUE A | 2893 | §102§103§112 | Non-Final OA | — | Pending | Mar 17, 2023 |
| 18182552 | INTEGRATED SUBSTRATES AND RELATED METHODS | HIBBERT, DANIEL JOHNATHAN | 2899 | §103 | Non-Final OA | — | Pending | Mar 13, 2023 |
| 18174837 | SANDWICH PACKAGE FOR MICROELECTRONICS | HUTSON, NICHOLAS LELAND | 2818 | §102§103 | Non-Final OA | — | Pending | Feb 27, 2023 |
| 18169780 | SEMICONDUCTOR DEVICE HAVING A SUPER JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME | PARENDO, KEVIN A | 2896 | §103 | Final Rejection | 15d | Pending | Feb 15, 2023 |
| 18055123 | POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET | CIESLEWICZ, ANETA B | 2893 | §103§112 | Final Rejection | 16d overdue | Pending | Nov 14, 2022 |
| 18053796 | SEMICONDUCTOR CRYSTAL GROWTH USING SOURCE POWDER FROM CRUCIBLE WALL | QI, HUA | 1714 | §112 | Non-Final OA | 16d overdue | Pending | Nov 09, 2022 |
| 17930111 | IMAGE SENSOR PACKAGES AND RELATED METHODS | LUKE, DANIEL M | 2896 | §102§103§112 | Final Rejection | 6d | Pending | Sep 07, 2022 |
| 17814750 | POWER DEVICE INCLUDING METAL LAYER | NGUYEN, THANH T | 2893 | §102§103 | Non-Final OA | 79d | Pending | Jul 25, 2022 |
| 17814566 | HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §102§103§112 | Final Rejection | 23d | Pending | Jul 25, 2022 |
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