Prosecution Insights
Prosecution Insights
47 pending office actions • 19 art units • 44 examiners • 0 of 47 (0%) have an AI response strategy ready • 163 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 15 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 15 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 18 (38%) |
| §102 only | 3 (6%) |
| Multi-statute (no §101) | 26 (55%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| TIVARUS, CRISTIAN ALEXANDRU | 2 | 77.8% | +21.9% |
| PETERSON, ERIK T | 2 | 77.2% | +11.2% |
| VALENZUELA, PATRICIA D | 2 | 90.2% | +2.1% |
| KHAN, USMAN A | 1 | 74.9% | +11.9% |
| YENINAS, STEVEN LEE | 1 | 73.4% | +4.7% |
| RETEBO, METASEBIA T | 1 | 89.4% | +5.3% |
| MIHALIOV, DMITRI | 1 | 73.1% | +35.0% |
| FAYE, MAMADOU | 1 | 78.5% | +6.7% |
| MUSE, ISMAIL A | 1 | 86.8% | +7.9% |
| ASFAW, MESFIN T | 1 | 82.8% | +14.0% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18755366 | SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING | MUSE, ISMAIL A | — |
| 18355171 | COPPER FEATURES AND RELATED METHODS OF FORMING | VALENZUELA, PATRICIA D | — |
| 18346976 | DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES | VALENZUELA, PATRICIA D | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18766902 | SCINTILLATOR CRYSTAL AND PHOTOMULTIPLIER ASSEMBLIES WITH IMPROVED EMISSION DETECTION | FAYE, MAMADOU | 28d overdue |
| 18350474 | PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE | AHMADI, MOHSEN | 18d overdue |
| 18053796 | SEMICONDUCTOR CRYSTAL GROWTH USING SOURCE POWDER FROM CRUCIBLE WALL | QI, HUA | 16d overdue |
| 17930111 | IMAGE SENSOR PACKAGES AND RELATED METHODS | LUKE, DANIEL M | 6d |
| 18490923 | PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE | PETERSON, ERIK T | 12d |
| 18954353 | INDUCTIVE ANGULAR POSITION SENSOR | YENINAS, STEVEN LEE | — |
| 18891830 | IMPROVED VOLTAGE BUFFER | RETEBO, METASEBIA T | — |
| 18753608 | OVERLAPPING RETICLE PLACEMENT FOR LITHOGRAPHIC FABRICATION OF A DIE | ASFAW, MESFIN T | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 7 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18491369 | MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES | TIVARUS, CRISTIAN ALEXANDRU | 4d overdue |
| 18490923 | PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE | PETERSON, ERIK T | 12d |
| 19010521 | AUTOMATED MUTLI-MODAL SENSING SYNCHRONIZATION | KHAN, USMAN A | — |
| 18787369 | OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES | MIHALIOV, DMITRI | — |
| 18753608 | OVERLAPPING RETICLE PLACEMENT FOR LITHOGRAPHIC FABRICATION OF A DIE | ASFAW, MESFIN T | — |
| 18444251 | FLUIDIC-CHANNEL COOLED SUBSTRATES | TIVARUS, CRISTIAN ALEXANDRU | — |
| 18444221 | PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCTURES | PETERSON, ERIK T | — |
| Art Unit | Apps |
|---|---|
| 2899 | 8 |
| 2898 | 6 |
| 2812 | 5 |
| 2818 | 3 |
| 2896 | 3 |
| 1714 | 2 |
| 2858 | 2 |
| 2893 | 2 |
| 2637 | 1 |
| 2836 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19010521 | AUTOMATED MUTLI-MODAL SENSING SYNCHRONIZATION | KHAN, USMAN A | 2637 | §103 | Non-Final OA | — | Pending | Jan 06, 2025 |
| 18954353 | INDUCTIVE ANGULAR POSITION SENSOR | YENINAS, STEVEN LEE | — | §102§112 | Non-Final OA | — | Pending | Nov 20, 2024 |
| 18891830 | IMPROVED VOLTAGE BUFFER | RETEBO, METASEBIA T | 2836 | §102§103 | Final Rejection | — | Pending | Sep 20, 2024 |
| 18787369 | OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES | MIHALIOV, DMITRI | — | §103 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18766902 | SCINTILLATOR CRYSTAL AND PHOTOMULTIPLIER ASSEMBLIES WITH IMPROVED EMISSION DETECTION | FAYE, MAMADOU | 2884 | §102§103 | Non-Final OA | 28d overdue | Pending | Jul 09, 2024 |
| 18755366 | SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING | MUSE, ISMAIL A | — | §103 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18753608 | OVERLAPPING RETICLE PLACEMENT FOR LITHOGRAPHIC FABRICATION OF A DIE | ASFAW, MESFIN T | 2882 | §102§103 | Final Rejection | — | Pending | Jun 25, 2024 |
| 18732248 | COOLER ASSEMBLY FOR ELECTRONIC MODULES | FENG, ZHENGFU J | 2835 | §102§103§112 | Non-Final OA | — | Pending | Jun 03, 2024 |
| 18668408 | SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH INTERPOSER AND OPPOSING SUBSTRATES | YEUNG LOPEZ, FEIFEI | 2899 | §102§103 | Non-Final OA | — | Pending | May 20, 2024 |
| 18661875 | MANAGING GROWTH OF SILICON CARBIDE CRYSTALS | BRATLAND JR, KENNETH A | 1714 | §103 | Non-Final OA | — | Pending | May 13, 2024 |
| 18649686 | c/o onsemi | CHI, SUBERR L | — | §103 | Non-Final OA | — | Pending | Apr 29, 2024 |
| 18647326 | METHOD OF TESTING A POWER TRANSISTOR | FREDERIKSEN, DAVID B | 2858 | §102§103 | Final Rejection | — | Pending | Apr 26, 2024 |
| 18637126 | OPERATING MODE CONTROL TECHNIQUE FOR POWER FACTOR CORRECTION CIRCUITS | CORDOVA RODRIGUEZ, ULARISLAO | 2838 | §102§103 | Final Rejection | — | Pending | Apr 16, 2024 |
| 18617325 | POWER MODULE WITH OVERLAPPING TERMINALS | MUIR, MATTHEW SINCLAIR | — | §102§103 | Non-Final OA | — | Pending | Mar 26, 2024 |
| 18602261 | IMAGE SENSOR PACKAGES AND RELATED METHODS | ABDELAZIEZ, YASSER A | 2898 | §103 | Non-Final OA | — | Pending | Mar 12, 2024 |
| 18444251 | FLUIDIC-CHANNEL COOLED SUBSTRATES | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103§112 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18444221 | PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCTURES | PETERSON, ERIK T | 2898 | §103§112 | Non-Final OA | — | Pending | Feb 16, 2024 |
| 18441484 | DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES | MUNOZ, ANDRES F | 2818 | §102§103 | Non-Final OA | — | Pending | Feb 14, 2024 |
| 18434625 | JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES USING MONOLITHIC MICROSTRUCTURES | NIEVES, NELSON J | 2899 | §102 | Non-Final OA | — | Pending | Feb 06, 2024 |
| 18430787 | ROTOR FOR INDUCTIVE POSITION SENSOR | ISLA, RICHARD | 2858 | §103 | Non-Final OA | 8d overdue | Pending | Feb 02, 2024 |
| 18397847 | HIGH DNAMIC RANGE OPTICAL SENSOR USING TRENCH CAPACITORS WITH SIDEWALL STRUCTURES | ASSOUMAN, HERVE-LOUIS Y | 2812 | §103 | Final Rejection | 1d overdue | Pending | Dec 27, 2023 |
| 18543644 | WIRE BONDING USING A FLOATING PAD | WALL, VINCENT | 2898 | §103 | Final Rejection | 9d overdue | Pending | Dec 18, 2023 |
| 18538533 | OPTICAL SENSOR PACKAGE | BENTON, CHLOE ELAINE | 2899 | §102§103 | Non-Final OA | — | Pending | Dec 13, 2023 |
| 18534804 | ETCHED DIE SINGULATION SYSTEMS AND RELATED METHODS | MOJADDEDI, OMAR F | 2898 | §102§103 | Non-Final OA | — | Pending | Dec 11, 2023 |
| 18534065 | SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES | HENRY, CALEB E | 2818 | §102 | Final Rejection | 22d | Pending | Dec 08, 2023 |
| 18526088 | ASYMMETRIC OPERATIONAL AMPLIFIER | SHAMIRYAN, NAREH | 2843 | §102§103§112 | Non-Final OA | — | Pending | Dec 01, 2023 |
| 18508551 | SCALABLE POWER SEMICONDUCTOR DEVICE PACKAGE WITH LOW INDUCTANCE | BOOTH, RICHARD A | 2812 | §102§103 | Non-Final OA | — | Pending | Nov 14, 2023 |
| 18558593 | STACKED INTEGRATED CIRCUIT DIES AND INTERCONNECT STRUCTURES | WINTERS, SEAN AYERS | 2892 | §102§103§112 | Final Rejection | — | Pending | Nov 02, 2023 |
| 18491369 | MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES | TIVARUS, CRISTIAN ALEXANDRU | 2899 | §103 | Final Rejection | 4d overdue | Pending | Oct 20, 2023 |
| 18490923 | PLASMA-SINGULATED, CONTAMINANT-REDUCED SEMICONDUCTOR DIE | PETERSON, ERIK T | 2898 | §103§112 | Non-Final OA | 12d | Pending | Oct 20, 2023 |
| 18489961 | SLOTTED CLIPS FOR REDUCTION OF MOLDING COMPOUND DELAMINATION | RAHMAN, MOIN M | 2898 | §102§112 | Non-Final OA | — | Pending | Oct 19, 2023 |
| 18488628 | ARC PREVENTION FOR BONDED WAFERS OF A CHIP STACK | FAN, SU JYA | 2818 | §103 | Non-Final OA | — | Pending | Oct 17, 2023 |
| 18485966 | POWER MODULE PACKAGE HAVING MIRRORED LEADS | NADAV, ORI | 2811 | §103 | Final Rejection | 21d | Pending | Oct 12, 2023 |
| 18473659 | BLACK MASK ON GLASS SYSTEMS AND RELATED METHODS | SELBY, GEVELL V | 2638 | §102 | Final Rejection | 16d | Pending | Sep 25, 2023 |
| 18355171 | COPPER FEATURES AND RELATED METHODS OF FORMING | VALENZUELA, PATRICIA D | 2812 | §103 | Non-Final OA | — | Pending | Jul 19, 2023 |
| 18354863 | TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE | CLINTON, EVAN GARRETT | 2899 | §102§103 | Non-Final OA | — | Pending | Jul 19, 2023 |
| 18350474 | PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE | AHMADI, MOHSEN | 2896 | §102§103 | Final Rejection | 18d overdue | Pending | Jul 11, 2023 |
| 18349440 | SEMICONDUCTOR DEVICE PACKAGE | NIELSEN, DEREK LANG | 2899 | §103§112 | Final Rejection | — | Pending | Jul 10, 2023 |
| 18346976 | DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES | VALENZUELA, PATRICIA D | 2812 | §103 | Final Rejection | — | Pending | Jul 05, 2023 |
| 18313425 | STRUCTURE AND METHOD FOR POWER METAL LINES | PROSTOR, ANDREW VICTOR | 2812 | §103 | Final Rejection | — | Pending | May 08, 2023 |
| 18194811 | CLIPS WITH ALIGNMENT FEATURES AND RELATED METHODS | BOYLE, ABBIGALE A | 2899 | §102§112 | Non-Final OA | — | Pending | Apr 03, 2023 |
| 18193847 | SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS | ARROYO, TERESA M | 2893 | §102§103§112 | Final Rejection | — | Pending | Mar 31, 2023 |
| 18169780 | SEMICONDUCTOR DEVICE HAVING A SUPER JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME | PARENDO, KEVIN A | 2896 | §103 | Final Rejection | 15d | Pending | Feb 15, 2023 |
| 18055123 | POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET | CIESLEWICZ, ANETA B | 2893 | §103 | Final Rejection | 16d overdue | Pending | Nov 14, 2022 |
| 18053796 | SEMICONDUCTOR CRYSTAL GROWTH USING SOURCE POWDER FROM CRUCIBLE WALL | QI, HUA | 1714 | §103§112 | Final Rejection | 16d overdue | Pending | Nov 09, 2022 |
| 17931770 | SIC MOSFET WITH BUILT-IN SCHOTTKY DIODE | WARD, ERIC A | 2891 | §103 | Non-Final OA | 22d | Pending | Sep 13, 2022 |
| 17930111 | IMAGE SENSOR PACKAGES AND RELATED METHODS | LUKE, DANIEL M | 2896 | §102§103§112 | Final Rejection | 6d | Pending | Sep 07, 2022 |
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