DETAILED ACTION
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-15 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Sakamoto et al. (Sakamoto, US 6,562,660 B1).
Regarding claim 1, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A), comprising: a substrate ( substrate 84 shown in FIG. 23A); a first electronic component ( chip 52A/ B in FIG. 8) disposed over the substrate (substrate 84); an interposer ( conductive element 59 in FIG. 23A) disposed over the substrate (substrate 84); a conductive wire (wire 55a) connecting the first electronic component ( chip 52A/B) to the interposer; and a conductive adhesive ( conductive element 51A in FGU. 23A) connecting the interposer to the substrate (substrate 84).
Regarding claim 2, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A), comprising, wherein the conductive adhesive partially covers the interposer (see FIG. 23A).
Regarding claim 3, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A), comprising, wherein the interposer (conductive element 59) comprises a first conductive pad connected to the conductive wire and at least partially exposed by the conductive adhesive (see FIG. 23A).
Regarding claim 4, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A), comprising, wherein a height of the first electronic component (chip 52) is greater than a height of the interposer (conductive element 59).
Regarding claim 5, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A), comprising, wherein the conductive adhesive (conductive element 51) comprises an anisotropic conductive adhesive (product by process).
Regarding claim 6, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A), comprising: wherein the conductive adhesive extends continuously from a lateral sidewall of the first electronic component to a lateral sidewall of the interposer in a cross-sectional view perspective (see FIG. 23 with respect to FIG. 23B).
Regarding claim 7, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A), comprising, wherein an elevation of a contact between the conductive wire and the first electronic component is higher than an elevation of a contact between the conductive wire and the interposer with respect to the substrate (see FIG. 23 with respect to FIG. 23B.
Regarding claim 8, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A), comprising, wherein a second electronic component (chip 52B) disposed over the substrate and flip-chip bonded ( chip 52B in FGI. 13) to the substrate through the conductive adhesive (see FIG.13).
Regarding claim 9, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A), comprising: a substrate (substrate 84); a first electronic component (chip 52) disposed over the substrate (substrate 84), the first electronic component having a first surface facing the substrate and a second surface opposite to the first surface (see FIG. 23A); a second electronic component disposed over the substrate, the second electronic component having a third surface facing the substrate and comprising a first electrode on the third surface (see FIG. 23A with respect to FIG. 13); a conductive wire electrically connecting the second surface to the substrate; a first conductive adhesive connecting the first surface to the substrate; and a second conductive adhesive connecting the first electrode on the third surface to the substrate (see FIG. 13 with respect to FIG. 23A).
Regarding claim 10, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A),comprising an interposer electrically connecting the conductive wire to the substrate (see FIG. 13 with respect to FIG. 23A).
Regarding claim 11, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A),comprising, wherein the first conductive adhesive is between the interposer and the substrate and connected to the interposer and the substrate (see FIG. 13 with respect to FIG. 23A).
Regarding claim 12, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A),comprising, wherein the interposer has a lateral surface, the first conductive adhesive comprises an insulating structure and a conductive portion, and the conductive portion is protruded beyond the lateral surface of the interposer (see FIG. 13 with respect to FIG. 23A).
Regarding claim 13, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A),comprising, wherein the second electronic component further comprises a second electrode connected to the substrate through the second conductive adhesive (see FIG. 13 with respect to FIG. 23A).
Regarding claim 14, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A),comprising, wherein the first electronic component comprises an electrode on the first surface, and the electrode is connected to the substrate through the first conductive adhesive (see FIG. 13 with respect to FIG. 23A).
Regarding claim 15, Sakamoto shows a package structure ( FIG. 2B and FIG. 23A),comprising, wherein the first conductive adhesive is spaced apart from the second conductive adhesive (see FIG. 13 with respect to FIG. 23A).
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 16-20 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Dubin ( US 8,933,473)
Regarding claim 16, Dubin shows a package structure, comprising: a substrate; a light-emitting array disposed over the substrate, the light-emitting array comprising a plurality of first light-emitting elements flip-chip bonded to the substrate and a plurality of second light-emitting elements wire-bonded to the substrate; and a plurality of interposers disposed over the substrate, wherein the second light-emitting elements are wire-bonded to the substrate through the interposers (see FIG. 3D and related text).
Regarding claim 17, Dubin shows a package structure, comprising wherein an elevation of a first light- emitting source of one of the first light-emitting elements is lower than an elevation of a second light-emitting source of one of the second light-emitting elements with respect to the substrate (see FIG. 3D and related text).
Regarding claim 18, Dubin shows a package structure, comprising wherein the one of the first light-emitting elements comprises two electrodes on a same side of the first light-emitting source, and the one of the second light-emitting elements comprises two electrodes on opposite sides of the second light-emitting source see FIG. 3D and related text).
Regarding claim 19, Dubin shows a package structure, comprising wherein one of the first light-emitting elements and one of the second light-emitting elements are adjacent to each other, and one of the interposers connected to the one of the second light-emitting elements is disposed between the one of the first light-emitting elements and the one of the second light-emitting elements from a top view perspective (see FIG. 3D and related text).
Regarding claim 20, Dubin shows a package structure, comprising wherein the one of the second light- emitting elements is closer to the one of the interposers than to the one of the first light- emitting elements (see FIG. 3D and related text).
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ELIAS M ULLAH whose telephone number is (571)272-1415. The examiner can normally be reached M-F at 8AM-5PM EST.
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/ELIAS ULLAH/Primary Examiner, Art Unit 2893
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