Prosecution Insights
Last updated: July 17, 2026
Application No. 18/395,709

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Non-Final OA §103
Filed
Dec 25, 2023
Priority
Oct 19, 2023 — CN 202311356601.1
Examiner
WALL, VINCENT
Art Unit
2898
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
United Microelectronics Corp.
OA Round
1 (Non-Final)
62%
Grant Probability
Moderate
1-2
OA Rounds
2m
Est. Remaining
87%
With Interview

Examiner Intelligence

Grants 62% of resolved cases
62%
Career Allowance Rate
505 granted / 813 resolved
-5.9% vs TC avg
Strong +24% interview lift
Without
With
+24.5%
Interview Lift
resolved cases with interview
Typical timeline
2y 9m
Avg Prosecution
58 currently pending
Career history
862
Total Applications
across all art units

Statute-Specific Performance

§101
0.7%
-39.3% vs TC avg
§103
82.9%
+42.9% vs TC avg
§102
7.1%
-32.9% vs TC avg
§112
7.2%
-32.8% vs TC avg
Black line = Tech Center average estimate • Based on career data from 813 resolved cases

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of Group I, claims 1-10 in the reply filed on March 21, 2026 is acknowledged. Accordingly, claims 11-20 have been withdrawn from consideration. Priority Receipt is acknowledged of certified copies of papers required by 37 CFR 1.55. Information Disclosure Statement As of March 31, 2026, no information disclosure statement has been made of record. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 1-4, 7, and 10 are is/are rejected under 35 U.S.C. 103 as being unpatentable over Sung et al. (US 2015/0179796 A1) (“Sung”), in view of Lu et al. (US 2012/0309171 A1) (“Lu”). Regarding claim 1, Sung teaches at least in figure 1: a gate structure disposed on a substrate (108); a first epitaxial layer (106a; ¶ 0018) disposed in the substrate (102) and at two sides of the gate structure (108); a second epitaxial layer (106b) disposed on the first epitaxial layer (106a); and a cap layer (106c) disposed on the second epitaxial layer (106b). Sung does not teach: wherein an included angle between a surface of the second epitaxial layer and a horizontal direction is 15 degrees to 35 degrees. This is because Sung teaches: The angle can be 90-45 degrees. Lu teaches at least in figure 5: wherein an included angle between a surface of the epitaxial layer (36) and a horizontal direction is 15 degrees to 35 degrees (¶ 0018, where the angle can range from 15-60 degrees). It would have been obvious to one of ordinary skill in the art to combine Lu with Sung as Lu teaches the angle of the epitaxial layer and the horizontal direction results in different faces of the epitaxial layer being exposed. ¶ 0018. Therefore, it would have been obvious to one of ordinary skill in the art to choose the angle of the epitaxial layer to coincide with their choice of which face they want to use on the epitaxial layer. The combination of Lu and Sung would result in: the second epitaxial layer (Sung 106b) having the claimed angle (Lu ¶ 0018). Regarding claim 2, Sung teaches at least in figure 1: wherein an included angle between a surface of the cap layer (106c) and the horizontal direction is 0 degrees to 5 degrees (figure 1 shows the cap layer as flat or 0 degrees). Regarding claim 3, Sung teaches at least in figure 1: wherein a material of the cap layer comprises silicon (¶ 0038 where 106c can be pure silicon epitaxial layer), and a crystal orientation of the surface of the cap layer is (100) (it would have been obvious to one of ordinary skill in the art that 106c could have a crystal orientation of (100). This is because as stated in claim 1 Sung teaches the angle determines which face is presented on top. In addition, (100) single crystal silicon is one of the most commonly used silicon crystal faces. See Sung ¶ 0018, where (100) silicon is used as the substrate. Therefore, it would have been obvious for one of ordinary skill in the art to try and use (100) silicon as this is a well-known face of silicon, and is routinely used.). Regarding claim 4, Sung does not expressly teach: wherein a thickness of the second epitaxial layer (106b) in a direction perpendicular to the horizontal direction is 30 angstroms to 150 angstroms. However, Sung teaches that the total depth of the source/drain region is approximately 300-1000Å. ¶ 0063. Further, Sung teaches the germanium concentration in each layer of the source/drain region is a dependent upon the depth of each source/drain region. Figure 2, and ¶¶ 0023-25. Therefore, it would have been obvious for one of ordinary skill in the art to use routine skill in the art and optimize the depth of the second epitaxial layer and its corresponding Ge concentration based upon the required strain they want each region/layer of the source drain region to have in regards to the channel. ¶¶ 0020-22. Therefore, claim 4 would have been a matter of optimization to one of ordinary skill in the art based upon their requirements for the device of Sung.). Regarding claim 7, Sung teaches at least in figure 1: further comprising (detailed below): a spacer (116) surrounding the gate structure (108). Regarding claim 10, Sung does not teach: wherein a material of the second epitaxial layer comprises silicon germanium, and a crystal orientation of the surface of the second epitaxial layer is (311). However, based upon the analysis of claim 1, it would have been obvious to one of ordinary skill int eh art using Lu that they could have made the second epitaxial layer have the claimed surface plane based upon the angle the top portion of the second epitaxial layer is made to. Claim(s) 5-6, 8-9 are is/are rejected under 35 U.S.C. 103 as being unpatentable over Sung, in view of Lu, in view of Kwok et al. (US 2012/0205715 A1) (“Kwok”). Regarding claim 5, Sung is silent with respect to the limitation: wherein a thickness of the cap layer in a direction perpendicular to the horizontal direction is 100 angstroms to 200 angstroms. Therefore, one of ordinary skill in the art would be motivated to find another reference to teach this thickness. This search would lead them to find Kwok. Kwok is directed to similar technology as Sung, epitaxially grown source/drain regions. Kwok teaches at least in figure 8: wherein a thickness of the cap layer (238) in a direction perpendicular to the horizontal direction is 100 angstroms to 200 angstrom (¶ 0029). It would have been obvious to one of ordinary skill in the art to combine Kwok with Sung for the aforementioned reasons. Regarding claim 6, the combination of references teaches: wherein a total thickness of the second epitaxial layer (Sung 106b) and the cap layer (106c) in a direction perpendicular to the horizontal direction is 130 angstroms to 350 angstroms (This would have been obvious for the reasons stated in claim 4. In addition it would have been obvious based upon the thicknesses given in Kwok, where V3 can be 250-550 angstroms and the thickness of 238 can be 80-200 angstroms. Therefore, Kwok also teaches this limitation). Regarding claim 8, the combination of references teaches: wherein a ratio of a total thickness of the second epitaxial layer and the cap layer in a direction perpendicular to the horizontal direction to a thickness of a sidewall of the spacer in the horizontal direction is 1 to 2 (this limitation is obvious as it is considered an optimization and/or a change in size and proportion of the spacer to the width of the epitaxial layers. This optimization is based upon the distance between the gates. This distance is a standard process variable used in fabricating semiconductors. This standard process variable is based upon the process node used to construct the device of the prior art. See MPEP 2144.04(IV)(A), where the only difference between the prior art and the claims was a recitation of relative dimensions of the claimed device and a device having the claimed relative dimensions would not perform differently than the prior art device, the claimed device was not patentably distinct from the prior art device. Citing Gardner v.TEC Syst., Inc., 725 F.2d 1338 (Fed. Cir. 1984)). Regarding claim 9, Kwok teaches at least in figure 8: wherein a thickness of a sidewall of the spacer (230) in the horizontal direction is 150 angstroms to 200 angstroms (¶ 0013). Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to VINCENT WALL whose telephone number is (571)272-9567. The examiner can normally be reached Monday to Thursday at 7:30am to 2:30pm PST. Interviews can be scheduled on Tuesday thru Thursday at 10am PST or 2pm PST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Jessica Manno can be reached at 571-272-2339. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /VINCENT WALL/Primary Examiner, Art Unit 2898
Read full office action

Prosecution Timeline

Dec 25, 2023
Application Filed
Apr 14, 2026
Non-Final Rejection mailed — §103
Jul 07, 2026
Response Filed

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
62%
Grant Probability
87%
With Interview (+24.5%)
2y 9m (~2m remaining)
Median Time to Grant
Low
PTA Risk
Based on 813 resolved cases by this examiner. Grant probability derived from career allowance rate.

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