Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2816 2822 2838 2893 2898
This examiner grants 62% of resolved cases
Vincent Wall has a substantial record of 827 resolved cases in Art Unit 2816 of Tech Center 2800. The examiner's allowance rate is 62.5 percent, representing a moderate level of difficulty for applicants. This 62.5 percent rate indicates that while the majority of cases are allowed, the examiner requires clear differentiation from the prior art to move an application toward issuance.
The median days to allowance is 1015, which is a typical timeline for reaching a final grant in this technology area. Practitioners can utilize the interview lift of 24.4 percent to improve their outcomes, as direct communication appears to be a productive way to address rejections. This 24.4 percent lift suggests that verbal discussion can effectively resolve technical issues that might otherwise stall prosecution.
Given the 62.5 percent allowance rate and the 1015 day median, an interview is a strategic choice for applicants who want to increase their chances of success. The 24.4 percent lift is high enough to justify the effort of preparing for and conducting an interview. This approach can help clarify the examiner's position and potentially lead to a more efficient path to grant.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18594551 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CIRCUIT | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18390637 | NANOGAP DIELECTRIC MATERIAL | Non-Final OA | Robert Bosch GmbH |
| 18255760 | VERTICAL POWER TRANSISTOR | Non-Final OA | Robert Bosch GmbH |
| 18390103 | METHOD FOR MANUFACTURING A PHASE CHANGE MEMORY DEVICE | Non-Final OA | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18597406 | ANCHORED ENCAPSULATION IN LED DEVICES | Non-Final OA | CreeLED, Inc. |
| 18338404 | MEMORY WITH ONE ACCESS TRANSISTOR COUPLED TO MULTIPLE CAPACITORS | Non-Final OA | Intel Corporation |
| 18089945 | TRANSISTOR INCLUDING WIDE BAND GAP MATERIALS | Final Rejection | Intel Corporation |
| 18064362 | MULTI-PITCH PATTERNING THROUGH ONE-STEP FLOW | Final Rejection | Intel Corporation |
| 18540329 | METHODS FOR FORMING MULTILAYER STRUCTURES ON A SUBSTRATE AND RELATED MULTILAYER STRUCTURES | Final Rejection | ASM IP Holding B.V. |
| 18597186 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Japan Display Inc. |
| 18580309 | DISPLAY APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18707097 | LIGHT EMISSION DEVICE AND IMAGE DISPLAY APPARATUS | Non-Final OA | SONY GROUP CORPORATION |
| 18503801 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18366938 | THIN FILM TRANSISTOR AND METHOD OF MANUFACTRUTING THIN FILM TRANSISTOR | Final Rejection | TOPPAN Inc. |
| 18448703 | SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18647687 | SEMICONDUCTOR DEVICE INCLUDING ELECTRODE AND ISOLATION PATTERN AND METHOD OF FORMING THE SAME | Non-Final OA | SK hynix Inc. |
| 18430647 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18403266 | Memory Circuitry And Method Used In Forming Memory Circuitry | Non-Final OA | Micron Technology, Inc. |
| 18671424 | INTEGRATED CIRCUIT CHIP COMPRISING A RADIOFREQUENCY COMPONENT | Non-Final OA | STMicroelectronics International N.V. |
| 18782061 | FERROELECTRIC MEMORY DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18649262 | Dielectric Frame Structures to Mitigate Lay-Out-Dependent Effect in Semiconductor Devices | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18595429 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18405951 | ONE-TIME-PROGRAMMABLE MEMORY DEVICES WITH HIGH SECURITY AND METHODS OF MANUFACTURING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18402404 | CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18226849 | Methods and Structure for Shielding Semiconductors From Ultraviolet Light | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18299691 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18151141 | SEMICONDUCTOR DEVICE INCLUDING A BLOCKING LAYER | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18597219 | SEMICONDUCTOR DEVICE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18779020 | ACCESS TRANSISTORS IN A DUAL GATE LINE CONFIGURATION AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18597057 | CONTACT CONSTRUCTION FOR SEMICONDUCTOR DEVICES WITH LOW-DIMENSIONAL MATERIALS | Non-Final OA | Applied Materials, Inc. |
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