Prosecution Insights
Last updated: April 19, 2026
Application No. 18/398,919

SUBSTRATE EDGE PATTERNING TECHNIQUES

Final Rejection §103
Filed
Dec 28, 2023
Examiner
PERSAUD, DEORAM
Art Unit
2882
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Onto Innovation Inc.
OA Round
2 (Final)
76%
Grant Probability
Favorable
3-4
OA Rounds
2y 9m
To Grant
88%
With Interview

Examiner Intelligence

Grants 76% — above average
76%
Career Allow Rate
572 granted / 748 resolved
+8.5% vs TC avg
Moderate +12% lift
Without
With
+12.0%
Interview Lift
resolved cases with interview
Typical timeline
2y 9m
Avg Prosecution
36 currently pending
Career history
784
Total Applications
across all art units

Statute-Specific Performance

§101
2.7%
-37.3% vs TC avg
§103
46.3%
+6.3% vs TC avg
§102
34.5%
-5.5% vs TC avg
§112
5.9%
-34.1% vs TC avg
Black line = Tech Center average estimate • Based on career data from 748 resolved cases

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 1-23 are rejected under 35 U.S.C. 103 as being unpatentable over Tanaka et al. [US 5,811,211 A] in view of Fehkuhrer [US 2019/0109034 A1] and further in view of Tsurui et al. [KR 2015/0005522 A]. Regarding claims 1, 12 and 20, Tanaka et al. discloses a panel edge patterning system (Figs. 2, 13, 15, 28) for imaging an edge region of a substrate panel (Figs. 7, 17, 22-24), the panel edge patterning system comprising: a clamp assembly configured to clamp the substrate panel (Col. 39 lines 7-22); and an illumination mask assembly (Col. 6 lines 38-45, see also Fig. 5) coupled to the clamp assembly and configured to expose at least one edge region of a plurality of edge regions of the substrate panel (as shown in Figs. 2, 7, 13, 15, 17, 22-24 and 28), a mask assembly including at least one opening through which light from the light array passes to image the at least one edge region of the substrate panel (as shown in Fig. 5, see also Col. 6 lines 37-44 and Col. 13 line 66-Col. 14 line 5). Tanaka et al does not explicitly teach wherein the illumination mask assembly comprises a light array including a plurality of light sources. However, Fehkuhrer discloses wherein an array of UV light sources (Fig. 2b, item 10’) are preferably individually controlled to expose the peripheral region (8), (paragraph [0086]). Therefore, it would have been obvious to one of ordinary skill in the art to provide an array of UV light sources, as taught by Fehkuhrer in the system of system of Tanaka et al because such a modification provides a suitable alternative light source for exposing the peripheral region with better control (paragraph [0086] of Fehkuhrer). Tanaka et al as modified does not explicitly teach wherein the clamp assembly is configured to clamp at least one edge of the substrate panel. However, Tsurui et al. discloses an exposure apparatus configured with a clamping mechanism (30) between two positions for pinchingly supporting the edge of substrate mounted in stage (Figs. 1, 2, 4, 5, clamp bars 31a-31d, see also paragraph [0030], [0041] and [0050]-[0057]). Therefore, it would have been obvious to one of ordinary skill in the art to provide a clamp assembly configured to clamp at least one edge of the substrate panel, as taught by Tsurui et al. in the system of Tanaka et al as modified because such a modification is a suitable alternative clamping assembly for a substrate panel wherein the deterioration of the quality of mark for position alignment of substrate can be prevented (Tsurui et al.). Regarding claim 2, Tanaka et al. as modified discloses wherein the clamp assembly includes a flange that extends above the substrate panel, and wherein the light array is coupled to the flange; and the mask assembly is coupled to an underside of the light array (Figs. 2, 13, 15, 28, see also Col. 19 lines 20 – Col. 20 lines 37 of Tanaka et al. and paragraph [0086] and Fig. 2b of Fehkuhrer). Regarding claims 3 and 15, Tanaka et al. discloses wherein the mask assembly is selected from a group of mask assemblies (Col. 9 lines 24-43). Regarding claims 4 and 16, Tanaka et al. discloses wherein a proximity of the mask assembly relative to the substrate panel is adjustable (as shown in Fig. 28, see also Col. 22 lines 57-67). Regarding claims 5-7, Tanaka et al. discloses wherein the mask assembly includes a metallic material, wherein the mask assembly includes a non-metallic material, wherein the non-metallic material includes glass (Col. 13 line 66 – Col. 14 line 5). Regarding claims 8-10 and 17-19, Tanaka et al. as modified discloses wherein the illumination mask assembly further includes a diffuser coupled between the light array and the mask assembly, wherein the light array includes a plurality of light emitting diodes, wherein a wavelength of the plurality of light emitting diodes is configurable to correspond with a photoresist material on the substrate panel (Figs. 2, 13, 15, 28, see also Col. 19 lines 20 – Col. 20 lines 37 of Tanaka et al. and paragraph [0086] and Fig. 2b of Fehkuhrer). Regarding claim 11, Tanaka et al. discloses wherein the at least one edge region of the substrate panel includes at least one dummy pattern defined in a layer of the substrate panel (as shown in Figs. 2, 7, 13, 15, 17, 22-24 and 28). Regarding claim 13, Tanaka et al. discloses wherein the at least one other region was previously exposed to ultraviolet (UV) light (Col. 6 lines 46-54). Regarding claim 14, Tanaka et al. discloses exposing a plurality of edge regions of the substrate panel (as shown in Fig. 7). Regarding claim 21, Tanaka et al. as modified discloses further comprising: a controller communicatively coupled to the illumination mask assembly, the controller configured to selectively turn on and off individual light sources of the plurality of light sources based on which region of the substrate panel to be exposed and which region is not to be exposed (Figs. 26 and 27 of Tanaka et al. and paragraph [0086] and Fig. 2b of Fehkuhrer). Regarding claim 22, Tanaka et al. discloses wherein the illumination mask assembly is configured to image a dummy pattern on the at least one edge region to improve current density prior to a plating process (as shown in Figs. 7, 17, 22 and 23). Regarding claim 23, Tanaka et al. as modified discloses wherein the light array is a first light array configured to illuminate a first side of the substrate panel, the panel edge patterning system further comprising: a second light array configured to illuminate a second side of the substrate panel (Figs. 2, 13, 15, 28, see also Col. 19 lines 20 – Col. 20 lines 37 of Tanaka et al. and paragraph [0086] and Fig. 2b of Fehkuhrer). Response to Arguments Applicant’s arguments with respect to claims 1-23 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument. Conclusion Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to DEORAM PERSAUD whose telephone number is (571)270-5476. The examiner can normally be reached M-F 8AM-5PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Minh-Toan Ton can be reached at 571-272-2303. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /DEORAM PERSAUD/Primary Examiner, Art Unit 2882
Read full office action

Prosecution Timeline

Dec 28, 2023
Application Filed
Jun 10, 2025
Non-Final Rejection — §103
Oct 09, 2025
Response Filed
Jan 28, 2026
Final Rejection — §103 (current)

Precedent Cases

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
76%
Grant Probability
88%
With Interview (+12.0%)
2y 9m
Median Time to Grant
Moderate
PTA Risk
Based on 748 resolved cases by this examiner. Grant probability derived from career allow rate.

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