Prosecution Insights
Last updated: July 17, 2026
Application No. 18/406,451

SUBSTRATE SUPPORT WITH PRINTED HEATER

Non-Final OA §102
Filed
Jan 08, 2024
Examiner
BURNS, TREMESHA WILLIS
Art Unit
2847
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Tokyo Electron Limited
OA Round
2 (Non-Final)
78%
Grant Probability
Favorable
2-3
OA Rounds
0m
Est. Remaining
95%
With Interview

Examiner Intelligence

Grants 78% — above average
78%
Career Allowance Rate
673 granted / 867 resolved
+9.6% vs TC avg
Strong +18% interview lift
Without
With
+17.7%
Interview Lift
resolved cases with interview
Typical timeline
2y 6m
Avg Prosecution
54 currently pending
Career history
887
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
47.2%
+7.2% vs TC avg
§102
49.9%
+9.9% vs TC avg
§112
1.8%
-38.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 867 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Response to Amendment Applicant’s arguments with respect to claims 15 – 20 have been considered, and have found to be persuasive. Please find new ground(s) of rejection below. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 15 – 20 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Spielmann et al. (U.S. Patent Publication No. 2016/0205726). Regarding claim 15, in Figure 20, Spielmann discloses a method of fabricating a substrate support, the method comprising: printing a heater material (14, 16, paragraph [0086]) on to a dielectric base layer (44) of the substrate support (46) as thermal traces to form a printed heater (Abstract, paragraph [0001]); and sealing the printed heater within the substrate support by printing a dielectric top layer (56, paragraph [0109]) over the printed heater. Regarding claim 16, Spielmann discloses printing the dielectric base layer on a metal base plate of the substrate support (Figure 20). Regarding claim 17, Spielmann discloses printing a dielectric cover layer over the printed heater; printing an electrically conductive material onto the dielectric cover layer as electrical traces to form a printed electrostatic chuck (ESC) circuit; and wherein sealing the printed heater within the substrate support further comprises printing the dielectric top layer over the printed ESC circuit (Figure 20). Regarding claim 18, Spielmann discloses wherein printing the dielectric base layer, printing the heater material, and sealing the printed heater within the substrate support are all performed in situ within a single processing chamber (Figure 20). Regarding claim 19, Spielmann discloses printing an electrically conductive material as wiring traces to form a printed wiring layer below the printed heater; forming vias in the dielectric base layer electrically coupled to the wiring traces before printing the heater material; and wherein the printed heater comprises a plurality of independently-controllable heater zones electrically coupled to the vias (Figure 20). Regarding claim 20, Spielmann discloses wherein sealing the printed heater within the substrate support further comprises forming a dielectric side layer on exterior sidewalls of the substrate support (Figure 20). Allowable Subject Matter Claims 1 – 14 are allowed. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to TREMESHA W BURNS whose telephone number is (571)270-3391. The examiner can normally be reached Monday-Friday 8am - 4:30 pm EST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Timothy Thompson can be reached at (571) 272-2342. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. TREMESHA W. BURNS Primary Examiner Art Unit 2847 /TREMESHA W BURNS/Primary Examiner, Art Unit 2847
Read full office action

Prosecution Timeline

Jan 08, 2024
Application Filed
Oct 22, 2025
Non-Final Rejection mailed — §102
Jan 08, 2026
Response Filed
May 12, 2026
Non-Final Rejection mailed — §102 (current)

Precedent Cases

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

2-3
Expected OA Rounds
78%
Grant Probability
95%
With Interview (+17.7%)
2y 6m (~0m remaining)
Median Time to Grant
Moderate
PTA Risk
Based on 867 resolved cases by this examiner. Grant probability derived from career allowance rate.

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