Prosecution Insights
Last updated: July 17, 2026
Application No. 18/409,829

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Non-Final OA
Filed
Jan 11, 2024
Examiner
PRASAD, NEIL R
Art Unit
2897
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Taiwan Semiconductor Manufacturing Company, Ltd.
OA Round
1 (Non-Final)
85%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
95%
With Interview

Examiner Intelligence

Grants 85% — above average
85%
Career Allowance Rate
607 granted / 711 resolved
+17.4% vs TC avg
Moderate +10% lift
Without
With
+9.5%
Interview Lift
resolved cases with interview
Typical timeline
2y 2m
Avg Prosecution
20 currently pending
Career history
731
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
82.5%
+42.5% vs TC avg
§102
10.3%
-29.7% vs TC avg
§112
0.4%
-39.6% vs TC avg
Black line = Tech Center average estimate • Based on career data from 711 resolved cases

Prosecution Timeline

Jan 11, 2024
Application Filed
May 04, 2026
Non-Final Rejection mailed (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12685211
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
3y 1m to grant Granted Jul 14, 2026
Patent 12672557
CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
2y 11m to grant Granted Jun 30, 2026
Patent 12672523
System and Method for Die Crack Detection in Wafer-to-Wafer Bonding
2y 11m to grant Granted Jun 30, 2026
Patent 12666988
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CAVITY-EMBEDDED CUBES AND LOGIC-SUPPORTING INTERPOSERS
3y 10m to grant Granted Jun 23, 2026
Patent 12666970
SEMICONDUCTOR PACKAGE
3y 9m to grant Granted Jun 23, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
85%
Grant Probability
95%
With Interview (+9.5%)
2y 2m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 711 resolved cases by this examiner. Grant probability derived from career allowance rate.

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