Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 1713 2811 2822 2897 4134
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18747798 | SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18736075 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18416530 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18735179 | METHOD OF MANUFACTURING HEAT DISSIPATION ADHESIVE LAYER FOR DISPLAY DEVICE AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18604452 | ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE | Final Rejection | InnoLux Corporation |
| 18233732 | QUANTUM CHIP AND METHOD FOR PREPARING THE SAME | Non-Final OA | Tencent Technology (Shenzhen) Company Limited |
| 17484213 | CONFORMAL POWER DELIVERY STRUCTURES | Non-Final OA | Intel Corporation |
| 18624084 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 17894095 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18621229 | METHOD AND WAFER PROCESSING SYSTEM FOR WET ETCHING A SEMICONDUCTOR WAFER | Non-Final OA | Tokyo Electron Limited |
| 18114653 | SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE MODULE INCLUDING THE SAME | Final Rejection | Infineon Technologies Austria AG |
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