Tech Center 4100 • Art Units: 2811 2822 2897 4134
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18655879 | INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18320527 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co. Ltd. |
| 19072087 | SCALABLE ELECTRONICS MANUFACTURING WITH RIGID TILE PANEL EMBEDDING | Non-Final OA | THE FLORIDA INTERNATIONAL UNIVERSITY BOARD OF TRUSTEES |
| 17966530 | SEMICONDUCTOR DEVICES AND METHODS OF MAKING SAME | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17924814 | Electronic Device and Chip Packaging Method | Final Rejection | Honor Device Co., Ltd. |
| 17889404 | PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18077763 | OLED DISPLAY PANEL AND PREPARATION METHOD THEREFOR | Non-Final OA | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 17654886 | FILM DEPOSITION AND TREATMENT PROCESS FOR SEMICONDUCTOR DEVICES | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17822405 | SIDEWALL PROTECTED IMAGE SENSOR PACKAGE | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18330233 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18154353 | Thermal Enhanced Power Semiconductor Package | Final Rejection | Wolfspeed, Inc. |
| 17972484 | PRINTED DEVICES IN CAVITIES | Non-Final OA | X-Celeprint Limited |
| 18447466 | PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLICATION MANUFACTURING METHOD THEREOF | Final Rejection | SOONER POWER SEMICONDUCTOR CO., LTD. |
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