Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 1713 2811 2822 2897 4134
This examiner grants 85% of resolved cases
Neil R. Prasad is an examiner in Tech Center 4100, Art Unit 1713, with 718 resolved cases. He has a high allowance rate of 85.4 percent. The median time to allowance is 825 days, which is quite efficient for patent prosecution. This combination of speed and a high grant rate makes for a very favorable environment for applicants.
The interview lift for this examiner is 9.8 percent. This suggests that while the 85.4 percent allowance rate is already high, an interview can still provide a meaningful boost to clear any remaining obstacles. Practitioners should focus on high-quality initial filings to take advantage of the 825-day median pendency. With 718 resolved cases, the examiner's high allowance rate is well-established. This data suggests that the written record is the most effective way to secure a grant in Tech Center 4100.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18823988 | SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18765648 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18736075 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18353279 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18735179 | METHOD OF MANUFACTURING HEAT DISSIPATION ADHESIVE LAYER FOR DISPLAY DEVICE AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18604452 | ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 17484213 | CONFORMAL POWER DELIVERY STRUCTURES | Non-Final OA | Intel Corporation |
| 18624084 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18233732 | QUANTUM CHIP AND METHOD FOR PREPARING THE SAME | Final Rejection | Tencent Technology (Shenzhen) Company Limited |
| 18731542 | TESTING STRUCTURE FOR SEMICONDUCTOR DEVICES | Non-Final OA | International Business Machines Corporation |
| 18114653 | SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE MODULE INCLUDING THE SAME | Non-Final OA | Infineon Technologies Austria AG |
| 17966530 | SEMICONDUCTOR DEVICES AND METHODS OF MAKING SAME | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18765356 | PACKAGE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18740881 | SEMICONDUCTOR PACKAGE STRUCTURE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18456782 | Thermal Enhanced Power Semiconductor Package | Final Rejection | Wolfspeed, Inc. |
| 18154353 | Thermal Enhanced Power Semiconductor Package | Non-Final OA | Wolfspeed, Inc. |
| 18669994 | STRUCTURE AND SOLID-STATE IMAGING DEVICE | Non-Final OA | Mitsubishi Chemical Corporation |
| 18784161 | METHOD FOR PRODUCING AN ADVANCED SUBSTRATE FOR HYBRID INTEGRATION | Non-Final OA | Soitec |
| 18825422 | ORGANIC ELECTROLUMINESCENT DEVICES | Non-Final OA | Universal Display Corporation |
| 18675462 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd. |
| 18783128 | METHOD FOR FORMING WET OXIDATION APERTURE SHAPE OF VCSEL DEVICE | Non-Final OA | Taiwan-Asia Semiconductor Corporation |
| 17790457 | IMAGING SYSTEM HAVING MICROLENS AND PHOTO-ELECTRIC DEVICE AND MANUFACTURING METHOD | Non-Final OA | ChangXin Memory Technologies, Inc. |
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