Prosecution Insights
Prosecution Insights
Tech Center 4100 • Art Units: 2811 2822 2897 4134
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18361482 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18320527 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co. Ltd. |
| 17966530 | SEMICONDUCTOR DEVICES AND METHODS OF MAKING SAME | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17924814 | Electronic Device and Chip Packaging Method | Final Rejection | Honor Device Co., Ltd. |
| 17992185 | POWER SEMICONDUCTOR MODULE AND METHOD OF PRODUCING A POWER SEMICONDUCTOR MODULE | Non-Final OA | Infineon Technologies AG |
| 17894095 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17889404 | PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17654886 | FILM DEPOSITION AND TREATMENT PROCESS FOR SEMICONDUCTOR DEVICES | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17822405 | SIDEWALL PROTECTED IMAGE SENSOR PACKAGE | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18330233 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18456782 | Thermal Enhanced Power Semiconductor Package | Non-Final OA | Wolfspeed, Inc. |
| 18154353 | Thermal Enhanced Power Semiconductor Package | Final Rejection | Wolfspeed, Inc. |
| 17972484 | PRINTED DEVICES IN CAVITIES | Non-Final OA | X-Celeprint Limited |
| 18221510 | CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | Zhuhai ACCESS Semiconductor Co., Ltd |
| 18112590 | MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION PLATE AND PREPARATION METHOD THEREOF | Non-Final OA | SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD |
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