DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of Invention I claims 1-12 in the reply filed on 06/05/2026 is acknowledged.
Foreign Priority
Acknowledgment is made of applicant’s claim for foreign priority under 35 U.S.C. 119 (a)-(d). The certified copy has been filed in parent Application No. KR10-2023-0069262, filed on 05/30/2023.
Information Disclosure Statement
The information disclosure statement (IDS) submitted on 01/22/2024 is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner.
Claim Rejections - 35 USC § 103
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claims 1-3, 10, and 12 are rejected under U.S.C. 103 as being unpatentable over Kim et al.; US 2023/0217692 A1; 12/2022 in view of Lee et al.; US 2021/0200357 A1; 12/2020
Claim 1: Kim ( ‘692 ) discloses a display device comprising: a first pixel electrode ( Fig. 2: first electrode 114 ) disposed on a substrate ( Fig. 2: substrate 110 ); an inorganic insulating layer ( Fig. 2: gate insulating layer 111a; see [0036] to verify it is inorganic ) disposed on the substrate ( Fig 2: #110 ) and exposing the first pixel electrode ( Fig. 2 #114 ); a first light emitting layer ( Fig. 2: light emitting layer 116 ) disposed on the first pixel electrode ( Fig. 2 #114 ); a first common electrode ( Fig. 2: second electrode 117 ) disposed on the first light emitting layer ( Fig 2 #116 ); a first bank layer ( Fig. 2: bank 115 ) disposed on the inorganic insulating layer ( Fig. 2 #111a ); a second bank layer ( Fig. 2 second bank 1152 ) disposed on the first bank layer ( Fig. 2 first bank 1151 ) and including side surfaces ( as shown in Fig. 2 angled sides of the 1152 layer ) protruding more than side surfaces ( as shown in Fig. 2 side surfaces of 1152 are above 1151 ) of the first bank layer ( Fig. 2 #1151 ); and a first inorganic encapsulation layer ( Fig. 2 encapsulation layer 118; as described in [0068] is inorganic ) disposed on an upper surface of the first common electrode ( Fig. 2 second electrode 117 ), the side surfaces of the first bank layer ( Fig. 2 #1151 ), and a lower surface ( as shown in Fig. 2 ) and the side surfaces of the second bank layer ( Fig. 2 #1152 ), the first inorganic encapsulation layer ( Fig. 2 #118 ) spaced apart from the side surfaces of the second bank layer ( Fig. 2 #1152 ).
Kim ( ‘692 ) does not appear to disclose a maximum distance from an upper surface of the substrate to an upper surface of the second bank layer is greater than or equal to a maximum distance from the upper surface of the substrate to an upper surface of the first inorganic encapsulation layer.
However, Lee teaches a maximum distance from an upper surface of the substrate ( Fig. 5 substrate 100 ) to an upper surface of the second bank layer ( Fig. 5 second bank insulating film 180 ) is greater than or equal to a maximum distance from the upper surface of the substrate ( Fig. 5 #100 ) to an upper surface of the first inorganic encapsulation layer ( Fig. 5 first encapsulation film 160; paragraph [0016] establishes the encapsulation layer is inorganic ).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Lee with Kim ( ‘692 ) to implement a maximum distance from an upper surface of the substrate to an upper surface of the second bank layer is greater than or equal to a maximum distance from the upper surface of the substrate to an upper surface of the first inorganic encapsulation layer because this is a convergence point for optical, mechanical, and process optimization.
Claim 2: Kim ( ‘692 ) and Lee disclose the display device of claim 1 ( as discussed above).
Kim ( ‘692 ) does not appear to disclose the first inorganic encapsulation layer comprises: a first portion disposed on the upper surface of the first common electrode, and a second portion spaced apart from the side surfaces of the second bank layer, and the first portion of the first inorganic encapsulation layer and the second portion of the first inorganic encapsulation layer are connected to each other.
However, Lee teaches the first inorganic encapsulation layer ( Fig. 5 #160 ) comprises: a first portion disposed on the upper surface of the first common electrode ( Fig. 5 second electrode 153 ), and a second portion spaced apart ( as shown in Fig. 5 left side of figure ) from the side surfaces of the second bank layer ( Fig. 5 #180 ), and the first portion of the first inorganic encapsulation layer ( Fig. 5 #160 ) and the second portion of the first inorganic encapsulation layer ( Fig. 5 #160 ) are connected to each other ( as shown in Fig. 5 #160 is one continuous layer ).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Lee with Kim ( ‘692 ) to implement the first inorganic encapsulation layer comprises: a first portion disposed on the upper surface of the first common electrode, and a second portion spaced apart from the side surfaces of the second bank layer, and the first portion of the first inorganic encapsulation layer and the second portion of the first inorganic encapsulation layer are connected to each other because this approach balances performance, defect mitigation, and mechanical flexibility.
Claim 3: Kim ( ‘692 ) and Lee disclose the display device of claim 2 ( as discussed above).
Kim ( ‘692 ) does not appear to disclose a first filler disposed in a groove defined by the first portion of the first inorganic encapsulation layer and the second portion of the first inorganic encapsulation layer.
However, Lee teaches a first filler ( Fig. 5: planarization film 170; on left side of Fig. 5 where the two portions of 160 meet ) disposed in a groove ( Fig. 5: edge of where 160 overlaps 153 ) defined by the first portion of the first inorganic encapsulation layer and the second portion of the first inorganic encapsulation layer (Fig. 5 #160 ).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Lee with Kim ( ‘692 ) to implement a first filler disposed in a groove defined by the first portion of the first inorganic encapsulation layer and the second portion of the first inorganic encapsulation layer because this approach locally relieves mechanical stress, prevents defects from trapped bubbles, provides planar support for upper layers, and enhances encapsulation performance.
Claim 10: Kim ( ‘692 ) and Lee disclose the display device of claim 1 ( as discussed above).
Kim ( ‘692 ) teaches an upper surface of the first bank layer ( Fig. 2 bank 115 ) does not overlap the first inorganic encapsulation layer ( Fig. 2 encapsulation layer 118 ) in a direction perpendicular to the substrate ( as shown in Fig. 2 ).
Claim 12: Kim ( ‘692 ) and Lee disclose the display device of claim 1 ( as discussed above ).
Kim ( ‘692 ) does not appear to disclose the first inorganic encapsulation layer comprises one or more of silicon nitrate (SiNx), silicon oxynitride (SiOxNy), and silicon oxide (SiOx).
However, Lee teaches the first inorganic encapsulation layer comprises one or more of silicon nitrate (SiNx), silicon oxynitride (SiOxNy), and silicon oxide (SiOx) ( [0106] the first encapsulation film 160 can be formed of at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, and titanium oxide ).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Kim ( ‘692 ) with Lee to implement the first inorganic encapsulation layer comprises one or more of silicon nitrate (SiNx), silicon oxynitride (SiOxNy), and silicon oxide (SiOx) because this material provides robust impermeability against moisture and oxygen.
Claim 6 is rejected under U.S.C. 103 as being unpatentable over Kim et al.; US 2023/0217692 A1; 12/2022 in view of Lee et al.; US 2021/0200357 A1; 12/2020 as it relates to claim 2 above and further in view of Li; US 2022/0037618 A1; 04/2020
Claim 6: Kim ( ‘692 ) and Lee disclose the display device of claim 2 ( as discussed above ).
Kim ( ‘692 ) does not appear to disclose the first inorganic encapsulation layer further comprises: a third portion extending from the second portion and contacting a lower surface of the second bank layer, a fourth portion extending from the first portion and the third portion and contacting the side surfaces of the first bank layer, and a cavity surrounded by the first, second, third, and fourth portions of the first inorganic encapsulation layer.
Lee discloses the first inorganic encapsulation layer ( Fig. 5 #160 ) further comprises: a third portion ( as shown in Fig. 5 portion past the second ) extending from the second portion ( as shown in Fig. 5 left side of figure ) and contacting a lower surface of the second bank layer ( Fig. 5 second bank insulating film 180; as described in [0108] ), a fourth portion extending from the first portion and the third portion and contacting the side surfaces of the first bank layer ( Fig. 5 first bank insulating film 155 ).
Lee does not appear to disclose a cavity surrounded by the first, second, third, and fourth portions of the first inorganic encapsulation layer.
However, Li teaches a cavity ( as shown in Fig. 1 ) surrounded by the first, second, third, and fourth portions of the first inorganic encapsulation layer ( Fig. 1 inorganic encapsulation layers 15 ).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Li with Kim ( ‘692 ) and Lee to implement the first inorganic encapsulation layer further comprises: a third portion extending from the second portion and contacting a lower surface of the second bank layer, a fourth portion extending from the first portion and the third portion and contacting the side surfaces of the first bank layer, and a cavity surrounded by the first, second, third, and fourth portions of the first inorganic encapsulation layer because this approach relieves mechanical stress and increases bending durability, enhances hermetic sealing against moisture and oxygen, and ensures adhesion and compatibility.
Claim 7 is rejected under U.S.C. 103 as being unpatentable over Kim et al.; US 2023/0217692 A1; 12/2022 in view of Lee et al.; US 2021/0200357 A1; 12/2020 as it relates to claim 3 above and further in view of Tian et al.; US 2024/0306465 A1; 03/2022
Claim 7: Kim ( ‘692 ) and Lee disclose the display device of claim 3 ( as discussed above).
Neither Kim ( ‘692 ) nor Lee appear to disclose an upper surface of the first filler is aligned with the upper surface of the first inorganic encapsulation layer to form a flat surface.
However, Tian teaches an upper surface of the first filler ( Fig. 4 filler layer 40 ) is aligned with the upper surface of the first inorganic encapsulation layer ( Fig. 4 thin film encapsulation layer 30 ; inorganic encapsulation described in [0048] ) to form a flat surface.
It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Tian with Kim ( ‘692 ) and Lee to implement an upper surface of the first filler is aligned with the upper surface of the first inorganic encapsulation layer to form a flat surface because this approach achieves optimal interfacial bonding, mechanical performance, and barrier integrity
Claim 8 is rejected under U.S.C. 103 as being unpatentable over Kim et al.; US 2023/0217692 A1; 12/2022 in view of Lee et al.; US 2021/0200357 A1; 12/2020 as it relates to claim 3 above and further in view of Cha et al.; US 2015/0243853 A1; 10/2014
Claim 8: Kim ( ‘692 ) and Lee disclose the display device of claim 3 ( as discussed above).
Neither Kim ( ‘692 ) nor Lee appear to disclose the first filler comprises spin-on-glass.
However, Cha teaches the first filler comprises spin-on-glass ( Fig. 11 insulating filler 336; described in [0049] ).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Cha with Kim ( ‘692 ) and Lee to implement the first filler comprises spin-on-glass because this material improves gap-filling, planarizing, and is low-stress and cost-effective.
Claim 9 is rejected under U.S.C. 103 as being unpatentable over Kim et al.; US 2023/0217692 A1; 12/2022 in view of Lee et al.; US 2021/0200357 A1; 12/2020 and Cha et al.; US 2015/0243853 A1; 10/2014 as it relates to claim 8 above and further in view of Tian et al.; US 2024/0306465 A1; 03/2022
Claim 9: Kim ( ‘692 ), Lee, and Cha disclose the display device of claim 8 ( as discussed above ).
Neither Kim ( ‘692 ) nor Lee nor Cha appear to disclose a refractive index of the first filler is in a range of about 1.45 to about 1.60.
However, Tian teaches a refractive index of the first filler is in a range of about 1.45 to about 1.60 ( a refractive index of the first filler is in a range of about 1.45 to about 1.60 ).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Tian with Kim ( ‘692 ), Leem and Cha to implement a refractive index of the first filler is in a range of about 1.45 to about 1.60 because this range optically matches the surrounding layers, reduces reflections, and maintains high light efficiency.
Claim 11 is rejected under U.S.C. 103 as being unpatentable over Kim et al.; US 2023/0217692 A1; 12/2022 in view of Lee et al.; US 2021/0200357 A1; 12/2020 as it relates to claim 1 above and further in view of Kim et al.; US 12701845 B2; 10/2022
Claim 11: Kim ( ‘692 ) and Lee disclose the display device of claim 1 ( as discussed above ).
Neither Kim ( ‘692 ) nor Lee appear to disclose the first bank layer comprises aluminum (Al) , and the second bank layer comprises titanium (Ti) or molybdenum (Mo).
However, Kim ( ‘845 ) teaches the first bank layer comprises aluminum (Al) ( Col. 17 lines 55 – 61 the first bank BNK1 may include various kinds of inorganic insulating materials, including silicon oxide (SiO.sub.x), silicon nitride (SiN.sub.x), silicon oxynitride (SiO.sub.xN.sub.y), aluminum nitride (AlN.sub.x), aluminum oxide (AlO.sub.x), zirconium oxide (ZrO.sub.x), hafnium oxide (HfO.sub.x), and/or titanium oxide (TiO.sub.x) ) , and the second bank layer comprises titanium (Ti) or molybdenum (Mo) ( Col. 18 lines 5 – 11 the second bank BNK2 may include various kinds of inorganic insulating materials, including silicon oxide (SiO.sub.x), silicon nitride (SiN.sub.x), silicon oxynitride (SiO.sub.xN.sub.y), aluminum nitride (AlN.sub.x), aluminum oxide (AlO.sub.x), zirconium oxide (ZrO.sub.x), hafnium oxide (HfO.sub.x), and/or titanium oxide (TiO.sub.x) ).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention, to utilize the teachings of Kim ( ‘845 ) with Kim ( ‘692 ) and Lee to implement the first bank layer comprises aluminum (Al) , and the second bank layer comprises titanium (Ti) or molybdenum (Mo) because these materials are selected for conductivity and cost as well as barrier and adhesion properties respectively.
Allowable Subject Matter
Claims 4-5 objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Conclusion
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/K.N.F./Examiner, Art Unit 2817
/ALI NARAGHI/Primary Examiner, Art Unit 2817