Prosecution Insights
Last updated: July 05, 2026
Application No. 18/440,435

DIE SHAPE CONTROL FOR DIE TO WAFER BOND ENHANCEMENT

Non-Final OA
Filed
Feb 13, 2024
Examiner
BLACKWELL, ASHLEY NICOLE
Art Unit
2897
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Tokyo Electron Limited
OA Round
1 (Non-Final)
98%
Grant Probability
Favorable
1-2
OA Rounds
1y 0m
Est. Remaining
99%
With Interview

Examiner Intelligence

Grants 98% — above average
98%
Career Allowance Rate
59 granted / 60 resolved
+30.3% vs TC avg
Minimal +3% lift
Without
With
+2.9%
Interview Lift
resolved cases with interview
Typical timeline
3y 5m
Avg Prosecution
34 currently pending
Career history
95
Total Applications
across all art units

Statute-Specific Performance

§103
92.4%
+52.4% vs TC avg
§102
4.3%
-35.7% vs TC avg
§112
3.3%
-36.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 60 resolved cases

Prosecution Timeline

Feb 13, 2024
Application Filed
Apr 17, 2026
Non-Final Rejection mailed (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12672334
CONDUCTIVE VIA BAR SELF-ALIGNED TO GATE END
5y 0m to grant Granted Jun 30, 2026
Patent 12666593
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
4y 0m to grant Granted Jun 23, 2026
Patent 12666834
SEGMENTED OLED
3y 1m to grant Granted Jun 23, 2026
Patent 12660261
CROSS-COUPLING CONNECTIONS FOR STACKED FIELD EFFECT TRANSISTORS
4y 1m to grant Granted Jun 16, 2026
Patent 12653026
POWER SEMICONDUCTOR DEVICES INCLUDING MULTIPLE GATE BOND PADS
4y 2m to grant Granted Jun 09, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
98%
Grant Probability
99%
With Interview (+2.9%)
3y 5m (~1y 0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 60 resolved cases by this examiner. Grant probability derived from career allowance rate.

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