DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1-10 and 15-20 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being incomplete for omitting an element deemed essential by the examiner, such omission amounting to a gap between the elements. See MPEP § 2172.01.
The omitted element is:
the “adhesion layer 206 over and/or on the substrate 204” as:
described in paragraphs [0029], [0039], [0040], [0065], [0066], and [0070]; and
illustrated in Figures 2, 3, 6C, 6D, 6E, 6F, 6G, 6H, 6I, 6J, 6K, 6L, and 6M.
Claims 11-15 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being incomplete for omitting a step deemed essential by the examiner, such omission amounting to a gap between the steps. See MPEP § 2172.01.
The omitted step is:
forming an “adhesion layer 206 over and/or on the substrate 204” as:
described in paragraphs [0029], [0039], [0040], [0065], [0066], and [0070]; and
illustrated in Figures 2, 3, 6C, 6D, 6E, 6F, 6G, 6H, 6I, 6J, 6K, 6L, and 6M.
Allowable Subject Matter
Claims 1-20 are objected to as being rejected under 35 U.S.C. § 112(b) or 35 U.S.C. § 112 (pre-AIA ), second paragraph, but would be allowable if rewritten with the omitted elements and steps, respectively.
The following is a statement of reasons for the indication of allowable subject matter.
The prior art of record, taken alone or in combination, does not teach or suggest a piezoelectric device as recited by independent claim 1, comprising:
an adhesion layer over a substrate;
a first electrode over adhesion layer;
a first piezoelectric layer on the first electrode;
a first portion of a second electrode on the first piezoelectric layer;
a diffusion barrier layer on the first portion of the second electrode;
a second portion of the second electrode on the diffusion barrier layer;
a second piezoelectric layer on the second portion of the second electrode; and
a third electrode on the second piezoelectric layer.
The prior art of record, taken alone or in combination, does not teach or suggest a method as recited by independent claim 8, comprising the steps of:
forming an adhesion layer over a substrate;
forming a first electrode of a piezoelectric device over the adhesion layer and the substrate of a semiconductor device;
forming a first seed layer of a first piezoelectric layer on the first electrode;
forming a main layer of the first piezoelectric layer on the first seed layer;
forming a first portion of a second electrode on the first piezoelectric layer;
forming a diffusion barrier layer on the first portion of the second electrode;
forming a second portion of the second electrode on the diffusion barrier layer;
forming a second seed layer of a second piezoelectric layer on the second portion of the second electrode;
forming a main layer of the second piezoelectric layer on the second seed layer; and
forming a third electrode on the second piezoelectric layer.
The prior art of record, taken alone or in combination, does not teach or suggest a piezoelectric device as recited by independent claim 15, comprising:
an adhesion layer over a substrate;
a first electrode over adhesion layer;
a first piezoelectric layer on the first electrode;
a first portion of a second electrode on the first piezoelectric layer; a lead-blocking layer on the first portion of the second electrode, wherein the lead-blocking layer comprises a multiple-layer stack;
a second portion of the second electrode on the lead-blocking layer;
a second piezoelectric layer on the second portion of the second electrode; and
a third electrode on the second piezoelectric layer.
Dependent claims 2-7, 9-14, and 16-20 are considered allowable due to their respective dependence on allowed independent claims 1, 8, and 15.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to PEDRO J CUEVAS whose telephone number is (571)272-2021. The examiner can normally be reached 9:00 AM - 6:00 PM.
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/PEDRO J CUEVAS/Primary Examiner, Art Unit 2834 June 2, 2026
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