DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of Group I in the reply filed on 03/02/2026 is acknowledged.
Claims 8-20 are cancelled pursuant to Applicant’s amendment filed on 03/02/2026. Election was made without traverse in the reply filed on 03/02/2026.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1 and 7 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Hsu (US-20200411576-A1).
Regarding claim 1, Hsu teaches an image sensor package (Fig.1 2; ¶0041) comprising:
an optically transmissive cover (Fig.1 6; ¶0042) comprising a groove (Fig.1 20; ¶0044) along an entire perimeter (see Fig.2) of the optically transmissive cover (6);
an image sensor die (Fig.1 4; ¶0042);
an adhesive material (¶0040) coupling the optically transmissive cover (6) to the image sensor die (4); and
a mold compound (Fig.1 16; ¶0042) contacting sidewalls of the image sensor die (4), contacting the adhesive material (¶0040), and extending into the groove (20).
Regarding claim 7, Hsu teaches the package of claim 1, wherein the groove (20) is located adjacent a largest planar side (top center surface) of the optically transmissive cover (6) that is opposite a largest planar side (bottom surface) that faces the image sensor die (4).
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
Claim(s) 2-5 is/are rejected under 35 U.S.C. 103 as being unpatentable over Hsu in view of Lee et al. (US-20250038058-A1 – hereinafter Lee).
Regarding claim 2, Hsu teaches the package of claim 1.
Hsu does not teach the package further comprising a substrate coupled to the image sensor die.
Lee teaches a substrate (Fig.2j 120; ¶0052 of Lee) for coupling electronic components through both land grid array connections and conductive bumps (¶0052 of Lee).
It would be obvious to attach the image sensor package of Hsu (2 of Hsu) to a substrate like that of Lee (120 of Lee) with either land grid array or ball grid array (conductive bumps) connections for various applications. Substrates and both package connection types are well known in the art.
Regarding claim 3, the aforementioned combination of Hsu in view of Lee from claim 2 teaches the package of claim 2, wherein the substrate (120 of Lee) comprises a ball grid array (¶0052 of Lee).
Regarding claim 4, the aforementioned combination of Hsu in view of Lee from claim 2 teaches the package of claim 2, wherein the substrate (120 of Lee) comprises a land grid array (¶0052 of Lee).
Regarding claim 5, the aforementioned combination of Hsu in view of Lee from claim 2 teaches the package of claim 2, wherein an outer edge of the package (2 of Hsu) comprises only mold compound (16 of Hsu) and the substrate (120 of Lee).
Claim(s) 6 is/are rejected under 35 U.S.C. 103 as being unpatentable over Hsu in view of Punzalan et al. (US-20220093664-A1 – hereinafter Punzalan).
Regarding claim 6, Hsu teaches the package of claim 1.
Hsu does not teach wherein a plurality of wire bonds are located in the adhesive material.
Punzalan teaches an image sensor package (Fig.1b; ¶0017 of Punzalan) with a sensor die (Fig.1b 130; ¶0022 of Punzalan) having wire bonds (Fig.1b 164; ¶0026 of Punzalan) located in an adhesive (Fig.1b 143; ¶0029 of Punzalan).
It would have been obvious to one of ordinary skill in the art, before the effective filing date of the claimed invention, to have the image sensor die of Hsu (4 of Hsu) connected with wire bonds (164 of Punzalan) to arrive at the claimed invention. This modification is obvious because it is a matter of design choice, and the modified wire bonds (164 of Punzalan) must pass through the adhesive (¶0040 of Hsu) to be implemented.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to THADDEUS J KOLB whose telephone number is (571)272-0276. The examiner can normally be reached Monday - Friday, 8:30am - 5:00pm.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Eliseo Ramos-Feliciano can be reached at (571) 272-7925. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/T.J.K./ Examiner, Art Unit 2817
/ELISEO RAMOS FELICIANO/Supervisory Patent Examiner, Art Unit 2817
Prosecution Insights