Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2817
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18231341 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17878355 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 17854998 | ELECTROSTATIC DISCHARGE PROTECTION DEVICES WITH HIGH CURRENT CAPABILITY | Final Rejection | Texas Instruments Incorporated |
| 17993014 | DISPLAY PANEL | Non-Final OA | Samsung Display Co., LTD. |
| 17946676 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17932735 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | InnoLux Corporation |
| 18342424 | CONDUCTIVE PASTE, WIRING SUBSTRATE, LIGHT-EMITTING DEVICE,AND MANUFACTURING METHOD THEREOF | Non-Final OA | NICHIA CORPORATION |
| 17944854 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | NICHIA CORPORATION |
| 17957403 | HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES | Non-Final OA | Intel Corporation |
| 17891654 | IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES | Non-Final OA | Intel Corporation |
| 17888775 | 3D STACKABLE SYNAPSE STRING, 3D STACKABLE SYNAPSE ARRAY USING THE STRING AND METHOD OF FABRICATING THE STRING | Final Rejection | Seoul National University R&DB FOUNDATION |
| 18461538 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17892344 | SEMICONDUCTOR PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17992959 | DISPLAY PANEL AND SPLICING PANEL | Non-Final OA | TCL China Star Optoelectronics Technology Co., Ltd. |
| 18242991 | MOLDED CORE SUBSTRATE FOR EMBEDDING COMPONENTS | Non-Final OA | Advanced Micro Devices, Inc. |
| 17873521 | Semiconductor Package Interconnection Structure | Non-Final OA | Avago Technologies International Sales Pte. Limited |
| 18456906 | UNSINGULATED SEMICONDUCTOR PACKAGE | Non-Final OA | Sandisk Technologies, Inc. |
| 17821168 | FAN-OUT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | POWERTECH TECHNOLOGY INC. |
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