Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2817
This examiner grants 83% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18231341 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18023443 | DISPLAY SUBSTRATE, METHOD FOR FORMING THE SAME AND DISPLAY DEVICE | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18342424 | CONDUCTIVE PASTE, WIRING SUBSTRATE, LIGHT-EMITTING DEVICE,AND MANUFACTURING METHOD THEREOF | Final Rejection | NICHIA CORPORATION |
| 17948510 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17946062 | ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE | Non-Final OA | Innolux Corporation |
| 17815297 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | InnoLux Corporation |
| 17957403 | HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES | Final Rejection | Intel Corporation |
| 17891654 | IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES | Final Rejection | Intel Corporation |
| 17871359 | MULTI-DIE PANEL-LEVEL HIGH PERFORMANCE COMPUTING COMPONENTS | Final Rejection | Intel Corporation |
| 17873521 | Semiconductor Package Interconnection Structure | Non-Final OA | Avago Technologies International Sales Pte. Limited |
| 18422055 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE | Non-Final OA | MEDIATEK INC. |
| 17854998 | ELECTROSTATIC DISCHARGE PROTECTION DEVICES WITH HIGH CURRENT CAPABILITY | Non-Final OA | Texas Instruments Incorporated |
| 17844920 | SPLIT SEMICONDUCTOR PACKAGE | Final Rejection | Texas Instruments Incorporated |
| 17873170 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17892344 | SEMICONDUCTOR PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18242991 | MOLDED CORE SUBSTRATE FOR EMBEDDING COMPONENTS | Final Rejection | Advanced Micro Devices, Inc. |
| 18456906 | UNSINGULATED SEMICONDUCTOR PACKAGE | Final Rejection | Sandisk Technologies, Inc. |
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