Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2817
This examiner grants 85% of resolved cases
Thaddeus J Kolb is an examiner in Tech Center 2800 and Art Unit 2817. The examiner has 33 resolved cases. The allowance rate is 84.8%. This baseline rate indicates a favorable environment for applicants, with a high frequency of successful outcomes. The 33 resolved cases provide the foundation for the current performance metrics.
The median days to allowance is 1336. This 1336-day median reflects the typical duration of the prosecution process for cases that reach issuance. Practitioners should factor this timeframe into their planning when their cases are assigned to Art Unit 2817.
The interview lift is 21.7%. This lift shows that conducting an interview is associated with an increased probability of success over the 84.8% allowance rate. Direct engagement with the examiner appears to be an effective strategy for resolving outstanding issues and advancing cases toward a favorable conclusion.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17821920 | Warpage Compensation for BGA Package | Non-Final OA | Apple Inc. |
| 17948510 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17944854 | LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NICHIA CORPORATION |
| 17946062 | ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE | Non-Final OA | Innolux Corporation |
| 17932735 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | InnoLux Corporation |
| 17822589 | EMBEDDED TRACE SUBSTRATE (ETS) WITH EMBEDDED METAL TRACES HAVING MULTIPLE THICKNESS FOR INTEGRATED CIRCUIT (IC) PACKAGE HEIGHT CONTROL | Non-Final OA | QUALCOMM Incorporated |
| 17957403 | HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES | Final Rejection | Intel Corporation |
| 17891654 | IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES | Final Rejection | Intel Corporation |
| 17873521 | Semiconductor Package Interconnection Structure | Final Rejection | Avago Technologies International Sales Pte. Limited |
| 18422055 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE | Non-Final OA | MEDIATEK INC. |
| 17854998 | ELECTROSTATIC DISCHARGE PROTECTION DEVICES WITH HIGH CURRENT CAPABILITY | Non-Final OA | Texas Instruments Incorporated |
| 17844920 | SPLIT SEMICONDUCTOR PACKAGE | Final Rejection | Texas Instruments Incorporated |
| 18472862 | MEMORY DEVICE WITH TWISTED BIT LINES AND METHODS OF MANUFACTURING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18461538 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17897196 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17873170 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17813212 | MULTIPLE NON-ACTIVE DIES IN A MULTI-DIE PACKAGE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17809039 | SEMICONDUCTOR PACKAGE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18456906 | UNSINGULATED SEMICONDUCTOR PACKAGE | Non-Final OA | Sandisk Technologies, Inc. |
| 18396725 | IMAGE COMPENSATION DEVICE | Final Rejection | Industrial Technology Research Institute |
| 18462082 | IMAGE SENSOR PACKAGES AND RELATED METHODS | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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