Prosecution Insights
Last updated: August 17, 2026
Application No. 18/508,603

ELECTRICAL STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Final Rejection §112§DP
Filed
Nov 14, 2023
Priority
Aug 11, 2023 — divisional of 12/538,790
Examiner
GHEYAS, SYED I
Art Unit
2893
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
NANYA TECHNOLOGY Corporation
OA Round
2 (Final)
82%
Grant Probability
Favorable
3-4
OA Rounds
0m
Est. Remaining
86%
With Interview

Examiner Intelligence

Grants 82% — above average
82%
Career Allowance Rate
560 granted / 679 resolved
+14.5% vs TC avg
Minimal +4% lift
Without
With
+3.9%
Interview Lift
resolved cases with interview
Fast prosecutor
2y 0m
Avg Prosecution
42 currently pending
Career history
701
Total Applications
across all art units

Statute-Specific Performance

§101
0.5%
-39.5% vs TC avg
§103
55.5%
+15.5% vs TC avg
§102
27.0%
-13.0% vs TC avg
§112
11.6%
-28.4% vs TC avg
Black line = Tech Center average estimate • Based on career data from 679 resolved cases

Office Action

§112 §DP
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claims 1-9 were rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor, or for pre-AIA the applicant regards as the invention. Claim 1 recites, inter alia, “ a first insulation layer disposed over the first surface of the substrate, and defining a first through hole extending through the first insulation layer, wherein the first through hole has a first width; a second insulation layer disposed on the first insulation layer and defining a second through hole extending through the second insulation layer, wherein the second through hole has a second width, and a difference between the first width and the second width is less than one tenth of the first width; and an electrical contact disposed in the first through hole and the second through hole, and electrically connected to the first surface of the substrate; wherein the recess portion has a third width less than the first width, and the third width is less than the second width”. It seems that the first through hole, the second through hole and the third through hole all have varying widths at different depths (Figs. 1-9). It is not clear which width the Applicant is referring to, i.e., at what depth of each hole and the recess the widths are measured. Some of the limitations of claim 1 may not be even true if the widths are measured at arbitrary depths. Appropriate correction/clarification is requested. Claims 2-9 inherit the 35 U.S.C. 112(b) or 35 U.S.C. 112, 2nd paragraph (pre-AIA ) rejections based on their dependencies on claim 1. Double Patenting The nonstatutory double patenting rejection is based on a judicially created doctrine grounded in public policy (a policy reflected in the statute) so as to prevent the unjustified or improper timewise extension of the “right to exclude” granted by a patent and to prevent possible harassment by multiple assignees. A nonstatutory double patenting rejection is appropriate where the claims at issue are not identical, but at least one examined application claim is not patentably distinct from the reference claim(s) because the examined application claim is either anticipated by, or would have been obvious over, the reference claim(s). See, e.g., In re Berg, 140 F.3d 1428, 46 USPQ2d 1226 (Fed. Cir. 1998); In re Goodman, 11 F.3d 1046, 29 USPQ2d 2010 (Fed. Cir. 1993); In re Longi, 759 F.2d 887, 225 USPQ 645 (Fed. Cir. 1985); In re Van Ornum, 686 F.2d 937, 214 USPQ 761 (CCPA 1982); In re Vogel, 422 F.2d 438, 164 USPQ 619 (CCPA 1970); and In re Thorington, 418 F.2d 528, 163 USPQ 644 (CCPA 1969). A timely filed terminal disclaimer in compliance with 37 CFR 1.321(c) or 1.321(d) may be used to overcome an actual or provisional rejection based on a nonstatutory double patenting ground provided the reference application or patent either is shown to be commonly owned with this application, or claims an invention made as a result of activities undertaken within the scope of a joint research agreement. A terminal disclaimer must be signed in compliance with 37 CFR 1.321(b). The USPTO internet Web site contains terminal disclaimer forms which may be used. Please visit http://www.uspto.gov/forms/. The filing date of the application will determine what form should be used. A web-based e-Terminal Disclaimer may be filled out completely online using web-screens. An e-Terminal Disclaimer that meets all requirements is auto-processed and approved immediately upon submission. For more information about e-Terminal Disclaimers, refer to http://www.uspto.gov/patents/process/file/efs/guidance/eTD-info-I.jsp. Claims 1-9 are rejected on the ground of nonstatutory double patenting as being unpatentable over claims 1-14 of Patent No. US 12,538,790 B2. Although the claims at issue are not identical, they are not patentably distinct from each other. Regarding Claim 1, Patent No.: US 12,538,790 B2 discloses an electrical structure, comprising: a substrate having a recess portion recessed from a first surface of the substrate (claims 1 & 10); a first insulation layer disposed over the first surface of the substrate, and defining a first through hole extending through the first insulation layer, wherein the first through hole has a first width (claims 1 & 10); a second insulation layer disposed on the first insulation layer and defining a second through hole extending through the second insulation layer, wherein the second through hole has a second width, and a difference between the first width and the second width is less than one tenth of the first width (claims 1 & 10); and an electrical contact disposed in the first through hole and the second through hole, and electrically connected to the first surface of the substrate claims 1 & 10); wherein the recess portion has a third width less than the first width, and the third width is less than the second width (claims 1 & 10). Regarding Claim 2, Patent No.: US 12,538,790 B2, as applied to claim 1, discloses the electrical structure, wherein the first through hole is communicated with the second through hole claims 1 & 10). Regarding Claim 3, Patent No.: US 12,538,790 B2, as applied to claim 1, discloses the electrical structure, wherein the electrical contact is a monolithic structure hole (claims 2 & 12). Regarding Claim 4, Patent No.: US 12,538,790 B2, as applied to claim 1, discloses the electrical structure, further comprising a first metal- oxide-semiconductor (MOS) transistor and a second MOS transistor disposed on the substrate, wherein the electrical contact is disposed between the first MOS transistor and the second MOS transistor (claims 4 & 13). Regarding Claim 5, Patent No.: US 12,538,790 B2, as applied to claim 4, discloses the electrical structure, wherein the electrical contact electrically connects an electrode of the first MOS transistor and/or the second MOS transistor (claims 5 & 14). Regarding Claim 6, Patent No.: US 12,538,790 B2, as applied to claim 1, discloses the electrical structure, wherein a material of the second insulation layer is different from a material of the first insulation layer (claims 1 & 10). Regarding Claim 7, Patent No.: US 12,538,790 B2, as applied to claim 1, discloses the electrical structure, wherein the substrate defines a recess portion in communication with the first through hole, and the electrical contact is further disposed in the recess portion (claims 1 & 10). Regarding Claim 8, Patent No.: US 12,538,790 B2, as applied to claim 7, discloses the electrical structure, wherein the substrate includes a low resistance layer disposed on a bottom wall of the recess portion (claim 8). Regarding Claim 9, Patent No.: US 12,538,790 B2, as applied to claim 8, discloses the electrical structure, wherein the substrate includes silicon, and the low resistance layer includes cobalt disilicide (CoSi2) (claim 3 together with claim 9). Conclusion THIS ACTION IS MADE FINAL. Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any extension fee pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to SYED I GHEYAS whose telephone number is (571)272-0592. The examiner can normally be reached on Monday-Friday from 8:30 AM - 5:30 PM EST. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Britt Hanley, can be reached at telephone number (571)270-3042. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://portal.uspto.gov/external/portal. Should you have questions about access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. 07/19/2026 /SYED I GHEYAS/Primary Examiner, Art Unit 2893
Read full office action

Prosecution Timeline

Nov 14, 2023
Application Filed
May 20, 2026
Non-Final Rejection mailed — §112, §DP
Jun 10, 2026
Response Filed
Jul 22, 2026
Final Rejection mailed — §112, §DP (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
82%
Grant Probability
86%
With Interview (+3.9%)
2y 0m (~0m remaining)
Median Time to Grant
Moderate
PTA Risk
Based on 679 resolved cases by this examiner. Grant probability derived from career allowance rate.

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