Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2821 2858 2893
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18670378 | SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18638939 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18444592 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME, AND ELECTRONIC SYSTEM | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18379027 | LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | LG DISPLAY CO., LTD. |
| 18677307 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18676363 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18425992 | LIGHT EMITTING DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18455666 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18450636 | PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDITIONAL METAL PAD LAYER TO FACILITATE REDUCED VIA SIZE FOR REDUCED BUMP PITCH, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS | Non-Final OA | QUALCOMM Incorporated |
| 18128733 | DEVICE UNDER TEST (DUT) STRUCTURES IN FILL REGIONS OF PRODUCT DIE FOR VOLTAGE CONTRAST (VC) DEFECT DETECTION FOR IMPROVED YIELD LEARNING | Non-Final OA | Intel Corporation |
| 18326628 | BURIED CHANNEL SEMICONDUCTOR DEVICE INCLUDING ENERGY BARRIER MODULATION REGION(S) | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18418812 | METHODS OF FORMING INTERCONNECT STRUCTURES | Final Rejection | Applied Materials, Inc. |
| 18494401 | ISOLATION OF P-GAN HEMT BY USE OF GATE RING | Final Rejection | STMicroelectronics International N.V. |
| 18616108 | PERIODIC FILTERS FOR QUANTUM COMMUNICATION LINKS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18765069 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18508603 | ELECTRICAL STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 18476281 | MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE | Final Rejection | VIA Technologies, Inc. |
| 18762663 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP |
| 18225706 | SEMICONDUCTOR DEVICE | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18767418 | LATERAL BIPOLAR TRANSISTORS | Non-Final OA | GLOBALFOUNDRIES U.S. Inc. |
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