Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2821 2893
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18378874 | SEMICONDUCTOR DEVICE INCLUDING BLOCKING LAYER AND SOURCE/DRAIN STRUCTURE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18326628 | BURIED CHANNEL SEMICONDUCTOR DEVICE INCLUDING ENERGY BARRIER MODULATION REGION(S) | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18453932 | SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18476211 | DISPLAY DEVICE INCLUDING A DISPLAY SUBSTRATE AND A POLARIZATION LAYER | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18455666 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 15882966 | SYSTEMS AND METHODS FOR FLEXIBLE COMPONENTS FOR POWERED CARDS AND DEVICES | Final Rejection | Dynamics Inc. |
| 18494401 | ISOLATION OF P-GAN HEMT BY USE OF GATE RING | Non-Final OA | STMicroelectronics International N.V. |
| 18476281 | MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE | Non-Final OA | VIA Technologies, Inc. |
| 18333632 | Low Contact Resistance in Semiconductor Devices with Implanted Regions | Final Rejection | Wolfspeed, Inc. |
| 18304869 | Power Semiconductor Devices Including Beryllium Metallization | Final Rejection | Wolfspeed, Inc. |
| 18467481 | MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONSTITUTED WAFER | Non-Final OA | ADEIA SEMICONDUCTOR TECHNOLOGIES LLC |
| 18550343 | QUANTUM COMPONENT | Non-Final OA | C12 Quantum Electronics |
| 18152251 | High Voltage MOSFET Device | Non-Final OA | NuVolta Technologies (Hefei) Co., Ltd. |
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