Prosecution Insights
Last updated: April 19, 2026
Application No. 18/574,188

TRANSISTOR

Non-Final OA §102
Filed
Dec 26, 2023
Examiner
TRAN, TRANG Q
Art Unit
2811
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Semiconductor Energy Laboratory Co. Ltd.
OA Round
1 (Non-Final)
81%
Grant Probability
Favorable
1-2
OA Rounds
2y 10m
To Grant
88%
With Interview

Examiner Intelligence

Grants 81% — above average
81%
Career Allow Rate
579 granted / 716 resolved
+12.9% vs TC avg
Moderate +7% lift
Without
With
+7.4%
Interview Lift
resolved cases with interview
Typical timeline
2y 10m
Avg Prosecution
34 currently pending
Career history
750
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
45.3%
+5.3% vs TC avg
§102
36.1%
-3.9% vs TC avg
§112
17.3%
-22.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 716 resolved cases

Office Action

§102
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Priority Receipt is acknowledged of papers submitted under 35 U.S.C. 119(a)-(d), which papers have been placed of record in the file. Information Disclosure Statement The information disclosure statement (IDS) submitted on 04/26/2024. The submission is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1-13 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Yamazaki et al. (US 2017/0033111). As for claim 1, Yamazaki et al. disclose in Fig.1a-1b or 14a-14b and the related text a transistor comprising: a first gate electrode 102a; a first insulator 105/103 over the first gate electrode; a second insulator 103/104 over the first insulator; a third insulator (middle portion of 106a), a fourth insulator (left portion of 106a), and a fifth insulator (right portion of 106a) over the second insulator; an oxide semiconductor 106b over the third insulator, the fourth insulator, and the fifth insulator; a first conductor 108a and a second conductor 108b over the oxide semiconductor; a sixth insulator (lower portion of 117) over the first conductor and the second conductor and the third conductor; a seventh insulator (upper portion of 117) over the sixth insulator; and a second gate electrode 114a embedded in an opening of the sixth insulator and an opening of the seventh insulator (Fig. 1A-1B) wherein the sixth insulator (lower portion of 117) is in (thermally/electrically) contact with a top surface of the first insulator, a side surface of the oxide semiconductor, a side surface and a top surface of the first conductor, and a side surface and a top surface of the second conductor (Fig. 1B), wherein the second gate electrode 114a overlaps with the third insulator is positioned to overlap with a first region of the oxide semiconductor therebetween (Fig. 1B), wherein the second conductor 108a overlaps with the fourth insulator with a second region of the oxide semiconductor therebetween (Fig. 1B) wherein the second conductor 108b overlaps with the fifth insulator with a third region of the oxide semiconductor therebetween (Fig. 1B), and wherein a top surface of the third insulator (middle portion of 106a) is level or substantially level with a top surface of the fourth insulator (left portion of 106a), and a top surface of the fifth insulator (right portion of 106a) (Fig. 1B). As for claim 2, Yamazaki et al. disclose the transistor according to claim 1, further comprising: an eighth insulator 106ca over the oxide semiconductor; a ninth insulator 112a over the eighth insulator; and a tenth insulator 116 over the seventh insulator, the eighth insulator, the ninth insulator and the second gate electrode (Fig. 1B), wherein in a cross section in a channel width direction of the transistor, the eighth insulator is in (thermally/electrically) contact with the each of the third insulator, the oxide semiconductor, and the seventh insulator (Fig. 1B), wherein a thickness of the eighth insulator 106ca is smaller than a thickness of the ninth insulator 112a (Fig. 1B), and wherein a top surface of the second gate electrode 114a is level or substantially level with a top surface of the seventh insulator (Fig. 1B). As for claim 3, Yamazaki et al. disclose the transistor according to claim 2, wherein the top surface of the second gate electrode 114A is level or substantially level with an uppermost portion of the eighth insulator 106ca and an uppermost portion of the ninth insulator 112a (Fig. 1B). As for claim 4, Yamazaki et al. disclose the transistor according to claim 2, wherein the eighth insulator comprises aluminum and oxygen [0143], and the thickness of the eighth insulator is greater than or equal to 1.0 nm and less than or equal to 3.0 nm [0155]. As for claim 5, Yamazaki et al. disclose the transistor according to claim 1, wherein each of the first insulator 103 [0187] and the sixth insulator (lower portion of 117a) comprises silicon and nitrogen [0205], wherein the second insulator 104 comprises aluminum and oxygen [0189], and wherein each of the third insulator and the seventh insulator (upper portion of 117a) comprises silicon and oxygen [0205]. As for claim 6, Yamazaki et al. disclose the transistor according to claim 2, further comprising: an eleventh insulator 116 over the tenth insulator (Fig. 14B), wherein the eleventh insulator is in (thermally/electrically) contact with the top surface of the first insulator, a side surface of the sixth insulator, a side surface of the seventh insulator, and a side surface and a top surface of the tenth insulator (Fig. 14B), and wherein the eleventh insulator comprises silicon and nitrogen [0211]. As for claim 7, Yamazaki et al. disclose in Fig. 14a-14b and the related text a transistor comprising: a first insulator 103; a second insulator 104 over the first insulator; a third insulator (middle portion of 106a), a fourth insulator (left portion of 106a), and a fifth insulator (right portion of 106a) over the second insulator; an oxide semiconductor 106b over the third insulator, the fourth insulator, and the fifth insulator; a first conductor 108a and a second conductor 108b over the oxide semiconductor; a sixth insulator (lower portion of 117a) over the first conductor and the second conductor (Fig. 14B); a seventh insulator (upper portion of 117a) over the sixth insulator (Fig. 14B); an eighth insulator 106ca/112a over the oxide semiconductor (Fig. 14B); a gate electrode 114a embedded in an opening of the sixth insulator and an opening of the seventh insulator (Fig. 14B); and a ninth insulator 117b over the seventh insulator, the eighth insulator, and the gate electrode (Fig. 14B), wherein the sixth insulator (lower portion of 117a) is in (thermally/electrically) contact with a top surface of the first insulator, a side surface of the oxide semiconductor, a side surface and a top surface of the first conductor, and a side surface and a top surface of the second conductor (Fig. 14B), wherein the gate electrode 114a overlaps with the third insulator with a first region of the oxide semiconductor therebetween (Fig. 14B), wherein the first conductor 108a overlaps with the fourth insulator with a second region of the oxide semiconductor therebetween (Fig. 14B), wherein the second conductor 108b overlaps with the fifth insulator with a third region of the oxide semiconductor therebetween (Fig. 14B), wherein in a cross section in a channel width direction of the transistor, the eighth insulator 106ca/112a is in (thermally/electrically) contact with each of the third insulator, the oxide semiconductor, and the seventh insulator (Fig. 14B), and wherein a top surface of the third insulator (middle portion of 106a) is level or substantially level with a top surface of the fourth insulator (left portion of 106a), and a top surface of the fifth insulator (right portion of 106a). As for claim 8, Yamazaki et al. disclose the transistor according to claim 7, wherein a top surface of the gate electrode 114a is level or substantially level with a top surface of the seventh insulator (Fig. 14B). As for claim 9, Yamazaki et al. disclose the transistor according to claim 8, wherein the top surface of the gate electrode 114a is level or substantially level with an uppermost portion of the eighth insulator (Fig. 14B). As for claim 10, Yamazaki et al. disclose the transistor according to claim 7, wherein each of the first insulator 103 [0187] and the sixth insulator (lower portion of 117a) comprises silicon and nitrogen [0205], wherein the second insulator 104 comprises aluminum and oxygen [0189], and wherein each of the third insulator and the seventh insulator (upper portion of 117a) and the eighth insulator 112a comprises silicon and oxygen [0205]. As for claim 11, Yamazaki et al. disclose the transistor according to claim 7, further comprising: a tenth insulator 116 over the ninth insulator, wherein the tenth insulator is in (thermally/electrically) contact with the top surface of the first insulator, the side surface of the sixth insulator, the side surface of the seventh insulator, and a side surface, and a top surface of the ninth insulator (Fig. 14B), and wherein the tenth insulator 116 comprises silicon and nitrogen [0211]. As for claim 12, Yamazaki et al. disclose the transistor according to claim 7, wherein each of the oxide semiconductor, the fourth insulator, and the fifth insulator comprises indium, gallium, zinc, and oxygen [0159], and wherein an atomic ratio of gallium to indium in the fourth insulator is higher than an atomic ratio of gallium to indium in the oxide semiconductor [0159]. As for claim 13, Yamazaki et al. disclose the transistor according to claim 7, wherein the oxide semiconductor comprises a region with a hydrogen concentration lower than 1 X 10¹⁹ atoms/cm³ when the oxide semiconductor is measured by secondary ion mass spectrometry [0159]. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to TRANG Q TRAN whose telephone number is (571)270-3259. The examiner can normally be reached Monday-Thursday (9am-4pm). Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Lynne Gurley can be reached at 5712721670. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /TRANG Q TRAN/Primary Examiner, Art Unit 2811
Read full office action

Prosecution Timeline

Dec 26, 2023
Application Filed
Feb 18, 2026
Non-Final Rejection — §102 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
81%
Grant Probability
88%
With Interview (+7.4%)
2y 10m
Median Time to Grant
Low
PTA Risk
Based on 716 resolved cases by this examiner. Grant probability derived from career allow rate.

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