Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811
This examiner grants 81% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18497672 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18222567 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18208979 | SEMICONDUCTOR MEMORY DEVICE, METHOD FOR MANUFACTURING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18574188 | TRANSISTOR | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18020758 | SEMICONDUCTOR DEVICE | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18242322 | PACKAGE WITH EMBEDDED CAPACITORS | Non-Final OA | Intel Corporation |
| 17481234 | MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE | Non-Final OA | Intel Corporation |
| 17940933 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Kioxia Corporation |
| 18498031 | DUMMY DIES AND METHOD OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18336435 | PACKAGE STRUCTURE WITH DUMMY DIE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18150539 | STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18339840 | METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A DAM | Non-Final OA | SK hynix Inc. |
| 17533395 | MAGNETORESISTIVE DEVICES AND METHODS OF FABRICATING SUCH DEVICES | Non-Final OA | Everspin Technologies, Inc. |
| 18334695 | Integrated Circuit Package and Methods of Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18152502 | INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18151856 | Die Structures and Methods of Forming the Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18570100 | QUANTUM DOT LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | Non-Final OA | TCL Technology Group Corporation |
| 18569635 | SUPER JUNCTION DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Shanghai Huahong Grace Semiconductor Manufacturing Corporation |
| 18202310 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | nD-HI Technologies Lab,Inc. |
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