Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2811
This examiner grants 81% of resolved cases
Trang Q Tran serves in Tech Center 2800 and Art Unit 2800, with a record of 738 resolved cases. The allowance rate stands at 81.3 percent, indicating the frequency of successful outcomes. These 738 resolved cases offer a data set for understanding the examiner's approach. This volume of cases forms the basis for the current metrics.
The interview lift is 7.3 percent, which highlights the impact of oral advocacy during prosecution. A median days to allowance of 984 provides a benchmark for the speed of the process. Within Art Unit 2800, these statistics reflect the examiner's typical workflow and decision-making timeline.
For practitioners, the 7.3 percent interview lift is a relevant metric when considering a request for a personal discussion. The 81.3 percent allowance rate and the 984 median days to allowance are factors for setting realistic goals. Data from Tech Center 2800 suggests a predictable environment for patent applications.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18740045 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18437473 | STACKED INTEGRATED CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18497672 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18222567 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18208979 | SEMICONDUCTOR MEMORY DEVICE, METHOD FOR MANUFACTURING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18021197 | ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUS | Final Rejection | BOE TECHNOLOGY GROUP CO., LTD. |
| 18408087 | DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18415679 | ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 18242322 | PACKAGE WITH EMBEDDED CAPACITORS | Final Rejection | Intel Corporation |
| 17825340 | INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING INTEGRATED CIRCUIT DEVICES THEREIN | Final Rejection | Intel Corporation |
| 17481234 | MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE | Final Rejection | Intel Corporation |
| 18020758 | SEMICONDUCTOR DEVICE | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 17899909 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE | Non-Final OA | Kioxia Corporation |
| 17899260 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Non-Final OA | KIOXIA CORPORATION |
| 18429228 | LASER ANNEAL FORMED NANOSHEET LDMOS TRANSISTOR | Non-Final OA | Texas Instruments Incorporated |
| 18428306 | SPLIT-GATE TRENCH POWER MOSFET WITH THICK POLY-TO-POLY ISOLATION | Non-Final OA | STMicroelectronics International N.V. |
| 18593444 | SEMICONDUCTOR DEVICES WITH EPITAXIAL SOURCE/DRAIN REGION WITH A BOTTOM DIELECTRIC AND METHODS OF FABRICATION THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18415668 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18405146 | SEMICONDUCTOR DEVICES WITH EPITAXIAL SOURCE/DRAIN REGION WITH A BOTTOM DIELECTRIC AND METHODS OF FABRICATION THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18498031 | DUMMY DIES AND METHOD OF FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18788697 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18786482 | PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18428315 | SEMICONDUCTOR DEVICE AND METHOD | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18334695 | Integrated Circuit Package and Methods of Forming the Same | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18151856 | Die Structures and Methods of Forming the Same | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18431001 | OLED STRUCTURE AND PROCESS BASED ON PIXEL PASSIVATION BY REMOVING OLED STACK OVER HEAT ABSORBENT STRUCTURES | Non-Final OA | Applied Materials, Inc. |
| 18408016 | TRANSFERRABLE POLYCHROMIC microLEDs | Non-Final OA | Lumileds LLC |
| 18582677 | MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | MACRONIX International Co., Ltd. |
| 18132602 | HIGH-DENSITY-INTERCONNECTION PACKAGING STRUCTURE AND METHOD FOR PREPARING SAME | Non-Final OA | SJ Semiconductor(Jiangyin) Corporation |
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