Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2811
This examiner grants 81% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18222567 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18348233 | SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18048561 | SEMICONDUCTOR MEMORY DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18408087 | DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18415679 | ELECTRONIC DEVICE | Non-Final OA | InnoLux Corporation |
| 18242322 | PACKAGE WITH EMBEDDED CAPACITORS | Final Rejection | Intel Corporation |
| 17825340 | INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNING INTEGRATED CIRCUIT DEVICES THEREIN | Non-Final OA | Intel Corporation |
| 17481234 | MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE | Final Rejection | Intel Corporation |
| 18778988 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18593444 | SEMICONDUCTOR DEVICES WITH EPITAXIAL SOURCE/DRAIN REGION WITH A BOTTOM DIELECTRIC AND METHODS OF FABRICATION THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18415668 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18405146 | SEMICONDUCTOR DEVICES WITH EPITAXIAL SOURCE/DRAIN REGION WITH A BOTTOM DIELECTRIC AND METHODS OF FABRICATION THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18511279 | SEMICONDUCTOR STRUCTURE INCLUDING TRANSISTOR WITH DIFFERENT CHANNEL LENGTHS AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18336435 | PACKAGE STRUCTURE WITH DUMMY DIE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18150539 | STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17570710 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18151856 | Die Structures and Methods of Forming the Same | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18431001 | OLED STRUCTURE AND PROCESS BASED ON PIXEL PASSIVATION BY REMOVING OLED STACK OVER HEAT ABSORBENT STRUCTURES | Non-Final OA | Applied Materials, Inc. |
| 17940933 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Final Rejection | Kioxia Corporation |
| 17899909 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE | Final Rejection | Kioxia Corporation |
| 17899260 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Non-Final OA | KIOXIA CORPORATION |
| 18408016 | TRANSFERRABLE POLYCHROMIC microLEDs | Non-Final OA | Lumileds LLC |
| 18428306 | SPLIT-GATE TRENCH POWER MOSFET WITH THICK POLY-TO-POLY ISOLATION | Non-Final OA | STMicroelectronics International N.V. |
| 18582677 | MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | MACRONIX International Co., Ltd. |
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