Prosecution Insights
Last updated: July 17, 2026
Application No. 18/584,062

BOND PAD FOR REDUCED CONTACT RESISTANCE

Non-Final OA
Filed
Feb 22, 2024
Priority
Sep 08, 2023 — provisional 63/581,331
Examiner
TYNES JR., LAWRENCE C
Art Unit
2899
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Taiwan Semiconductor Manufacturing Company, Ltd.
OA Round
1 (Non-Final)
85%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
94%
With Interview

Examiner Intelligence

Grants 85% — above average
85%
Career Allowance Rate
666 granted / 781 resolved
+17.3% vs TC avg
Moderate +9% lift
Without
With
+8.9%
Interview Lift
resolved cases with interview
Typical timeline
2y 4m
Avg Prosecution
25 currently pending
Career history
811
Total Applications
across all art units

Statute-Specific Performance

§101
0.4%
-39.6% vs TC avg
§103
65.5%
+25.5% vs TC avg
§102
7.6%
-32.4% vs TC avg
§112
23.2%
-16.8% vs TC avg
Black line = Tech Center average estimate • Based on career data from 781 resolved cases

Prosecution Timeline

Feb 22, 2024
Application Filed
May 20, 2026
Non-Final Rejection mailed (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12685235
FINE PITCH CHIP INTERCONNECT STRUCTURE FOR BUMP BRIDGE AND HIGH TEMPERATURE STORAGE IMPROVEMENT AND METHODS FOR FORMING THE SAME
4y 3m to grant Granted Jul 14, 2026
Patent 12684786
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
3y 4m to grant Granted Jul 14, 2026
Patent 12677684
SEMICONDUCTOR PACKAGE
3y 2m to grant Granted Jul 07, 2026
Patent 12677582
METHOD FOR MANUFACTURING ORGANIC SEMICONDUCTOR ELEMENT
2y 8m to grant Granted Jul 07, 2026
Patent 12672559
LOW INSERTION LOSS COAXIAL THROUGH-HOLE FOR HIGHSPEED INPUT-OUPUT
4y 0m to grant Granted Jun 30, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
85%
Grant Probability
94%
With Interview (+8.9%)
2y 4m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 781 resolved cases by this examiner. Grant probability derived from career allowance rate.

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