Prosecution Insights
Last updated: August 06, 2026
Application No. 18/603,375

METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF

Non-Final OA §112
Filed
Mar 13, 2024
Priority
Mar 14, 2023 — CN 2023102473687
Examiner
JAHAN, BILKIS
Art Unit
2817
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
OA Round
1 (Non-Final)
88%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
99%
With Interview

Examiner Intelligence

Grants 88% — above average
88%
Career Allowance Rate
811 granted / 916 resolved
+20.5% vs TC avg
Moderate +10% lift
Without
With
+10.3%
Interview Lift
resolved cases with interview
Typical timeline
2y 4m
Avg Prosecution
23 currently pending
Career history
951
Total Applications
across all art units

Statute-Specific Performance

§101
0.5%
-39.5% vs TC avg
§103
54.0%
+14.0% vs TC avg
§102
23.8%
-16.2% vs TC avg
§112
13.8%
-26.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 916 resolved cases

Office Action

§112
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Attorney Docket Number: S32124VN02 Filling Date: 03/13/24 Priority Date: 03/14/23 Inventor: Chen et al Examiner: Bilkis Jahan Election/Restrictions Applicant’s election without traverse of Group I, claims 8-11 in the reply filed on 06/29/26 is acknowledged. Claims 1-7 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected method, there being no allowable generic or linking claim. Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claims 8-10 and 11 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as failing to set forth the subject matter which the inventor or a joint inventor, or for applications subject to pre-AIA 35 U.S.C. 112, the applicant regards as the invention. Claim 8 recites specifies "a first groove is formed thereon," and "metal thickness of the first groove". However, it is not understood from the claimed language where does the metal thickness of the first groove comes from. This is not definite language. Claim 8 also recites a "first wiring layer" formed on the first surface. It then recites a "window formed on the dielectric layer to expose the back side of the chip." It is not understood from the claim language that how a window on a dielectric layer (on the second surface) exposes the back side of a chip with a patterned side facing the first surface. Claims 9-11 are dependent from claim 8. Therefore, claims 9-11 are also rejected under 112 2nd rejection. Remark Claims 8-11 need to search again after 112 2nd paragraph is overcome. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to BILKIS JAHAN whose telephone number is (571)270-5022. The examiner can normally be reached Monday-Friday, 8:00 am-5 Pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Marlon T Fletcher can be reached at (571)272-2063. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. BILKIS . JAHAN Primary Examiner Art Unit 2817 /BILKIS JAHAN/Primary Examiner, Art Unit 2817
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Prosecution Timeline

Mar 13, 2024
Application Filed
Jul 15, 2026
Non-Final Rejection mailed — §112 (current)

Precedent Cases

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
88%
Grant Probability
99%
With Interview (+10.3%)
2y 4m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 916 resolved cases by this examiner. Grant probability derived from career allowance rate.

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