Prosecution Insights
Last updated: October 02, 2026

ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.

Technology area: Semiconductors, Circuits & Optics

7 pending office actions • 5 art units • 7 examiners • 0 of 7 (0%) have an AI response strategy ready • 17 patents granted in the last 365 days

Analysis

ZHUHAI ACCESS SEMICONDUCTOR CO., LTD. shows a robust prosecution profile with 7 pending office actions in the Semiconductors, Circuits & Optics technology area. These actions are distributed among 7 distinct examiners, indicating a broad range of individual reviews for the company's semiconductor innovations. Despite the high number of examiners, the portfolio is concentrated within 5 distinct art units. This suggests that while the technical focus is relatively narrow, the patent office has assigned multiple examiners to handle the volume of filings within those specific units.

The workload is highly fragmented across the examining corps. ROBERTSON, NOAH CHRISTOPHER is the busiest examiner for the company, yet they are only managing 1 pending office action. This distribution means that each of the 7 pending office actions is being handled by a different individual. The ratio of 7 distinct examiners to 5 distinct art units indicates a diverse examination environment. This diversity in examination may lead to varying perspectives on the patentability of the company's circuits and optics technologies, requiring a flexible approach to prosecution across the different examiners.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Portfolio Summary

7
Total Pending OAs
4
Non-Final OAs
3
Final Rejections
0
Advisory / Quayle

Response Deadline Pressure

Based on the USPTO statutory response window for each pending office action. 1 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.

1
Overdue
0
Due this week
0
Due this month
0
Due in next 60 days
0
Due later

Case Difficulty Mix

Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.

2
Hard (29%)
4
Medium (57%)
1
Easy (14%)
0
Unknown (0%)

Rejection Statute Mix

BucketCases
§103 only4 (57%)
§112 only1 (14%)
Multi-statute (no §101)2 (29%)

Industry Mix

How the docket's pending cases split across USPTO tech-center bands.

0
Life Sciences
0% of docket
0
Information Tech
0% of docket
0
Communications
0% of docket
5
Semiconductors
71% of docket
1
Mechanical / Eng
14% of docket
1
Business / Other
14% of docket

Time-on-OA Estimate

Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.

70 h
Manual time on pending OAs
14 h
Time saved (low, 20%)
24 h
Time saved (mid, 35%)
0.6 wks
FTE-weeks freed (mid)

Top Examiners on this docket

ExaminerApps on this docketAllow rateInterview lift
ROBERTSON, NOAH CHRISTOPHER 1 — —
JAHAN, BILKIS 1 88.7% +10.2%
WARD, ERIC A 1 78.1% +13.3%
MARIN, JACOB RAUL 1 100.0% +0.0%
WALJESKI-MOSES, KATRINA MARIE HESTER 1 100.0% +0.0%
CHEN, YU 1 67.9% +29.6%
KIM, PAUL D 1 87.7% +6.7%

Quick Wins (3)

Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 3 ordered by deadline are shown.

App #TitleExaminerDue in
18377399 COMPONENT PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF MARIN, JACOB RAUL 4d overdue
18603375 METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF JAHAN, BILKIS —
18453185 METHOD FOR MANUFACTURING HIGH-HEAT-DISSIPATION MIXED SUBSTRATE, AND SEMICONDUCTOR STRUCTURE KIM, PAUL D —

Hard Cases (2)

Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 2 ordered by deadline are shown.

App #TitleExaminerDue in
18377379 PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR WALJESKI-MOSES, KATRINA MARIE HESTER —
18465889 SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR CHEN, YU —

Interview Candidates (3)

Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 3 ordered by deadline are shown.

App #TitleExaminerDue in
18603375 METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF JAHAN, BILKIS —
18603347 ORGANIC INTERPOSER STRUCTURE, MANUFACTURING METHOD AND PACKAGE STRUCTURE THEREOF WARD, ERIC A —
18465889 SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR CHEN, YU —

Top Art Units

Art UnitApps
2818 2
2817 1
2891 1
2896 1
3729 1

Pending Office Actions

App #TitleExaminerArt UnitStatutesStatusDue inAIFiled
18623193 EMBEDDED MAGNETIC DEVICE INTEGRATED STRUCTURE AND MANUFACTURING METHOD THEREOF ROBERTSON, NOAH CHRISTOPHER — §103 Non-Final OA — Pending Apr 01, 2024
18603375 METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF JAHAN, BILKIS 2817 §112 Non-Final OA — Pending Mar 13, 2024
18603347 ORGANIC INTERPOSER STRUCTURE, MANUFACTURING METHOD AND PACKAGE STRUCTURE THEREOF WARD, ERIC A 2891 §103 Non-Final OA — Pending Mar 13, 2024
18377399 COMPONENT PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF MARIN, JACOB RAUL 2818 §103 Final Rejection 4d overdue Pending Oct 06, 2023
18377379 PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR WALJESKI-MOSES, KATRINA MARIE HESTER 2818 §103§112 Final Rejection — Pending Oct 06, 2023
18465889 SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR CHEN, YU 2896 §102§103 Final Rejection — Pending Sep 12, 2023
18453185 METHOD FOR MANUFACTURING HIGH-HEAT-DISSIPATION MIXED SUBSTRATE, AND SEMICONDUCTOR STRUCTURE KIM, PAUL D 3729 §103 Non-Final OA — Pending Aug 21, 2023

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