Technology area: Semiconductors, Circuits & Optics
7 pending office actions • 5 art units • 7 examiners • 0 of 7 (0%) have an AI response strategy ready • 17 patents granted in the last 365 days
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD. shows a robust prosecution profile with 7 pending office actions in the Semiconductors, Circuits & Optics technology area. These actions are distributed among 7 distinct examiners, indicating a broad range of individual reviews for the company's semiconductor innovations. Despite the high number of examiners, the portfolio is concentrated within 5 distinct art units. This suggests that while the technical focus is relatively narrow, the patent office has assigned multiple examiners to handle the volume of filings within those specific units.
The workload is highly fragmented across the examining corps. ROBERTSON, NOAH CHRISTOPHER is the busiest examiner for the company, yet they are only managing 1 pending office action. This distribution means that each of the 7 pending office actions is being handled by a different individual. The ratio of 7 distinct examiners to 5 distinct art units indicates a diverse examination environment. This diversity in examination may lead to varying perspectives on the patentability of the company's circuits and optics technologies, requiring a flexible approach to prosecution across the different examiners.
Based on the USPTO statutory response window for each pending office action. 1 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 4 (57%) |
| §112 only | 1 (14%) |
| Multi-statute (no §101) | 2 (29%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| ROBERTSON, NOAH CHRISTOPHER | 1 | — | — |
| JAHAN, BILKIS | 1 | 88.7% | +10.2% |
| WARD, ERIC A | 1 | 78.1% | +13.3% |
| MARIN, JACOB RAUL | 1 | 100.0% | +0.0% |
| WALJESKI-MOSES, KATRINA MARIE HESTER | 1 | 100.0% | +0.0% |
| CHEN, YU | 1 | 67.9% | +29.6% |
| KIM, PAUL D | 1 | 87.7% | +6.7% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18377399 | COMPONENT PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF | MARIN, JACOB RAUL | 4d overdue |
| 18603375 | METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF | JAHAN, BILKIS | — |
| 18453185 | METHOD FOR MANUFACTURING HIGH-HEAT-DISSIPATION MIXED SUBSTRATE, AND SEMICONDUCTOR STRUCTURE | KIM, PAUL D | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18377379 | PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR | WALJESKI-MOSES, KATRINA MARIE HESTER | — |
| 18465889 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR | CHEN, YU | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 3 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18603375 | METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF | JAHAN, BILKIS | — |
| 18603347 | ORGANIC INTERPOSER STRUCTURE, MANUFACTURING METHOD AND PACKAGE STRUCTURE THEREOF | WARD, ERIC A | — |
| 18465889 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR | CHEN, YU | — |
| Art Unit | Apps |
|---|---|
| 2818 | 2 |
| 2817 | 1 |
| 2891 | 1 |
| 2896 | 1 |
| 3729 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18623193 | EMBEDDED MAGNETIC DEVICE INTEGRATED STRUCTURE AND MANUFACTURING METHOD THEREOF | ROBERTSON, NOAH CHRISTOPHER | — | §103 | Non-Final OA | — | Pending | Apr 01, 2024 |
| 18603375 | METAL FRAME CHIP EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF | JAHAN, BILKIS | 2817 | §112 | Non-Final OA | — | Pending | Mar 13, 2024 |
| 18603347 | ORGANIC INTERPOSER STRUCTURE, MANUFACTURING METHOD AND PACKAGE STRUCTURE THEREOF | WARD, ERIC A | 2891 | §103 | Non-Final OA | — | Pending | Mar 13, 2024 |
| 18377399 | COMPONENT PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF | MARIN, JACOB RAUL | 2818 | §103 | Final Rejection | 4d overdue | Pending | Oct 06, 2023 |
| 18377379 | PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR | WALJESKI-MOSES, KATRINA MARIE HESTER | 2818 | §103§112 | Final Rejection | — | Pending | Oct 06, 2023 |
| 18465889 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR | CHEN, YU | 2896 | §102§103 | Final Rejection | — | Pending | Sep 12, 2023 |
| 18453185 | METHOD FOR MANUFACTURING HIGH-HEAT-DISSIPATION MIXED SUBSTRATE, AND SEMICONDUCTOR STRUCTURE | KIM, PAUL D | 3729 | §103 | Non-Final OA | — | Pending | Aug 21, 2023 |
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