Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2814 2816 2817 2872 2896
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18753427 | SEMICONDUCTOR DEVICE INCLUDING FORKSHEET TRANSISTORS WITH ISOLATION WALL AND GATE CUT STRUCTURE THEREON | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18369527 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18180758 | Display Systems with Light-Emitting Diodes | Non-Final OA | Apple Inc. |
| 18644792 | ENCAPSULATION LAYER, DISPLAY PANEL HAVING THE SAME AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18470344 | PACKAGE COMPRISING A BRIDGE LOCATED BETWEEN METALLIZATION PORTIONS | Non-Final OA | QUALCOMM Incorporated |
| 17856206 | SOURCE AND DRAIN REFRACTORY METAL CAP | Non-Final OA | Intel Corporation |
| 18833507 | SEMICONDUCTOR DEVICE | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18428603 | SEMICONDUCTOR DEVICE AND METHODS OF FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18523286 | INTERCONNECTION STRUCTURE HAVING AIR GAP | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18442747 | SELECTIVE FORMATION OF ETCH STOP LAYERS AND THE STRUCTURES THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18327390 | SEMICONDUCTOR PACKAGE | Final Rejection | Infineon Technologies Austria AG |
| 18415231 | SUBSTRATELESS CHIP SCALE OPTICAL SENSOR PACKAGE | Non-Final OA | STMicroelectronics International N.V. |
| 18193595 | FORKSHEET DEVICE WITH ACCURATE GATE EXTENSION FOR REDUCED PARASITIC CAPACITANCE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18603349 | Photosynapse Devices and Related Photonic Integrated Circuits (PICs) | Non-Final OA | The Government of the United States of America, as represented by the Secretary of the Navy |
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