Prosecution Insights
Last updated: August 18, 2026
Application No. 18/612,425

SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM

Non-Final OA §102§112
Filed
Mar 21, 2024
Priority
Sep 24, 2021 — continuation of PCTJP2021035191 +1 more
Examiner
MCDONALD, RODNEY GLENN
Art Unit
Tech Center
Assignee
Kokusai Electric Corporation
OA Round
1 (Non-Final)
63%
Grant Probability
Moderate
1-2
OA Rounds
11m
Est. Remaining
88%
With Interview

Examiner Intelligence

Grants 63% of resolved cases
63%
Career Allowance Rate
804 granted / 1269 resolved
+3.4% vs TC avg
Strong +24% interview lift
Without
With
+24.4%
Interview Lift
resolved cases with interview
Typical timeline
3y 4m
Avg Prosecution
46 currently pending
Career history
1309
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
56.1%
+16.1% vs TC avg
§102
16.5%
-23.5% vs TC avg
§112
17.6%
-22.4% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1269 resolved cases

Office Action

§102 §112
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claim 17 is rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention. Claim 17, line 2, the phrase “a semiconductor device comprising.” Is unclear. What is it comprising? Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1 is rejected under 35 U.S.C. 102(a)(1) as being anticipated by Wengert et al. (U.S. Pat. 6,093,252). Regarding claim 1, Wengert et al. teach a substrate processing device comprising a substrate holding tool (susceptor 84) that holds a substrate; a reaction chamber (chamber 10) that accommodates the holding tool therein; a heating unit (lamps 146) the is disposed around the periphery of the reaction chamber; an exhaust unit (outlet component 100 provided with an exhaust conduit 114) configured so as to be able to accommodate a first temperature measurement unit (thermocouple 102) that is disposed on the lateral side of the reaction chamber in a direction parallel to the surface of the substrate held by the substrate holding tool; and a processing gas inlet 98. (Fig. 8; Column 10 lines 46-67; Column 11 lines 1-67) Claim(s) 1-18 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Okajima et al. (WO 2021/176505 A1 - U.S. PGPUB. 2022/0356580 A1 for translational purposes). INDEPENDENT CLAIM 1: Regarding claim 1, Okajima et al. teach a substrate processing apparatus comprising: a reaction chamber (130) that accommodates a substrate (101) held by a substrate holder (140); a heater (110) disposed around the reaction chamber (130; and an exhauster disposed laterally to the reaction chamber and configured to accommodate a first temperature measurer disposed extending in a direction parallel to a surface of the substrate held by the substrate holder from an outside of the reaction chamber toward an inside of the reaction chamber. (Fig. 15; space lateral to the reaction chamber 130 including the exhaust port 121) (Paragraphs 0133-0170) PNG media_image1.png 594 842 media_image1.png Greyscale In comparison to Applicant’s invention: PNG media_image2.png 421 435 media_image2.png Greyscale PNG media_image3.png 204 688 media_image3.png Greyscale It appears that the exhauster is a lateral space connect to an exhaust which Okajima teaches as discussed above in the form of a lateral space connected to an exhaust 121. DEPENDENT CLAIM 2: Regarding claim 2, Okajima et al. teach wherein the first temperature measurer includes a tube incorporating a temperature sensor. (Paragraph 0058) DEPENDENT CLAIM 3: Regarding claim 3, Okajima et al. teach wherein the tube is disposed to be slidable back and forth with respect to the exhauster. (Fig. 15; Figs. 6, 7) DEPENDENT CLAIM 4: Regarding claim 4, Okajima et al. teach wherein the substrate holder is configured to hold a plurality of substrates. (Fig. 15) DEPENDENT CLAIM 5: Regarding claim 5, Okajima et al. teach wherein the first temperature measurer is positioned between the plurality of substrates held by the substrate holder. (Fig. 15) DEPENDENT CLAIM 6: Regarding claim 6, Okajima et al. teach wherein the heater includes a plurality of zone heaters corresponding to different positions in a height direction of the reaction chamber. (Paragraph 0028; Fig. 15) DEPENDENT CLAIM 7: Regarding claim 7, Okajima et al. teach wherein the first temperature measurer is disposed at a position corresponding to a height of each of the plurality of zone heaters. (Fig. 15) DEPENDENT CLAIM 10: Regarding claim 10, Okajima et al. teach wherein the first temperature measurer includes a plurality of tubes incorporating a plurality of temperature sensors, and the plurality of tubes is disposed at positions corresponding to respective heights of the plurality of zone heaters of the exhauster. (Paragraph 0058; Fig. 6; Fig. 15) DEPENDENT CLAIM 11: Regarding claim 11, Okajima et al. teach wherein the first temperature measurer simultaneously measures temperatures at a plurality of positions corresponding to the plurality of zone heaters by the plurality of temperature sensors incorporated in the tubes. (Paragraph 0063; Fig. 8) DEPENDENT CLAIM 12: Regarding claim 12, Okajima et al. teach comprising a controller, wherein the controller is configured to control the plurality of zone heaters on a basis of data of temperature distributions at a plurality of points at the positions corresponding to the plurality of zone heaters measured by the first temperature measurer. (Claims 8, 9, Paragraphs 0066-0075, 0093, 0098-0099, 0128-0129, 0133) DEPENDENT CLAIM 13: Regarding claim 13, Okajima et al. teach wherein the first temperature measurer is disposed at a position where temperature of the substrate is measured during processing of the substrates. (Fig. 15) DEPENDENT CLAIM 14: Regarding claim 14, Okajima et al. teach wherein the first temperature measurer is disposed between the substrate and the exhauster. (See Fig. 15) INDEPENDENT CLAIM 16: Regarding claim 16, Okajima et al. teach a method of processing a substrate comprising: accommodating a substrate holder in a reaction chamber; heating the reaction chamber; inserting a first temperature measurer, which is located in an exhauster laterally to the reaction chamber, into the reaction chamber, and measuring a temperature of a substrate held by the substrate holder by the first temperature measurer; adjusting a position of the first temperature measurer to a position near the substrate; supplying a gas into the reaction chamber; and heating and processing the substrate on a basis of the temperature of the substrate measured by the first temperature measurer. (Claims 8, 9, Paragraphs 0066-0075, 0093, 0098-0099, 0128-0165) DEPENDENT CLAIM 17: Regarding claim 17, Okajima et al. teach whereby the substrate comprises a semiconductor device comprising. (Paragraph 0002) INDEPENDENT CLAIM 18: Regarding claim 18, Okajima et al. teach a non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform: accommodating a substrate holder in a reaction chamber; heating the reaction chamber; inserting a first temperature measurer, which is located in an exhauster laterally to the reaction chamber, into the reaction chamber, and causing the first temperature measurer to measure a temperature of a substrate held by the substrate holder; adjusting a position of the first temperature measurer to a position near the substrate; supplying a gas into the reaction chamber; and heating and processing the substrate on a basis of a result of measuring the temperature of the substrate by the first temperature measurer. (Claims 8, 9, Paragraphs 0066-0075, 0093, 0098-0099, 0128-0129, 0133) Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to RODNEY GLENN MCDONALD whose telephone number is (571)272-1340. The examiner can normally be reached Hoteling: M-Th every Fri off. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, James Lin can be reached at 571-272-8902. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /RODNEY G MCDONALD/Primary Examiner, Art Unit 1794 RM July 22, 2026
Read full office action

Prosecution Timeline

Mar 21, 2024
Application Filed
Jul 27, 2026
Non-Final Rejection mailed — §102, §112 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
63%
Grant Probability
88%
With Interview (+24.4%)
3y 4m (~11m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1269 resolved cases by this examiner. Grant probability derived from career allowance rate.

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