DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claim(s) 1 and 6 is/are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Wang et al. (US 11,587,916, hereinafter, Wang.)
In regard to claim 1, in figs. 8-9, Wang discloses a package structure 1, comprising:
a first semiconductor die 150;
a second semiconductor die 150;
an insulating encapsulant 148 laterally encapsulating the first semiconductor die and the second semiconductor die;
a redistribution circuit structure 160 disposed on the first semiconductor die, the second die and the insulating encapsulant;
a first antenna 110 electrically connected to the first semiconductor die; and
a second antenna 110 electrically connected to the second semiconductor die.
Regarding claim 6, wherein the second antenna is stacked over the second semiconductor die. Fig. 8.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 8 and 13 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Ho et al. (US 2021/0013585, hereinafter, Ho.)
In regard to claim 8, in figs. 2-3, Ho discloses a package structure 2, comprising:
a semiconductor die 21 (para [00220]);
an insulating encapsulant 33 laterally encapsulating the semiconductor die;
a redistribution circuit structure disposed on the semiconductor die and the insulating encapsulant;
a first antenna 11 electrically connected to a first part of the semiconductor die (para [0030]);
a second antenna 11 electrically connected to a second part of the semiconductor die.
Regarding claim 13, wherein the second antenna is stacked over the semiconductor die. Fig. 2.
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claim(s) 15 and 20 is/are rejected under 35 U.S.C. 103 as being unpatentable over Ho and in view of Molzer et al. (US 2015/0084194, hereinafter, Molzer.)
In regard to claim 15, as mention above Ho discloses all of the claimed limitations (see claim 8), except a second redistribution circuit structure, wherein the at least one semiconductor die and the insulating encapsulant being between the first redistribution circuit structure and the second redistribution circuit structure.
Molzer, in fig. 12, discloses an analogous device 120 including semiconductor dies encapsulated in resin 123 a first redistribution circuit and a second redistribution circuit wherein the at least one semiconductor die and the insulating encapsulant being between the first redistribution circuit structure and the second redistribution circuit structure. The arrangement provides additional electrical connections to other devices in the package as well as external devices. This is common in the art.
Therefore, it would be obvious to one of ordinary skill in the art at the time of the application was filed to form an additional redistribution circuit as taught in order to take the advantage as mentioned.
Regarding claim 20, wherein the second antenna is stacked over the at least one semiconductor die. See Ho’s fig. 2.
Allowable Subject Matter
Claims 2=5, 7, and 9-12, 14, and 16-19 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to NATHAN W HA whose telephone number is (571)272-1707. The examiner can normally be reached M-T: 8:00AM-6:00PM.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, WAEL FAHMY can be reached at (571)-272-1705. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/NATHAN W HA/Primary Examiner, Art Unit 2814
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