Tech Center 2800 • Art Units: 2814
This examiner grants 91% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19321076 | METHODS OF MANUFACTURING 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH ELECTRONIC CIRCUIT UNITS | Non-Final OA | Monolithic 3D Inc. |
| 18616392 | ARRAY SUBSTRATE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18358970 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18303589 | SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18497043 | SEMICONDUCTOR PACKAGE STRUCTURE | Non-Final OA | MEDIATEK INC. |
| 18364964 | CMOS Fabrication Methods for Back-Gate Transistor | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17948750 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE | Final Rejection | LAPIS TECHNOLOGY CO., LTD. |
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