Prosecution Insights
Last updated: July 17, 2026
Application No. 18/641,927

Apparatus and Bonding Process for Wafer Bonding

Non-Final OA
Filed
Apr 22, 2024
Priority
Jan 29, 2024 — provisional 63/626,313
Examiner
JEAN BAPTISTE, WILNER
Art Unit
Tech Center
Assignee
Taiwan Semiconductor Manufacturing Company, Ltd.
OA Round
1 (Non-Final)
86%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
92%
With Interview

Examiner Intelligence

Grants 86% — above average
86%
Career Allowance Rate
941 granted / 1089 resolved
+26.4% vs TC avg
Moderate +5% lift
Without
With
+5.1%
Interview Lift
resolved cases with interview
Typical timeline
2y 3m
Avg Prosecution
20 currently pending
Career history
1116
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
80.8%
+40.8% vs TC avg
§102
12.2%
-27.8% vs TC avg
§112
4.0%
-36.0% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1089 resolved cases

Prosecution Timeline

Apr 22, 2024
Application Filed
Sep 15, 2025
Response after Non-Final Action
May 22, 2026
Non-Final Rejection mailed (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12677679
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
3y 2m to grant Granted Jul 07, 2026
Patent 12668728
ADHESIVE AGENT FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
3y 4m to grant Granted Jun 30, 2026
Patent 12672567
PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING THE SAME
3y 2m to grant Granted Jun 30, 2026
Patent 12672439
DISPLAY PANEL AND DISPLAY DEVICE
2y 6m to grant Granted Jun 30, 2026
Patent 12667006
INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME
3y 8m to grant Granted Jun 23, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.
Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

1-2
Expected OA Rounds
86%
Grant Probability
92%
With Interview (+5.1%)
2y 3m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1089 resolved cases by this examiner. Grant probability derived from career allowance rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month