DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 103
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claim(s) 1 – 5 is/are rejected under 35 U.S.C. 103 as being unpatentable over Kawaguchi et al. (US 20080107802 A1, “Kawaguchi”) in view of Nishida et al. (US 20090046183 A1, “Nishida”).
Regarding claim 1, Kawaguchi discloses (Fig. 1 – 4 and 9 – 12) a method for producing a multilayered wiring board, the method comprising: a step of heating and pressurizing a first wiring member having a first electrode portion on a surface thereof, a second wiring member having a second electrode portion on a surface thereof (See para [0215], [0230]), and a filmy adhesive (60) containing conductive particles (69) and a curable adhesive composition in a state where the first electrode portion and the second electrode portion are disposed to face each other with the filmy adhesive interposed therebetween, to electrically connect the first electrode portion and the second electrode portion (See para [0232] – [0233]),
Kawaguchi is silent on wherein when a thermal expansion coefficient and a glass transition temperature of the resin cured product are designated as
C
T
E
0
(
p
p
m
/
℃
)
and
T
g
0
(
℃
)
, respectively, the following conditions (A) and (B) are all satisfied: (A)
5
≤
C
T
E
0
≤
270
(B)
140
≤
T
g
0
≤
280
However, Nishida discloses wherein when a thermal expansion coefficient and a glass transition temperature of the resin cured product (7) are designated as
C
T
E
0
(
p
p
m
/
℃
)
and
T
g
0
(
℃
)
, respectively, the following conditions (A) and (B) are all satisfied: (A)
5
≤
C
T
E
0
≤
270
(B)
140
≤
T
g
0
≤
280
(See para [0051], [0053] and [0172])
Kawaguchi and Nishida are both considered to be analogous to the claimed invention because they are in the same field of wiring board. Therefore, it would have been obvious to someone of ordinary skill in the art before the effective filing date of the claimed invention to have modified Kawaguchi to incorporate the teachings of Nishida and provide wherein when a thermal expansion coefficient and a glass transition temperature of the resin cured product (7) are designated as
C
T
E
0
(
p
p
m
/
℃
)
and
T
g
0
(
℃
)
, respectively, the following conditions (A) and (B) are all satisfied: (A)
5
≤
C
T
E
0
≤
270
(B)
140
≤
T
g
0
≤
280
(See para [0051], [0053] and [0172]). Doing so would reduce the thermal stress between the wiring members (para [0051]) and also create a proper temperature cycle (para [0053])
Regarding claim 2, Kawaguchi discloses (Fig. 1 – 4 and 9 – 12) a curable adhesive composition used for bonding a wiring member constituting a multilayered wiring board (See para [0124], [0135] – [0136]),
Kawaguchi is silent on wherein when a thermal expansion coefficient and a glass transition temperature of the resin cured product are designated as
C
T
E
0
(
p
p
m
/
℃
)
and
T
g
0
(
℃
)
, respectively, the following conditions (A) and (B) are all satisfied: (A)
5
≤
C
T
E
0
≤
270
(B)
140
≤
T
g
0
≤
280
However, Nishida discloses wherein when a thermal expansion coefficient and a glass transition temperature of the resin cured product (7) are designated as
C
T
E
0
(
p
p
m
/
℃
)
and
T
g
0
(
℃
)
, respectively, the following conditions (A) and (B) are all satisfied: (A)
5
≤
C
T
E
0
≤
270
(B)
140
≤
T
g
0
≤
280
(See para [0051], [0053] and [0172])
Kawaguchi and Nishida are both considered to be analogous to the claimed invention because they are in the same field of wiring board. Therefore, it would have been obvious to someone of ordinary skill in the art before the effective filing date of the claimed invention to have modified Kawaguchi to incorporate the teachings of Nishida and provide wherein when a thermal expansion coefficient and a glass transition temperature of the resin cured product (7) are designated as
C
T
E
0
(
p
p
m
/
℃
)
and
T
g
0
(
℃
)
, respectively, the following conditions (A) and (B) are all satisfied: (A)
5
≤
C
T
E
0
≤
270
(B)
140
≤
T
g
0
≤
280
(See para [0051], [0053] and [0172]). Doing so would reduce the thermal stress between the wiring members (para [0051]) and also create a proper temperature cycle (para [0053])
Regarding claim 3, Kawaguchi discloses a filmy adhesive (26) comprising the curable adhesive composition (See para [0125] – [0126]) according to claim 2 (discloses by Kawaguchi in view of Nishida) and conductive particles (See para [0135]).
Regarding claim 4, Kawaguchi discloses (Fig. 1 – 4 and 9 – 12) a multilayered wiring board comprising: a first wiring member having a first electrode portion (20); a second wiring member having a second electrode portion (40); and a connection portion containing conductive particles electrically connecting the first electrode portion and the second electrode portion and a resin cured product bonding the first wiring member and the second wiring member (See para [0109] and [0110]), the connection portion being provided between the first wiring member and the second wiring member (See annotated figure below),
PNG
media_image1.png
464
1041
media_image1.png
Greyscale
Kawaguchi is silent on wherein when a thermal expansion coefficient and a glass transition temperature of the resin cured product are designated as
C
T
E
0
(
p
p
m
/
℃
)
and
T
g
0
(
℃
)
, respectively, the following conditions (A) and (B) are all satisfied: (A)
5
≤
C
T
E
0
≤
270
(B)
140
≤
T
g
0
≤
280
However, Nishida discloses wherein when a thermal expansion coefficient and a glass transition temperature of the resin cured product (7) are designated as
C
T
E
0
(
p
p
m
/
℃
)
and
T
g
0
(
℃
)
, respectively, the following conditions (A) and (B) are all satisfied: (A)
5
≤
C
T
E
0
≤
270
(B)
140
≤
T
g
0
≤
280
(See para [0051], [0053] and [0172])
Kawaguchi and Nishida are both considered to be analogous to the claimed invention because they are in the same field of wiring board. Therefore, it would have been obvious to someone of ordinary skill in the art before the effective filing date of the claimed invention to have modified Kawaguchi to incorporate the teachings of Nishida and provide wherein when a thermal expansion coefficient and a glass transition temperature of the resin cured product (7) are designated as
C
T
E
0
(
p
p
m
/
℃
)
and
T
g
0
(
℃
)
, respectively, the following conditions (A) and (B) are all satisfied: (A)
5
≤
C
T
E
0
≤
270
(B)
140
≤
T
g
0
≤
280
(See para [0051], [0053] and [0172]). Doing so would reduce the thermal stress between the wiring members (para [0051]) and also create a proper temperature cycle (para [0053])
Regarding claim 5, Kawaguchi in view of Nishida discloses an electronic component (See Kawaguchi para [0072], [0094]) comprising the multilayered wiring board according to claim 4.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to SIDI MOHAMED MAIGA whose telephone number is (703)756-1870. The examiner can normally be reached Monday - Friday 8 am 5 pm.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Timothy Thompson can be reached on 571-272-2342. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/SIDI M MAIGA/Examiner, Art Unit 2847
/TIMOTHY J THOMPSON/Supervisory Patent Examiner, Art Unit 2847