Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2847
This examiner grants 72% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18749535 | CONNECTOR AND WIRE HARNESS | Non-Final OA | YAZAKI CORPORATION |
| 18303648 | MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18683425 | CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING MULTILAYERED WIRING BOARD, AND MULTILAYERED WIRING BOARD | Non-Final OA | Resonac Corporation |
| 17457728 | Hybrid Dielectric Scheme in Packages | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18240574 | CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18524770 | METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING CIRCUIT SUBSTRATE, AND CIRCUIT SUBSTRATE | Non-Final OA | NGK INSULATORS, LTD. |
| 18407621 | CIRCUIT BOARD | Final Rejection | DONGWOO FINE-CHEM CO., LTD. |
| 18244182 | MULTILAYER WIRING BOARD | Non-Final OA | TOPPAN INC. |
| 18188622 | THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASITIC INDUCTANCE | Non-Final OA | Lumentum Operations LLC |
| 18234701 | INTEGRATED SUBSTRATE AND POWER INTEGRATED CIRCUIT | Final Rejection | Silergy Semiconductor Technology (Hangzhou) LTD |
| 18426547 | PRINTED WIRING BOARD | Final Rejection | IBIDEN CO., LTD. |
| 18561274 | OPTOELECTRONIC ASSEMBLY AND METHOD FOR THE PRODUCTION OF SAME | Non-Final OA | ams-OSRAM International GmbH |
| 18473657 | ELECTROCHROMIC VARIABLE-TRANSMITTANCE GLASS AND PREPARATION METHOD | Non-Final OA | Furcifer Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy