Prosecution Insights
Last updated: October 01, 2026

Examiner: MAIGA, SIDI MOHAMED

Tech Center 2800 • Art Units: 2834 2847 2898

This examiner grants 75% of resolved cases

Analysis

Sidi Mohamed Maiga is an examiner in Tech Center 2800, Art Unit 2834. The examiner has 47 resolved cases. The allowance rate is 74.5 percent, which suggests a favorable outlook for applicants. This 74.5 percent rate indicates that about three-quarters of the applications result in a patent grant.

The interview lift is 4.1 percent. This figure suggests that interviews have a relatively small impact on the final outcome, given the already high allowance rate. The median days to allowance is 975 days. This 975-day timeline represents the typical duration for successful applications to reach allowance in Art Unit 2834.

With 47 resolved cases, the 74.5 percent allowance rate is a key metric for practitioners. The 4.1 percent interview lift and 975 days median pendency are important for developing a prosecution strategy. These figures help applicants understand the probability of success and the expected timeline for their cases with this examiner.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

75.0%
Allow Rate
+7.0% vs TC avg
69
Total Applications
+4.0%
Interview Lift
973
Avg Prosecution Days
Based on 48 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
26.5%
§102 Novelty
68.3%
§103 Obviousness
4.8%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18175227 Optoelectronic Apparatus and Optoelectronic Integration Method Final Rejection Huawei Technologies Co., Ltd.
18402654 ELECTRONIC DEVICE Non-Final OA Innolux Corporation
18854987 ELECTRONIC DEVICE Non-Final OA Sony Interactive Entertainment Inc.
18941471 SUBSTRATE AND MODULE Non-Final OA Murata Manufacturing Co., Ltd.
18200224 PRINTED CIRCUIT BOARD Non-Final OA SAMSUNG ELECTRO-MECHANICS CO., LTD.
18203679 ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE STRUCTURES PASSING THERETHROUGH Non-Final OA Mellanox Technologies, Ltd.
18524770 METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING CIRCUIT SUBSTRATE, AND CIRCUIT SUBSTRATE Final Rejection NGK INSULATORS, LTD.
18987318 CONDUCTOR Non-Final OA Yazaki Corporation
18830630 MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE USING THE SAME Non-Final OA Absolics Inc.

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