Prosecution Insights
Last updated: April 19, 2026

Examiner: MAIGA, SIDI MOHAMED

Tech Center 2800 • Art Units: 2847

This examiner grants 76% of resolved cases

Performance Statistics

75.9%
Allow Rate
+7.9% vs TC avg
61
Total Applications
+9.4%
Interview Lift
972
Avg Prosecution Days
Based on 29 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
28.5%
§102 Novelty
64.2%
§103 Obviousness
6.6%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18175227 Optoelectronic Apparatus and Optoelectronic Integration Method Non-Final OA Huawei Technologies Co., Ltd.
18234701 INTEGRATED SUBSTRATE AND POWER INTEGRATED CIRCUIT Final Rejection Silergy Semiconductor Technology (Hangzhou) LTD
18406222 Electronic device and manufacturing method thereof Non-Final OA InnoLux Corporation
18749535 CONNECTOR AND WIRE HARNESS Non-Final OA YAZAKI CORPORATION
18303648 MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Final Rejection Murata Manufacturing Co., Ltd.
18683425 CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING MULTILAYERED WIRING BOARD, AND MULTILAYERED WIRING BOARD Non-Final OA Resonac Corporation
17457728 Hybrid Dielectric Scheme in Packages Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18399156 CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD Non-Final OA SAMSUNG ELECTRO-MECHANICS CO., LTD.
18240574 CIRCUIT BOARD Final Rejection SAMSUNG ELECTRO-MECHANICS CO., LTD.
18200224 PRINTED CIRCUIT BOARD Final Rejection SAMSUNG ELECTRO-MECHANICS CO., LTD.
18406608 PRESSURE SENSITIVE BUTTON AND ELECTRONIC DEVICE Non-Final OA VIVO MOBILE COMMUNICATION CO., LTD.
18520642 CIRCUIT BOARD FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE Final Rejection AGC Inc.
18243996 CONTROL BOARD, CONTROL APPARATUS AND METHOD FOR SECURITY ENHANCEMENT THEREOF Non-Final OA HL KLEMOVE CORP.
18524770 METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING CIRCUIT SUBSTRATE, AND CIRCUIT SUBSTRATE Non-Final OA NGK INSULATORS, LTD.
18407621 CIRCUIT BOARD Final Rejection DONGWOO FINE-CHEM CO., LTD.
18840310 CABLE SEALING ARRANGEMENT FOR AN ENCLOSURE Non-Final OA CommScope Technologies LLC
18188622 THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASITIC INDUCTANCE Non-Final OA Lumentum Operations LLC
18408617 WIRING SUBSTRATE Final Rejection IBIDEN CO., LTD.
18561274 OPTOELECTRONIC ASSEMBLY AND METHOD FOR THE PRODUCTION OF SAME Final Rejection ams-OSRAM International GmbH
18499188 CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT THERMAL EXPANSION COEFFICIENTS AND METHOD FOR PRODUCING THE SAME Final Rejection TONG HSING ELECTRONIC INDUSTRIES, LTD.
18473657 ELECTROCHROMIC VARIABLE-TRANSMITTANCE GLASS AND PREPARATION METHOD Non-Final OA Furcifer Inc.

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