Tech Center 2800 • Art Units: 2834 2847 2898
This examiner grants 75% of resolved cases
Sidi Mohamed Maiga is an examiner in Tech Center 2800, Art Unit 2834. The examiner has 47 resolved cases. The allowance rate is 74.5 percent, which suggests a favorable outlook for applicants. This 74.5 percent rate indicates that about three-quarters of the applications result in a patent grant.
The interview lift is 4.1 percent. This figure suggests that interviews have a relatively small impact on the final outcome, given the already high allowance rate. The median days to allowance is 975 days. This 975-day timeline represents the typical duration for successful applications to reach allowance in Art Unit 2834.
With 47 resolved cases, the 74.5 percent allowance rate is a key metric for practitioners. The 4.1 percent interview lift and 975 days median pendency are important for developing a prosecution strategy. These figures help applicants understand the probability of success and the expected timeline for their cases with this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18175227 | Optoelectronic Apparatus and Optoelectronic Integration Method | Final Rejection | Huawei Technologies Co., Ltd. |
| 18402654 | ELECTRONIC DEVICE | Non-Final OA | Innolux Corporation |
| 18854987 | ELECTRONIC DEVICE | Non-Final OA | Sony Interactive Entertainment Inc. |
| 18941471 | SUBSTRATE AND MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18200224 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18203679 | ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE STRUCTURES PASSING THERETHROUGH | Non-Final OA | Mellanox Technologies, Ltd. |
| 18524770 | METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING CIRCUIT SUBSTRATE, AND CIRCUIT SUBSTRATE | Final Rejection | NGK INSULATORS, LTD. |
| 18987318 | CONDUCTOR | Non-Final OA | Yazaki Corporation |
| 18830630 | MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE USING THE SAME | Non-Final OA | Absolics Inc. |
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