Detailed Action
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Priority
Receipt is acknowledged of certified copies of papers required by 37 CFR 1.55.
Information Disclosure Statement
The information disclosure statements (IDS) submitted on 03/05/2024, 01/21/2025, and 12/11/2025 are being considered by the examiner.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claim(s) 1,3,5, and 7-10 is/are rejected under 35 U.S.C. 102(a)(1) and (a)(2) as being anticipated by Okade (JP 2020086119A), as evidenced by a technical disclosure from Daicel Corp.
Regarding Claim 1,3,5, and 7-10, Okade discloses a photosensitive composition for use in the production of a printed wiring board and semiconductor package.
The composition of Okade is described from [0009]-[0100], wherein the composition comprises an ethylenically unsaturated polymerizable compound (A) that does not comprise an isocyanurate structure, an ethylenically unsaturated polymerizable compound (B) that comprises an isocyanurate structure, a photoinitiator (C), a thermosetting resin (D), an elastomer (E), and an inorganic filler (F).
The compound(s) (A) are discussed from [0016]-[0046] and may be, for example, a vinyl compound, a vinyl compound having an epoxy resin substituted thereupon, or a bifunctional or higher-functionality vinyl compound.
The compounds (B) are discussed from [0046]-[0049] and may include isocyanuric methacrylate compounds, such as ethylene oxide modified isocyanuric acid dimethacrylate, among other compounds.
The photoinitiator (C) is discussed from [0050]-[0052]. A photopolymerization aid (C’) may also be included.
The thermosetting resin (D) is discussed from [0054]-[0064], wherein the resin may be an epoxy resin such as a glycidyl ether resin, a bisphenol F epoxy resin, bisphenol A epoxy resin, or a novolac epoxy resin not based in a bisphenol compound such as a cresol, phenol, biphenyl, or other novolac epoxy resin.
The elastomer (E) is discussed from [0065]-[0082] and may be a silicone elastomer, an olefin elastomer, or other elastomer such as urethane.
The inorganic filler is discussed from [0082]-[0085], and may be particles of compounds such as silica, magnesium titanate, gallium oxide, or another compound described in the cited section.
Additional components, such as Thermal Polymerization Initiators (G), Pigments (H), Epoxy Curing agents (I), polymerization inhibitors, thickeners, antifoaming agents, and solvents are discussed from [0086]-[0100].
In the experimental examples described in Table 1 and [0127]-[0128], the following components are used therein:
Photopolymerizable unsaturated compounds (non-isocyanurate) (Claimed Component A)
“Acid-modified vinyl group-containing epoxy derivative 1” – as per Synthesis example 1 (bisphenol F novolac epoxy resin modified with acrylic acid)
“Acid-modified vinyl-group-containing epoxy derivative 2” – as per [0124] – a THPAC-modified cresol-novolak epoxy acrylate-epoxy resin
Photopolymerizable isocyanurate derivatives (B) (Claimed Component D)
Tris(2-acryloyloxyethyl) isocyanurate “FA-731A” (Examples 1,4,5)
Tris(2-acryloyloxyethyl) isocyanurate “A-9300” (Example 2)
Isocyanuric acid di-and-tri-acrylate, ethylene oxide modified :ARONIX M-315” (Examples 3 and 5)
Each of the compounds are present singly or together in an amount totaling 3.70 parts out of 100.29 parts - present in 3.69 wt% relative to the total solid content of the composition (claim 3)
Photopolymerization initiator (C) (Claimed compound (C))
(2-methyl-1-[4-(methylthio)phenyl] -2-morpholino-1-propanone, " IRGACURE 907”
4-diethylthioxanthone
Thermosetting resins (D) (Claimed Component (B)
Biphenyl type epoxy resin YX-4000
Elastomer (E) (Claimed compound (H))
Epoxidized polybutadiene “PB-4700” from Daicel Corp
This compound is a liquid, see attachment from Daicel Corp
Polyester resin “Espel 1108” from Hitachi Corp
Inorganic filler (F) (Claimed compound E – Claim 5)
Silica particles (1.3 micron avg. size) “CRS-2101-41”
The compositions of Examples 1-5 were blended and kneaded to prepare compositions as per [0125], then applied to a polyethylene terephthalate film (support) (claim 7). After, a drying process was performed to prepare a photosensitive film, and a polypropylene protective film was applied to the surface of the photosensitive film opposite the support film.
Laminates were prepared using the surface of a copper foil substrate for a printed circuit board as per [0120], wherein the photosensitive film(s) was placed into contact with the copper foil and a lamination treatment conducted. After lamination, the carrier film of the laminate was removed, and an exposure was performed using a mercury lamp with a dot pattern. After pattern exposure, the composition was spray developed using sodium carbonate solution at 30 degrees Celsius (claims 8-10).
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
Claim(s) 2 and 4 are rejected under 35 U.S.C. 103 as being unpatentable over Okade (JP 2020086119A), as evidenced by a technical disclosure from Daicel Corp..
Regarding Claim 2, Okade disclsoses the limitations of the claims as discussed above regarding claim 1.
Okade does not explicitly disclose an experimental embodiment wherein the polymerizable compound having an isocyanuric skeleton is at least one of the group selected from isocyanuric acid di(meth)acrylate and the corresponding tri(meth)acrylate).
This limitation is met by the general disclosure of the reference.
Okade, when discussing the isocyanuric acid derivatives at [0047] and [0048], refers to methacrylate derivatives of isocyanuric acid compounds as well as acrylate derivatives of isocyanuric acid compounds. Particularly, isocyanuric acid di(meth)acrylate and isocyanuric acid tri(meth)acrylate compounds are discussed as preferable. Methacrylate and acrylate groups are substantially chemically similar - a person having ordinary skill in the art would expect substantially similar results/performance as part of this chemical similarity.
A person having ordinary skill in the art would have found it obvious to arrive at the claimed invention prior to the effective filing date/ in view of the generally disclosed compounds – the substitution of a methacrylate embodiment for an acrylate embodiment would result in an embodiment having substantially similar performance.
Regarding Claim 4, Okade disclsoses the limitations of the claims as discussed above regarding claim 1.
Okade does not explicitly disclose an experimental embodiment wherein the thermosetting resin (D) is a bisphenol A epoxy resin, bisphenol F epoxy resin, novolac-type epoxy resin, or an isocyanurate epoxy resin. Okade disclsoses as part of the experimental embodiments a biphenyl epoxy resin.
This limitation is met by the general disclosure of the reference.
When discussing thermosetting resins at [0056]-[0058], Okade discusses biphenyl epoxy resins as well as bisphenol-A and bisphenol-F-type epoxy resins, and novolac epoxy resins of multiple types. The reference considers these resins to be alternatives to one another – otherwise they would not be presented together. As such, these components are considered by the art to result in similar performance/results.
A person having ordinary skill in the art would have found it obvious to arrive at the claimed invention by substituting the biphenyl epoxy resin of the experimental examples out for at least one of the art-recognized alternative resins - such as a bisphenol A or bisphenol F epoxy resin – with the expectation that this substitution for the same purpose would not materially affect the performance of the composition due to the art’s recognition of the components as alternatives.
Claim 6 is rejected under 35 U.S.C. 103 as being unpatentable over Okade (JP 2020086119A), as evidenced by a technical disclosure from Daicel Corp. as applied to claim 1 above, and further in view of Komuro et al (US 20190031790 A1)
Regarding Claim 6, Okade disclsoses the limitations of the claim as discussed above regarding claim 1.
Okade however does not disclose an ion scavenger.
This limitation is met by Komuro.
Komuro disclsoses a photosensitive resin composition for use in a printed wiring board (Abstract). The composition comprises an acid-modified vinyl group-containing epoxy resin, a photopolymerization initiator, an ion scavenger, and a photopolymerizable compound.
The epoxy resin is discussed from [0043]-[0111] and comprises an epoxy resin that has been modified by reacting it with an acid group such as a vinyl-group bearing acid such as acrylate or an acrylate derivative.
The photopolymerization initiator is discussed from [0112]-[0115].
The ion scavenger is discussed from [0116]-[0124], wherein the scavenger may be one capable of capturing at least one of either cations or anions. When incorporated, the scavenger results in an improved reliability of the composition by increasing the corrosion resistance,
A person having ordinary skill in the art would have found it obvious to arrive at the claimed invention prior to the effective filing date by incorporating the ion scavenger of Komuro into the composition of Okade so as to arrive at a product having improved corrosion resistance.
Conclusion
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/A.P.T./Examiner, Art Unit 1737
/SALLY A MERKLING/SPE, Art Unit 1738
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