Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1737
This examiner grants 71% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18381335 | THINNER COMPOSITION AND METHOD OF TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE BY USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18185115 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Non-Final OA | FUJIFILM Corporation |
| 18413619 | HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18156380 | FLEXIBLE SUBSTRATE AND MANUFACTURING METHOD THEREOF | Final Rejection | E Ink Holdings Inc. |
| 18321897 | CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS | Final Rejection | Shin-Etsu Chemical Co., Ltd. |
| 18174732 | INDIUM BASED SOL-GEL OXIDE PRECURSOR FILMS AS EXTREME ULTRAVIOLET AND LOW-ENERGY ELECTRON BEAM RESISTS | Final Rejection | Board of Regents, The University of Texas System |
| 18539218 | THREE-DIMENSIONAL NANOLITHOGRAPHY SYSTEMS AND METHODS | Non-Final OA | Purdue Research Foundation |
| 18176900 | METHOD FOR PRODUCING WIRING CIRCUIT BOARD | Final Rejection | NITTO DENKO CORPORATION |
| 17783206 | METHOD FOR PRODUCING WIRING CIRCUIT BOARD | Final Rejection | NITTO DENKO CORPORATION |
| 18016093 | POLYCYCLIC POLYPHENOLIC RESIN, COMPOSITION, METHOD FOR PRODUCING POLYCYCLIC POLYPHENOLIC RESIN, COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, AND COMPOSITION FOR OPTICAL MEMBER FORMATION | Non-Final OA | Mitsubishi Gas Chemical Company, Inc. |
| 17633856 | COMPOUND, POLYMER, COMPOSITION, COMPOSITION FOR FILM FORMATION, PATTERN FORMATION METHOD, INSULATING FILM FORMATION METHOD, AND METHOD FOR PRODUCING COMPOUND, AS WELL AS METHOD FOR PRODUCING IODINE-CONTAINING VINYL POLYMER AND ACETYLATED DERIVATIVE THEREOF | Final Rejection | Mitsubishi Gas Chemical Company, Inc. |
| 18687180 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD | Non-Final OA | Resonac Corporation |
| 17922867 | PHOTOSENSITIVE FILM, PHOTOSENSITIVE ELEMENT, AND METHOD FOR PRODUCING LAMINATE | Final Rejection | Showa Denko Materials Co., Ltd. |
| 18297004 | PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT | Final Rejection | eChem Solutions Corp. |
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