Prosecution Insights
Last updated: October 02, 2026
Application No. 18/687,238

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYERED PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYERED PRINTED WIRING BOARD

Non-Final OA §102§103
Filed
Feb 27, 2024
Priority
Aug 30, 2021 — nonprovisional of PCTJP2021031678
Examiner
WALKE, AMANDA C
Art Unit
Tech Center
Assignee
RESONAC Corporation
OA Round
1 (Non-Final)
88%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
97%
With Interview

Examiner Intelligence

Grants 88% — above average
88%
Career Allowance Rate
1531 granted / 1731 resolved
+28.4% vs TC avg
Moderate +9% lift
Without
With
+8.6%
Interview Lift
resolved cases with interview
Typical timeline
2y 5m
Avg Prosecution
44 currently pending
Career history
1751
Total Applications
across all art units

Statute-Specific Performance

§101
1.7%
-38.3% vs TC avg
§103
51.8%
+11.8% vs TC avg
§102
22.3%
-17.7% vs TC avg
§112
14.2%
-25.8% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1731 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Objections Claim 10 is objected to because of the following informalities: The claim recites, “for photo via formation”. It appears the language should be clearer, as “for” is similar to “used for”, and language such as “capable of” since the claim is drawn to a composition not a method, and claim 10 is claiming a use. Appropriate correction is required. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1-3, 6-8, and 10-15 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Kaguchi et al (JP 2019-066511 and its machine translation). Kaguchi et al disclose a photosensitive resin composition comprising: Photopolymerizable compound having an ethylenically unsaturated group which is an acid-modified epoxy (meth)acrylate having a carboxyl group (instant (A)) A photopolymerization initiator (instant (D)) An epoxy resin Polyfunctional maleimide compound (instant (C)) A curing accelerator An organic peroxide (instant (E)) Regarding component (B), the reference includes a combination of compounds (A) in the inventive examples, one being the acid-modified epoxy, and A-2 is dipentaerythritol pentaacrylate, a polyfunctional (meth)acrylate having five (meth)acryloyl groups meeting the limitations of the instant component (B). Therefore, the composition of the reference teaches a composition comprising each of the claimed components and meets the limitations of the instant claims 1-3. The reference further includes in examples as (C), C-3 an epoxidized polybutadiene (PB3600), having both epoxy, butadiene, and vinyl groups (instant claims 1, 2, 6, and 7). Examples further include an inorganic filler (G), [0011], examples), meeting the limitations of the instant claim 8 for component (F). The composition is used in a photolithographic process (instant claim 10, 12; composition is capable for use in a via formation step, [0006], [0009], [0036]), preferably as an insulating film having a thickness of 1 to 100 microns ([0001], [0042], 25 microns in examples [0052]; instant claim 14), and examples use the composition in a method of forming a mutli-layered printed wiring board (instant claim 15; claims 14-16, [0035]-[0037]). With respect to instant claim 11, the instant specification teaches that the compound (C) as set forth by the instant specification ([0055]) allows for curing without generating a hydroxy group unlike an epoxy group which provides the dielectric dissipation factor as claimed, and given the bismaleimide compound preferred by the reference which uses BMI-4000 in examples ( 2,2-bis[4-(3-maleimidophenoxy)phenyl]propane), the reference material employs a compound taught by the instant specification for achieving the dielectric dissipation factor property, one of skill in the art would have expected the material of the reference to inherently possess the claimed property absent evidence to the contrary. Claim(s) 1-4, 8, and 10-15 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Nagoshi et al (JP2006-323089 and its machine translation). Nagoshi et al disclose a photosensitive resin composition comprising Bismaleimide (instant (C); instant claims 1-3) A polymer having two or more allyl groups (instant (C); instant claims 1, 2, and 4) An organic peroxide (instant (E)) A polyfunctional photopolymerizable ethylenically unsaturated (instant (B)) An initiator (instant (D)) An inorganic filler (instant (F); instant claim 8; reference claim 2) A photosensitive prepolymer having a carboxyl group having an acid value of 20 to 150 mg KOH/g encompassing acid value of the compound in the instant examples (acidic groups; instant (A); reference claim 4). The composition is preferably used as an insulating resin layer (instant claims 10, 11) in a printed wiring board (instant claims 14 and 15; [0002]). The thickness of the layer is preferably 5 to 100 microns, 30 in examples (instant claim 13; [0064], [0083]). With respect to instant claim 11, the instant specification teaches that the compound (C) as set forth by the instant specification ([0055]) allows for curing without generating a hydroxy group unlike an epoxy group which provides the dielectric dissipation factor as claimed, and given the bismaleimide compound preferred by the reference which uses BMI-4000 in examples ( 2,2-bis[4-(3-maleimidophenoxy)phenyl]propane, [0081]), the reference material employs a compound taught by the instant specification for achieving the dielectric dissipation factor property, one of skill in the art would have expected the material of the reference to inherently possess the claimed property absent evidence to the contrary. Claim Rejections - 35 USC § 103 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 4-6 and 9 is/are rejected under 35 U.S.C. 103 as being unpatentable over Kaguchi et al in view of Kumazawa et al (WO 2020/153246 and its English language equivalent 12,133,339 as a translation. Kaguchi et al has been disclosed above. The reference teaches that more than one initiator may be used in combination, and that the composition does not exclude modifications and additional additives. Kumazawa et al disclose a resin composition similar to that of the Kaguchi et al reference and further teach that known and suitable compounds for inclusion are ethylene glycol divinyl ether, divinylbenzene, trimethylallyl isocyanurate, and bisallylnadic imide, meeting the limitations of the instant claims 4-6, and teaching these compounds are interchangeable with other allyl compounds and suitable for use in combination with maleimides. The reference further teaches known thiol photoinitiators 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one (Omnirad 907), ana thiol coupling agents 3-mercaptopropyltrimethoxysilane and 3-mercaptopropyldimethoxymethylsilane are contemplated for use. Therefore, given the teachings of the references it would have been obvious to one of ordinary skill in the art prior to the effective filing date of the instant invention to prepare the material of Kagushi et al, choosing as the compound in combination with a maleimide or in the place of the allyl compound, those having multiple unsaturated groups as taught by Kumazawa et al, or choosing to include a thiol compound as an additional initiator or as a coupling agent as taught to be known by Kumazawa et al. Claim(s) 4-6 and 9 is/are rejected under 35 U.S.C. 103 as being unpatentable over Nagoshi et al in view of Kumazawa et al. Both references have been discussed above. Nagoshi et al disclose maleimide and allyl compunds, and teach that additional components and known additives may be included in the composition. Kumazawa et al disclose a resin composition similar to that of the Kaguchi et al reference and further teach that known and suitable compounds for inclusion are ethylene glycol divinyl ether, divinylbenzene, trimethylallyl isocyanurate, and bisallylnadic imide, meeting the limitations of the instant claims 4-6, and teaching these compounds are interchangeable with other allyl compounds and suitable for use in combination with maleimides. The reference further teaches known thiol photoinitiators 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one (Omnirad 907), ana thiol coupling agents 3-mercaptopropyltrimethoxysilane and 3-mercaptopropyldimethoxymethylsilane are contemplated for use. Therefore, given the teachings of the references it would have been obvious to one of ordinary skill in the art prior to the effective filing date of the instant invention to prepare the material of Nagoshi et al, choosing as the compound in combination with a maleimide or in the place of the allyl compound, those having multiple unsaturated groups as taught by Kumazawa et al, or choosing to include a thiol compound as an additional initiator or as a coupling agent as taught to be known by Kumazawa et al. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Additional references as cited by applicant and on the foreign search report, JP -66791, JP 2019-066510, WO 2007/117915, are cumulative to the rejections above. Tashiro et al (2008/0268374) and Kawai et al (JP 2018-207132) are cited for their teachings of similar materials and compounds falling within the scope of (C). Any inquiry concerning this communication or earlier communications from the examiner should be directed to AMANDA C WALKE whose telephone number is (571)272-1337. The examiner can normally be reached Monday to Thursday 5:30am to 4pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Niki Bakhtiari can be reached at 571-272-3433. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /AMANDA C. WALKE/ Primary Examiner, Art Unit 1722
Read full office action

Prosecution Timeline

Feb 27, 2024
Application Filed
Aug 10, 2026
Non-Final Rejection mailed — §102, §103 (current)

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Prosecution Projections

1-2
Expected OA Rounds
88%
Grant Probability
97%
With Interview (+8.6%)
2y 5m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1731 resolved cases by this examiner. Grant probability derived from career allowance rate.

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