Prosecution Insights
Last updated: August 17, 2026
Application No. 18/750,987

VENTING HOLE ON PASSIVATION LAYER ON TOP OF GAP-FILL

Non-Final OA §102§103
Filed
Jun 21, 2024
Priority
Jan 31, 2024 — provisional 63/627,593
Examiner
ZHU, SHENG-BAI
Art Unit
Tech Center
Assignee
Applied Materials Inc.
OA Round
1 (Non-Final)
62%
Grant Probability
Moderate
1-2
OA Rounds
7m
Est. Remaining
68%
With Interview

Examiner Intelligence

Grants 62% of resolved cases
62%
Career Allowance Rate
446 granted / 716 resolved
+2.3% vs TC avg
Moderate +6% lift
Without
With
+6.1%
Interview Lift
resolved cases with interview
Typical timeline
2y 9m
Avg Prosecution
63 currently pending
Career history
782
Total Applications
across all art units

Statute-Specific Performance

§101
0.3%
-39.7% vs TC avg
§103
69.2%
+29.2% vs TC avg
§102
22.7%
-17.3% vs TC avg
§112
7.0%
-33.0% vs TC avg
Black line = Tech Center average estimate • Based on career data from 716 resolved cases

Office Action

§102 §103
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Detailed Action Claim Rejections – 35 U.S.C. 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale or otherwise available to the public before the effective filing date of the claimed invention. (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AlA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. Claims 1, 9 and 15 rejected under 35 U.S.C. 102(a)(1) as being anticipated by Li (CN 117241622, machine-translation provided). Regarding Claim 1 FIG. 1 of Li discloses a sub-pixel, comprising: a substrate (10); overhang pixel isolation structures (PIS 41, directly under 43); overhang structures (40), the overhang structures including an extension disposed past a sidewall of the overhang structures; separation PIS (41, along the direction orthogonal to overhang PIS); a metal structure (21) disposed over the substrate; an inorganic layer (42) disposed over each overhang PIS and over each separation PIS [0034], the inorganic layer including a plurality of openings; organic light-emitting diode (OLED) material (22) disposed over the metal structure, wherein the OLED material is disposed between the inorganic layer under each extension of the overhang structures; and a cathode (23) disposed over the OLED material. Regarding Claim 9 FIG. 1 of Li discloses a sub-pixel, comprising overhang structures (PIS 41, directly under 43) disposed over a substrate (40) including an extension disposed past a sidewall of the overhang structures, a metal structure (21) disposed over the substrate, an inorganic layer(42) disposed under each extension of the overhang structures, the inorganic layer including a plurality of openings, the sub-pixel is made by a process comprising: depositing an organic light-emitting diode (OLED) material (22) over the substrate, the OLED is disposed over the metal structure, wherein the inorganic layer under each extension of the overhang structures is disposed between the OLED material; and depositing a cathode (23), wherein the cathode is disposed under each extension of the overhang structures Regarding Claim 15 FIG. 1 of Li discloses a sub-pixel, comprising: overhang structures (PIS 41, directly under 43) disposed over a substrate (40) including an extension disposed past a sidewall of the overhang structures, a metal structure (21) disposed over the substrate, an inorganic layer (42) disposed under each extension of the overhang structures, the inorganic layer including a plurality of openings, the sub-pixel is made by a process comprising: depositing an organic light-emitting diode (OLED) material (22) over the substrate, the OLED is disposed over the metal structure, wherein the inorganic layer under each extension of the overhang structures is disposed between the OLED material; and depositing a cathode (23), wherein the cathode is disposed under each extension of the overhang structures Claims 1-3, 5, 6, 8-15 and 20 rejected under 35 U.S.C. 102(a)(1) as being anticipated by Choung (U.S. Patent Pub. No. 2022/0344417) Regarding Claim 1 FIG. 1 of Choung discloses a sub-pixel, comprising: a substrate (102); overhang pixel isolation structures (PIS 126 in rows); overhang structures (110), the overhang structures including an extension disposed past a sidewall of the overhang structures; separation PIS (126 in columns); a metal structure (104) disposed over the substrate; an inorganic layer (130) disposed over each overhang PIS and over each separation PIS, the inorganic layer including a plurality of openings; organic light-emitting diode (OLED) material (112) disposed over the metal structure, wherein the OLED material is disposed under each extension of the overhang structures; and a cathode (114) disposed over the OLED material. Regarding Claim 2 FIG. 1 of Choung discloses adjacent overhang PIS have the metal structure disposed therebetween. Regarding Claim 3 FIG. 1 of Choung discloses adjacent separation PIS have the metal structure disposed therebetween. Regarding Claim 5 FIG. 1 of Choung discloses the overhang structures include a second structure (110C) disposed over a first structure (110A). Regarding Claim 6 FIG. 1 of Choung discloses an encapsulation layer (116) disposed over the cathode (114) and past an endpoint of the cathode. Regarding Claim 8 FIG. 1 of Choung discloses the plurality of openings extend through the inorganic layer to a top surface of the separation PIS or an upper surface of the overhang PIS. Regarding Claim 9 FIG. 1 of Choung discloses a sub-pixel, comprising: overhang structures (110) disposed over a substrate (102) including an extension disposed past a sidewall of the overhang structures, a metal structure (104) disposed over the substrate, an inorganic layer (130) disposed under each extension of the overhang structures, the inorganic layer including a plurality of openings, the sub-pixel is made by a process comprising: depositing an organic light-emitting diode (OLED) material (112) over the substrate, the OLED is disposed over the metal structure, wherein the inorganic layer under each extension of the overhang structures is disposed between the OLED material; and depositing a cathode (114), wherein the cathode is disposed under each extension of the overhang structures Regarding Claim 10 The limitation “the inorganic layer is deposited using evaporation deposition” is considered to be a process or functional limitation. Even though product-by-process claims are limited by and defined by the process, determination of patentability is based on the product itself. The patentability of a product does not depend on its method of production. If the product in the product-by-process claim is the same as or obvious from a product of the prior art, the claim is unpatentable even though the prior product was made by a different process.” In re Thorpe, 777 F.2d 695, 698, 227 USPQ 964, 966 (Fed. Cir. 1985), MPEP 2113. Regarding Claim 11 FIG. 1 of Choung discloses overhang pixel isolation structures (PIS 126) disposed under the overhang structures. Regarding Claim 12 FIG. 1 of Choung discloses adjacent overhang PIS have the metal structure disposed therebetween. Regarding Claim 13 FIG. 1 of Choung discloses adjacent separation PIS have the metal structure disposed therebetween. Regarding Claim 14 FIG. 1 of Choung discloses an encapsulation layer (120) disposed over the cathode (114) and past an endpoint of the cathode, wherein the encapsulation layer extends under at least a portion of the extensions of overhang structures, along the sidewall of the overhang structures, and contacts a bottom surface of the extensions of the overhang structures. Regarding Claim 15 FIG. 1 of Choung discloses a sub-pixel, comprising: overhang structures (110) disposed over a substrate (102) including an extension disposed past a sidewall of the overhang structures, a metal structure (104) disposed over the substrate, an inorganic layer (130) disposed under each extension of the overhang structures, the inorganic layer including a plurality of openings, the sub-pixel is made by a process comprising: depositing an organic light-emitting diode (OLED) material (112) over the substrate, the OLED is disposed over the metal structure, wherein the inorganic layer under each extension of the overhang structures is disposed between the OLED material; and depositing a cathode (114), wherein the cathode is disposed under each extension of the overhang structures Regarding Claim 16 FIG. 1 of Choung discloses depositing an encapsulation layer (116) over the cathode (114) and past an endpoint of the cathode, wherein the encapsulation layer extends under at least a portion of the extensions of overhang structures, along the sidewall of the overhang structures, and contacts a bottom surface of the extensions of the overhang structures. Regarding Claim 17 FIG. 1 of Choung discloses the plurality of openings extend through the inorganic layer to a top surface of the separation PIS or an upper surface of the overhang PIS. Regarding Claim 20 FIG. 1 of Choung discloses the plurality of openings extend through the inorganic layer to a top surface of the separation PIS or an upper surface of the overhang PIS. Claims 1, 9, 15 and 18 rejected under 35 U.S.C. 102(a)(1) as being anticipated by Fukuda (U.S. Patent Pub. No. 2023/0269971) Regarding Claim 1 FIG. 3 of Fukuda discloses a sub-pixel, comprising: a substrate (10); overhang pixel isolation structures (PIS 5 in rows); overhang structures (6) [0040], the overhang structures including an extension disposed past a sidewall of the overhang structures; separation PIS (5 in columns); a metal structure (LE) disposed over the substrate; an inorganic layer (SE) disposed over each overhang PIS and over each separation PIS, the inorganic layer including a plurality of openings; organic light-emitting diode (OLED) material (OR) disposed over the metal structure [0053], wherein the OLED material is disposed under each extension of the overhang structures; and a cathode (UE) [0052] disposed over the OLED material. Regarding Claim 9 FIG. 3 of Fukuda discloses a sub-pixel, comprising: overhang structures (6) disposed over a substrate (12) including an extension disposed past a sidewall of the overhang structures, a metal structure (LE) disposed over the substrate, an inorganic layer (SE) disposed under each extension of the overhang structures, the inorganic layer including a plurality of openings, the sub-pixel is made by a process comprising: depositing an organic light-emitting diode (OLED) material (OR) over the substrate, the OLED is disposed over the metal structure, wherein the inorganic layer under each extension of the overhang structures is disposed between the OLED material; and depositing a cathode (UE), wherein the cathode is disposed under each extension of the overhang structures Regarding Claim 15 FIG. 3 of Fukuda discloses a sub-pixel, comprising: overhang structures (6) disposed over a substrate (12) including an extension disposed past a sidewall of the overhang structures, a metal structure (LE) disposed over the substrate, an inorganic layer (SE) disposed under each extension of the overhang structures, the inorganic layer including a plurality of openings, the sub-pixel is made by a process comprising: depositing an organic light-emitting diode (OLED) material (OR) over the substrate, the OLED is disposed over the metal structure, wherein the inorganic layer under each extension of the overhang structures is disposed between the OLED material; and depositing a cathode (UE), wherein the cathode is disposed under each extension of the overhang structures Regarding Claim 18 FIG. 3 of Fukuda discloses portions of the inorganic layer are removed by an etching process [0080]. Claim Rejections – 35 U.S.C. 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention. Claims 4, 7 and 19 rejected under 35 U.S.C. 103 as being unpatentable over Choung, in view of Bo (CN 108232036, machine-translation provided). Regarding Claim 4 Choung discloses Claim 1, wherein the inorganic layer comprises a metal oxide [0028]. Choung is silent with respect to “the inorganic layer comprises aluminum oxide (Al.sub.2O.sub.3)”. FIG. 5 of Bo discloses a similar sub-pixel, wherein the inorganic layer comprises aluminum oxide (Al.sub.2O.sub.3) [0048]. It would have been obvious to one of ordinary skill in the art before the effective filing of the claimed invention to modify the device of Choung, as taught by Bo. The ordinary artisan would have been motivated to modify Choung in the above manner for purpose of improving the adhesion ([0048] of Bo). Regarding Claim 7 Choung discloses Claim 1. Choung is silent with respect to “the plurality of openings comprise about 20 percent of the inorganic layer”. FIG. 5 of Bo discloses a similar sub-pixel, comprising an inorganic layer (140) disposed over each overhang PIS and over each separation PIS, wherein the plurality of openings comprise about 20 percent of the inorganic layer. It would have been obvious to one of ordinary skill in the art before the effective filing of the claimed invention to modify the device of Choung, as taught by Bo. The ordinary artisan would have been motivated to modify Choung in the above manner for purpose of preventing oxygen and water from corroding the pixel body. ([0003] of Bo). Regarding Claim 19 Choung discloses Claim 15. Choung is silent with respect to “the inorganic layer comprises aluminum oxide (Al.sub.2O.sub.3)”. FIG. 5 of Bo discloses a similar sub-pixel, wherein the inorganic layer comprises aluminum oxide (Al.sub.2O.sub.3) [0048]. It would have been obvious to one of ordinary skill in the art before the effective filing of the claimed invention to modify the device of Choung, as taught by Bo. The ordinary artisan would have been motivated to modify Choung in the above manner for purpose of improving the adhesion ([0048] of Bo). Pertinent Art Lin (U.S. Patent Pub. No. 2022/0376204); Zhu (CN 117279430), CN 117529179, CN 116261925, JP 2023120847, JP 2005026103. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to SHENG-BAI ZHU whose telephone number is (571)270-3904. The examiner can normally be reached on 11am – 7pm EST. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Chad Dicke can be reached on (571)270-7996. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://pair-direct.uspto.gov. Should you have questions on access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative or access to the automated information system, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /SHENG-BAI ZHU/Primary Examiner, Art Unit 2897
Read full office action

Prosecution Timeline

Jun 21, 2024
Application Filed
Jul 22, 2026
Non-Final Rejection mailed — §102, §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
62%
Grant Probability
68%
With Interview (+6.1%)
2y 9m (~7m remaining)
Median Time to Grant
Low
PTA Risk
Based on 716 resolved cases by this examiner. Grant probability derived from career allowance rate.

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